IC manufacturers Onsemi

IC manufacturers (103)

Onsemi NXH010P120MNF1 | Demoboard SEC-DAB-25KW-SIC-PIM-GEVK

SiC Module - EliteSiC 2-PACK Half Bridge Topology, 1200 V, 10 mohm SiC M1 MOSFET

Overview

TopologyFull-Bridge Converter symmetrical isolated
Input voltage800 V
Output 11000 V / 25 A
IC revision1

Description

SEC-25KW-SIC-PIM-GEVK is a reference design kit for 25kW fast DC EV charger based on SiC power integrated module. This full SiC solution consists of PFC and DC-DC stages featuring multiple 1200V, 10 mohm half-bridge SiC modules NXH010P120MNF1, the ultralow RDS(ON) and minimized parasitic inductance can significantly reduce conduction loss and switching loss. Relying on the powerful Universal Controller Board (UCB) with Zynq®-7000 SoC FPGA and ARM®-based processor the system can deliver maximum 25kW over 200V-1000V output voltage with 96% all-time efficiency to charge 400V or 800V EV batteries. SEC-25KW-SIC-PIM-GEVK also highlights the galvanic-isolated high-current driver NCD57000, auxiliary power solution SECO-HVDCDC1362-40W-GEVB to power stable voltage rails to low-voltage components, integrated protections like inrush control, over voltage protection and multiple interfaces for communication.

Features

  • 10 m/1200V SiC MOSFET Half Bridge
  • Thermistor
  • Options With Pre−Applied Thermal Interface Material (TIM) and Without Pre−Applied TIM
  • Press−Fit Pins Typical Applications

Typical applications

  • Solar Inverter
  • Electric Vehicle Charging Stations
  • Uninterruptible Power Supplies, Industrial Power

