Electronic & electromechanical components

Passive Components

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EMC Components Power Magnetics Signal & Communications Capacitors Resistors Quartz Crystals & Oscillatorsmore

Active Components

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Power Modules (MagI³C Series)Digital Isolators Sensors Radio Modulesmore

Electromechanical Components

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Connectors Switches Assembly REDCUBE Terminalsmore

Optoelectronic Components

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LEDs IC LEDs Infrared Ultraviolet Optocoupler Laser 7 Segments Display Optical Sensors Development Kits Evaluation Kitsmore

Thermal Management

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Gap Filling Solutions Heat Spreading Solutions Hybrid Solutions Heat Sinks Sample Kits Thermal Managementmore

Automotive

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Ferrites for Cable Assembly Ferrites for PCB Assembly Filter Chokes Common Mode Chokes for Automotive Power Lines Common Mode Chokes for Extra-low Voltage and Data Lines Single Coil Power Inductors Power Transformer RF Inductors Assembly REDCUBE PRESS FIT Terminals Customized Solutions Design Kits Automotive Alpha-Rack Automotivemore

NEW

Edge AI Boards NEW

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GRINN – GenioBoard Edge AI SBCmore

All new productsEMC ComponentsSignal & CommunicationsCapacitorsPower Modules (MagI³C Series)Digital IsolatorsSensorsRadio ModulesConnectorsSwitchesOptocouplerHeat SinksCommon Mode Chokes for Automotive Power LinesSingle Coil Power InductorsPower Transformer

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- By combining strong magnetic performance with flexible size and inductance options beyond typical ferrite limits, Nanocrystalline cores enable smaller designs
- High attenuation at lower frequencies with broadband noise-filtering capability
- Temperature stable behavior compared to existing ferrite materials

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- Extremely flexible and thin nanocrystalline sheets for low frequency (LF) magnetic field applications
- Easy placement and handling thanks to standard adhesive backing
- High surface resistance and easy to process

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- Test voltage of 2250 V<sub>DC</sub> / 1 min.
- Available in various footprints
- Operating temperature: -40 °C to 125 °C

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- Y2/X1 capacitors for safety and EMI suppression
- Good self-healing properties
- Ideal for safety applications, main filters and between line/neutral and ground

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- Simple design (no transformer design know how required)
- Leaded through-hole package for easy manufacturing and prototyping
- High output power

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- 2-channel bidirectional I²C isolators
- Isolation voltage up to 3750 VRMS
- Bidirectional SDA and bi- or unidirectional SCL communication

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- Flexible interface options: I²C, SPI, and analog outputs, plus an integrated CRC check for reliable data integrity.

- High precision: Operating voltage range of 3–5.5 V and 16‑bit ADC/DAC enabling accurate differential pressure measurements.

- Wide application range: Five fixed pressure ranges from ±1 kPa to –100…1000 kPa, suitable for diverse use cases.

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- Bluetooth® LE 6.0 with nRF54L15 and 1.5 MB NVM / 256 kB RAM.
- Smart antenna: integrated PCB antenna or external antenna option.
- Compact & efficient: 12×8×2.3 mm, +8 dBm output power, 0.6 µA system‑off current.

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- Flexible development platform: Built on the Nordic nRF54L15 SoC, Ophelia‑IV serves as a customizable platform for firmware development using the nRF Connect SDK and Zephyr RTOS.
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Extensive protocol support: Depending on the firmware, it supports modern wireless standards such as Thread, Zigbee, Matter, and IEEE 802.15.4, along with Smart Antenna Selection.

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- SKEDD direct plug-in technology
- Active locking with acoustic & haptic feedback
- Mechanical stability up to 10 g

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Manual crimp tool for the new WR-WSP SKEDD terminal

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- High current (6.5 A) and high Voltage (250 V)
- Space saving design
- Glow Wire tested

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- Standard and low-force crimp contacts
- AWG 26-24 & AWG 22-20
- Single contacts for manual prototyping

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- Cables with standard and low-force contacts
- 150 mm & 300 mm cable length
- Ideal for prototyping

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- Suitable for single-crimpcontacts of WR-NPC2 series
- Separate crimp head available for existing handles
- Covers all secified AWG range of WR-NPC2

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- Suitable for reeled crimpcontacts of WR-NPC2 series
- Fits in a wide range of semi-automatic crimp-tools
- Covers all secified AWG range of WR-NPC2

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- New short-travel tact switches with actuation forces from 16 to 250 g
- Ideal for remote controls and applications requiring very short travel

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- Optocouplers with very high transmission speed
- Precise shifting without much delay thanks to fast switching times
- High insulation voltage

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- Aluminum heatsinks
- Low thermal resistance
- High surface emissivity
- Size adapts to different TO packaging

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- Aluminum heatsinks
- Low thermal resistance and high surface emissivity
- Size adapts to different TO packaging
- Optimal contact between the component and heatsink

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- Aluminum heatsinks
- Low thermal resistance and high surface emissivity
- Size adapt to different IC
- Different designs depending on airflow

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- Aluminum heatsinks
- Low thermal resistance and high surface emissivity
- Size adapts to different IC
- Different design depending on airflow

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Mounting accessories for heat sinks

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- Very high permeability nanocrystalline core material
- Improved isolation through plastic case and winding spacer
- Automotive qualified

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- High‑voltage MnZn common mode choke for automotive use up to 1000 VAC / 1250 VDC and 22 A
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Reinforced isolation with plastic case and spacer

- Ideal for power line filtering and common‑mode noise suppression in DC/DC converters, onboard chargers, and motor inverters

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- Innovative iron alloy material
- Ultra low R<sup>DC</sup> and AC losses
- Automotive qualified

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- 3 heights (2010, 2013, 2016) for maximum design flexibility
- High-current saturation for high ripple applications
- Flat wire construction
- Very low DC resistance for less heat dissipation

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- Interwinding capacitance down to <3 pF
- Tiny surface mount EP7 package
- Dielectric insulation up to 4 kV AC

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Electronics Manufacturing

Vapor Phase Soldering

Discover how our electromechanical components, in collaboration with IBL soldering technology, not only provide comfort and safety but also demonstrate excellence under extreme conditions in the vapor phase soldering process.

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Power Electronics

Thermal Management

Thermal management describes the dissipation and distribution of heat in an application to avoid overheating and extend the lifespan of the installed electronic components.

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Internet of Things

Wireless Connectivity and Sensors

Internet of Things describes the exchange of data in a network of physical and virtual objects, enabling collaboration between them. Wireless modules and sensors provide the foundation for this.

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Data Transmission

Single Pair Ethernet

Single Pair Ethernet represents a new type of data transmission. Unlike multipair Ethernet, it only requires two wires. The reduced number of wires results in thinner cable diameters and lower costs.

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Electronic & electromechanical components

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