Products

Order Code
Data­sheet
Simu­lation
Downloads
Status
Product series
λDom typ.(nm)
Emitting Color
λPeak typ.(nm)
λPeak V typ.(nm)
λPeak Y typ.(nm)
λDom V typ.(nm)
λDom Y typ.(nm)
IV typ.(mcd)
IV V typ.(mcd)
IV Y typ.(mcd)
VF typ.(V)
VF V typ.(V)
VF Y typ.(V)
Chip Technology
50% typ.(°)
Z @ 100 MHz(Ω)
RDC(Ω)
Operation Force(g)
Schematic
Packaging
C
Tol. C
Size
Qmin.
DF(%)
RISO
Ceramic Type
L(mm)
Fl(mm)
Q(%)
ISAT(A)
fres(MHz)
IRP,40K(A)
Version
VIN(V)
VOut1(V)
VOut2(V)
VOut3(V)
Vaux(V)
PO(W)
CWW 1(pF)
fswitch(kHz)
n
IC Reference
SW(mm)
To
dV/dt(V/µs)
DF @ 1 kHz(%)
IRIPPLE(mA)
Endurance(h)
Z(mΩ)
ILeak(µA)
Ø D(mm)
RESR(Ω)
Gender
Variant
Working Voltage(V (AC))
G(mm)
Polarity
Pin Plating
Contact Plating
Qty.(pcs)
W(mm)
H(mm)
IR(A)
Ti
Tl(mm)
Pins
Winding Style
Number of windings
L(µH)
Zmax(Ω)
IR(mA)
RDC max.(Ω)
VR(V)
Data rate
PoE
Ports
Tab
Improved CMRR
Operating Temperature
LED
PHY Chip Mode
Mount
Shield Tabs
PCB/Cable/Panel
Modularity
Type
Wire Section
Samples
WE-CBA SMT EMI Suppression Ferrite Bead, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Impedance @ 100 MHz1000 Ω
DC Resistance0.5 Ω
Size0603 
Length1.6 mm
Pad Dimension0.3 mm
VersionSMT 
Packaging Unit4000 pcs
Width0.8 mm
Height0.8 mm
Number of windings
Maximum Impedance1100 Ω
Rated Current800 mA
Operating Temperature -55 °C up to +125 °C
MountSMT 
TypeWide Band 
WE-SL2 SMT Common Mode Line Filter, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Length9.2 mm
VersionSMT 
Packaging Unit1000 pcs
Width6 mm
Height5 mm
Pins
Winding Stylebifilar 
Number of windings
Inductance2000 µH
Maximum Impedance9200 Ω
Rated Current600 mA
DC Resistance0.42 Ω
Rated Voltage80 V
Operating Temperature -40 °C up to +125 °C
MountSMT 
WE-TPC SMT Tiny Power Inductor, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Size4828 
Length4.8 mm
Saturation Current1.7 A
Self Resonant Frequency60 MHz
Packaging Unit500 pcs
Width4.8 mm
Height2.8 mm
Pins
Number of windings11.5 
Inductance4.7 µH
Rated Current1550 mA
DC Resistance0.07 Ω
Operating Temperature -40 °C up to +125 °C
MountSMT 
WE-TPC SMT Tiny Power Inductor, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Size4828 
Length4.8 mm
Saturation Current1.25 A
Self Resonant Frequency57 MHz
Packaging Unit500 pcs
Width4.8 mm
Height2.8 mm
Pins
Inductance6.8 µH
Rated Current1300 mA
DC Resistance0.09 Ω
Operating Temperature -40 °C up to +125 °C
MountSMT 
WE-TPC SMT Tiny Power Inductor, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Size4828 
Length4.8 mm
Saturation Current0.7 A
Self Resonant Frequency20 MHz
Packaging Unit500 pcs
Width4.8 mm
Height2.8 mm
Pins
Number of windings24.5 
Inductance22 µH
Rated Current925 mA
DC Resistance0.185 Ω
Operating Temperature -40 °C up to +125 °C
MountSMT 
WE-PD SMT Power Inductor, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Size6050 
Length5.9 mm
Saturation Current1.3 A
Self Resonant Frequency15 MHz
Performance Rated Current2.1 A
VersionRobust 
Packaging Unit1000 pcs
Width6.2 mm
Height5 mm
Pins
Number of windings26.5 
Inductance22 µH
DC Resistance0.115 Ω
Operating Temperature -40 °C up to +125 °C
MountSMT 
WE-RJ45 LAN Transformer, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Length21.25 mm
VersionTHT 
Turns Ratio1:1 
Contact Plating30µ" Gold over 50µ" Nickel 
Packaging Unit29 pcs
Width16 mm
Height13.5 mm
Inductance350 µH
Data rate1000BASE-T 
PoEnon-PoE 
Ports1x1 
Tab PositionDown 
Improved Common Mode RejectionNo 
Operating Temperature -40 °C up to +85 °C
LED (Left-Right)green/yellow - green/yellow 
PHY Chip Modecurrent 
MountTHT 
Shield TabsYes 
WL-SMCW SMT Mono-color Chip LED Waterclear, 625 nm, Red
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Dominant Wavelength [typ.]625 nm
Emitting ColorRed 
Peak Wavelength [typ.]630 nm
Luminous Intensity [typ.]250 mcd
Forward Voltage [typ.]2 V
Chip TechnologyAlInGaP 
Viewing Angle Phi 0° [typ.]140 °
PackagingTape and Reel 
Size0603 
Length1.6 mm
Packaging Unit4000 pcs
Width0.8 mm
Height0.7 mm
Operating Temperature -40 °C up to +85 °C
MountSMT 
WL-SMCW SMT Mono-color Chip LED Waterclear, 525 nm, Green
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Dominant Wavelength [typ.]525 nm
Emitting ColorGreen 
Peak Wavelength [typ.]515 nm
Luminous Intensity [typ.]430 mcd
Forward Voltage [typ.]3.2 V
Chip TechnologyInGaN 
Viewing Angle Phi 0° [typ.]140 °
PackagingTape and Reel 
Size0603 
Length1.6 mm
Packaging Unit4000 pcs
Width0.8 mm
Height0.7 mm
Operating Temperature -40 °C up to +85 °C
MountSMT 
WCAP-ASLI Aluminum Electrolytic Capacitors, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging15" Tape & Reel 
Capacitance68 µF
Capacitance±20% 
Size6.3 x 7.7 
Dissipation Factor14 %
Insulation Resistance1.47059 MΩ
Length7.7 mm
VersionSMT 
Ripple Current265 mA
Endurance 2000
Impedance400 mΩ
Leakage Current23.8 µA
Diameter6.3 mm
ESR0.33477 Ω
Packaging Unit900 pcs
Width6.6 mm
Rated Voltage35 V
Operating Temperature -55 °C up to +105 °C
MountV-Chip SMT 
WCAP-AS5H Aluminum Electrolytic Capacitors, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging15" Tape & Reel 
Capacitance100 µF
Capacitance±20% 
Size10.0 x 10.5 
Dissipation Factor13 %
Insulation Resistance1 MΩ
Length10.5 mm
VersionSMT 
Ripple Current150 mA
Endurance 5000
Leakage Current35 µA
Diameter10 mm
Packaging Unit500 pcs
Width10.3 mm
Rated Voltage35 V
Operating Temperature -40 °C up to +105 °C
MountV-Chip SMT 
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Capacitance100 nF
Capacitance±20% 
Size0402 
Q-Factor [1]600 
Dissipation Factor10 %
Insulation Resistance5 GΩ
Ceramic TypeX5R Class II 
Length1 mm
Pad Dimension0.25 mm
Packaging Unit10000 pcs
Width0.5 mm
Height0.5 mm
Rated Voltage25 V
Operating Temperature -55 °C up to +85 °C
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Capacitance1 nF
Capacitance±5% 
Size0603 
Insulation Resistance10 GΩ
Ceramic TypeNP0 Class I 
Length1.6 mm
Pad Dimension0.4 mm
Q-Factor1000 %
Packaging Unit4000 pcs
Width0.8 mm
Height0.8 mm
Rated Voltage25 V
Operating Temperature -55 °C up to +125 °C
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Capacitance100 pF
Capacitance±5% 
Size0603 
Insulation Resistance10 GΩ
Ceramic TypeNP0 Class I 
Length1.6 mm
Pad Dimension0.4 mm
Q-Factor1000 %
Packaging Unit4000 pcs
Width0.8 mm
Height0.8 mm
Rated Voltage50 V
Operating Temperature -55 °C up to +125 °C
WCAP-CSGP MLCCs 10 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Capacitance2.2 µF
Capacitance±10% 
Size0603 
Q-Factor [1]600 
Dissipation Factor10 %
Insulation Resistance0.05 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Pad Dimension0.4 mm
Packaging Unit4000 pcs
Width0.8 mm
Height0.8 mm
Rated Voltage10 V
Operating Temperature -55 °C up to +125 °C
WCAP-CSGP MLCCs 16 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Capacitance100 nF
Capacitance±10% 
Size0603 
Q-Factor [1]600 
Dissipation Factor3.5 %
Insulation Resistance5 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Pad Dimension0.4 mm
Packaging Unit4000 pcs
Width0.8 mm
Height0.8 mm
Rated Voltage16 V
Operating Temperature -55 °C up to +125 °C
WCAP-CSGP MLCCs 16 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Capacitance150 nF
Capacitance±10% 
Size0603 
Q-Factor [1]600 
Dissipation Factor5 %
Insulation Resistance3.3 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Pad Dimension0.4 mm
Packaging Unit4000 pcs
Width0.8 mm
Height0.8 mm
Rated Voltage16 V
Operating Temperature -55 °C up to +125 °C
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Capacitance100 nF
Capacitance±10% 
Size0603 
Q-Factor [1]600 
Dissipation Factor3.5 %
Insulation Resistance5 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Pad Dimension0.4 mm
Packaging Unit4000 pcs
Width0.8 mm
Height0.8 mm
Rated Voltage25 V
Operating Temperature -55 °C up to +125 °C
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Capacitance220 pF
Capacitance±10% 
Size0603 
Q-Factor [1]600 
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Pad Dimension0.4 mm
Packaging Unit4000 pcs
Width0.8 mm
Height0.8 mm
Rated Voltage50 V
Operating Temperature -55 °C up to +125 °C
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Capacitance1.5 nF
Capacitance±10% 
Size0603 
Q-Factor [1]600 
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Pad Dimension0.4 mm
Packaging Unit4000 pcs
Width0.8 mm
Height0.8 mm
Rated Voltage50 V
Operating Temperature -55 °C up to +125 °C
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Capacitance2.2 nF
Capacitance±10% 
Size0603 
Q-Factor [1]600 
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Pad Dimension0.4 mm
Packaging Unit4000 pcs
Width0.8 mm
Height0.8 mm
Rated Voltage50 V
Operating Temperature -55 °C up to +125 °C
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Capacitance10 nF
Capacitance±10% 
Size0603 
Q-Factor [1]600 
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Pad Dimension0.4 mm
Packaging Unit4000 pcs
Width0.8 mm
Height0.8 mm
Rated Voltage50 V
Operating Temperature -55 °C up to +125 °C
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Capacitance47 nF
Capacitance±10% 
Size0603 
Q-Factor [1]600 
Dissipation Factor3 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Pad Dimension0.4 mm
Packaging Unit4000 pcs
Width0.8 mm
Height0.8 mm
Rated Voltage50 V
Operating Temperature -55 °C up to +125 °C
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Capacitance100 nF
Capacitance±10% 
Size0603 
Q-Factor [1]600 
Dissipation Factor3 %
Insulation Resistance5 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Pad Dimension0.4 mm
Packaging Unit4000 pcs
Width0.8 mm
Height0.8 mm
Rated Voltage50 V
Operating Temperature -55 °C up to +125 °C
WCAP-CSGP MLCCs 16 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Capacitance10 µF
Capacitance±20% 
Size0805 
Q-Factor [1]600 
Dissipation Factor10 %
Insulation Resistance0.01 GΩ
Ceramic TypeX5R Class II 
Length2 mm
Pad Dimension0.5 mm
Packaging Unit3000 pcs
Width1.25 mm
Height1.25 mm
Rated Voltage16 V
Operating Temperature -55 °C up to +85 °C
WR-MPC3 Receptacle & Plug Single Row, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
PackagingBag 
Insulation Resistance1000 MΩ
GenderFemale 
Polarity
Pins
Operating Temperature -25 °C up to +105 °C
PCB/Cable/PanelCable 
TypeReceptacle Housing 
WR-MPC3 Male Header Single Row, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
PackagingTray 
Insulation Resistance1000 MΩ
Length9.65 mm
GenderMale 
Working Voltage250 V (AC)
Polarity
Pin PlatingTin over Nickel 
Contact PlatingTin 
Rated Current5 A
Rated Current5000 mA
Operating Temperature -40 °C up to +105 °C
MountTHT 
PCB/Cable/PanelPCB 
TypeVertical 
WR-PHD Socket Header - Dual, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
PackagingTube 
Insulation Resistance1000 MΩ
Length8.12 mm
GenderSocket Header 
Working Voltage250 V (AC)
Contact PlatingGold 
Rated Current3 A
Pins
Rated Current3000 mA
Operating Temperature -40 °C up to +105 °C
MountSMT 
TypeStraight 
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
PackagingBag 
Insulation Resistance1000 MΩ
Length5.08 mm
GenderPin Header 
Working Voltage250 V (AC)
Contact PlatingGold 
Pins
Rated Current3000 mA
Operating Temperature -40 °C up to +105 °C
MountTHT 
TypeAngled 
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
PackagingBag 
Insulation Resistance1000 MΩ
Length10.16 mm
GenderPin Header 
Working Voltage250 V (AC)
Contact PlatingGold 
Pins
Rated Current3000 mA
Operating Temperature -40 °C up to +105 °C
MountTHT 
TypeAngled 
WR-TBL Series 313 - 5.08 mm Close Horizontal PCB Header, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
PackagingBox 
Length11.56 mm
VariantClosed ends 
Working Voltage320 V (AC)
Polarity02 
Pin PlatingTin over Nickel 
Contact PlatingTin 
Pins
Rated Current15000 mA
Operating Temperature -40 °C up to +105 °C
MountTHT 
PCB/Cable/PanelPCB 
ModularityNo 
TypeClosed Horizontal Plug entry 
WR-TBL Series 3221 - 3.50 mm Horizontal PCB Header, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
PackagingBox 
Length15.4 mm
Working Voltage300 V (AC)
Polarity04 
Pin PlatingTin over Nickel 
Contact PlatingTin 
Pins
Rated Current10500 mA
Operating Temperature -40 °C up to +105 °C
MountTHT 
PCB/Cable/PanelCable 
ModularityNo 
TypePCB Header 
WR-TBL Series 351 - 5.08 mm Vertical, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
PackagingBox 
Length10.16 mm
Working Voltage320 V (AC)
Polarity02 
Contact PlatingTin over Nickel 
Pins
Rated Current20000 mA
Operating Temperature -40 °C up to +105 °C
MountCable 
PCB/Cable/PanelCable 
ModularityNo 
TypeVertical 
Wire Section 12 to 24 (AWG) 3.31 to 0.205 (mm²)
WR-TBL Series 3611 - 3.50 mm Vertical, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
PackagingBox 
Length14 mm
Working Voltage300 V (AC)
Contact PlatingTin over Nickel 
Pins
Rated Current10500 mA
Operating Temperature -40 °C up to +105 °C
MountCable 
PCB/Cable/PanelCable 
ModularityNo 
TypeVertical 
Wire Section 26 to 16 (AWG) 0.129 to 1.31 (mm²)
WP-BUCF REDCUBE PRESS-FIT with internal thread, circumference, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
PackagingTray 
Width13 mm
Height13.5 mm
Rated Current240 A
Inner ThreadM6 
Thread Length13.5 mm
Pins16 
Rated Current240000 mA
Operating Temperature -55 °C up to +150 °C
MountPress-Fit 
WA-SSTIE Steel Spacer Stud, metric, internal/external, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
PackagingCarton 
Length30 mm
SW7 mm
Outer ThreadM4 
Inner ThreadM4 
Operating Temperature -55 °C up to +150 °C
WA-SSTII Steel Spacer Stud, metric, internal/internal, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
PackagingCarton 
Length60 mm
SW7 mm
Inner ThreadM4 
Operating Temperature -55 °C up to +150 °C
WA-SSTII Steel Spacer Stud, metric, internal/internal, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
PackagingCarton 
Length30 mm
SW8 mm
Inner ThreadM5 
Operating Temperature -55 °C up to +150 °C
WA-SSTII Steel Spacer Stud, metric, internal/internal, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
PackagingCarton 
Length30 mm
SW10 mm
Inner ThreadM6 
Operating Temperature -55 °C up to +150 °C
WS-SLSV SMT Mini Slide Switch, Same Side Connection 7.65 x 5.5 mm, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Operation Force350 g
SchematicDPDT 
PackagingTape and Reel 
Insulation Resistance100 MΩ
Contact PlatingSilver 
Packaging Unit1500 pcs
Rated Current300 mA
Rated Voltage6 V
Operating Temperature -40 °C up to +85 °C
WR-MPC3 Terminal, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Product seriesWR-MPC3 Terminal
PackagingBag 
GenderFemale 
VariantLow Force 
Working Voltage250 V (AC)
Contact PlatingTin 
Packaging Unit100 pcs
Rated Current5 A
Rated Current5000 mA
Operating Temperature -25 °C up to +105 °C
PCB/Cable/PanelCable 
TypeCrimp Terminal 
Wire Section 24 to 20 (AWG) 0.205 to 0.518 (mm²)
WR-DSUB PCB, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Product seriesWR-DSUB PCB
PackagingTray 
Insulation Resistance5000 MΩ
Length30.8 mm
VersionStandard 
GenderMale 
Variantwithout Hex Screw 
Working Voltage125 V (AC)
Contact PlatingSelective Gold 
Rated Current3 A
Pins
Rated Current3000 mA
Operating Temperature -55 °C up to +105 °C
PCB/Cable/PanelPCB 
TypeAngled 
WCAP-CSMH Mid and High Voltage, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Capacitance470 pF
Capacitance±10% 
Size1206 
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length3.2 mm
Pad Dimension0.6 mm
Q-Factor600 %
Packaging Unit3000 pcs
Width1.6 mm
Height1.25 mm
Rated Voltage1000 V
Operating Temperature -55 °C up to +125 °C
WCAP-PSHP Aluminum Polymer Capacitors, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging15" Tape & Reel 
Capacitance100 µF
Capacitance±20% 
Size8.0 x 8.7 
Dissipation Factor12 %
Length8.7 mm
Ripple Current3000 mA
Endurance 2000
Leakage Current700 µA
Diameter8 mm
ESR0.03 Ω
Width8.3 mm
Rated Voltage35 V
Operating Temperature -55 °C up to +105 °C
MountV-Chip SMT 
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Capacitance10 µF
Capacitance±10% 
Size1210 
Q-Factor [1]600 
Dissipation Factor10 %
Insulation Resistance0.01 GΩ
Ceramic TypeX7R Class II 
Length3.2 mm
Pad Dimension0.6 mm
Width2.5 mm
Height2.5 mm
Rated Voltage50 V
Operating Temperature -55 °C up to +125 °C
WL-SBCW SMT Bi-color Chip LED Waterclear, –, Yellow & Bright Green
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Emitting ColorYellow & Bright Green 
Peak Wavelength (Bright Green) [typ.]572 nm
Peak Wavelength (Yellow) [typ.]595 nm
Dominant Wavelength (Bright Green) [typ.]570 nm
Dominant Wavelength (Yellow) [typ.]590 nm
Luminous Intensity (Bright Green) [typ.]40 mcd
Luminous Intensity (Yellow) [typ.]120 mcd
Forward Voltage (Bright Green) [typ.]2 V
Forward Voltage (Yellow) [typ.]2 V
Chip TechnologyAlInGaP 
Viewing Angle Phi 0° [typ.]130 °
PackagingTape and Reel 
Size1210 
Packaging Unit3000 pcs
Operating Temperature -40 °C up to +85 °C
MountSMT 
WCAP-FTDB DC-Link, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Product seriesWCAP-FTDB DC-Link
PackagingCarton 
Capacitance75 µF
Capacitance±5% 
Insulation Resistance133.33 MΩ
Length57 mm
Rate of Voltage Rise15 V/µs
Dissipation Factor0.31 %
Ripple Current25700 mA
ESR0.0047 Ω
Pin length4 mm
Width45 mm
Height65 mm
Pins
Rated Voltage900 V
Operating Temperature -40 °C up to +105 °C
WCAP-FTDB DC-Link, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Product seriesWCAP-FTDB DC-Link
PackagingCarton 
Capacitance50 µF
Capacitance±5% 
Insulation Resistance200 MΩ
Length57 mm
Rate of Voltage Rise20 V/µs
Dissipation Factor0.27 %
Ripple Current19300 mA
ESR0.0062 Ω
Pin length4 mm
Width45 mm
Height65 mm
Pins
Rated Voltage1100 V
Operating Temperature -40 °C up to +105 °C
WE-AGDT Auxiliary Gate Drive Transformer, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
SizeEP7 
Length11.3 mm
Saturation Current1.2 A
VersionFlyback 
Input Voltage 6 - 18
Output Voltage 120 V
Output Voltage 25 V
Output Voltage 35 V
Auxiliary Voltage5 V
Total Output Power1.5 W
Interwinding Capacitance6.4 pF
Switching Frequency 150
Turns Ratio1.56:3.89:1:1:1 
IC ReferenceNCV(P)3064 
Width10.95 mm
Height11.94 mm
Inductance42 µH
Operating Temperature -40 °C up to +130 °C