IC manufacturers STMicroelectronics

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STMicroelectronics SPC58NN84E7 | Demoboard AEK-POW-BMS63EM

Overview

TopologyBattery Management System
Input voltage12 V
Output 164 V
IC revision1.0

Description

The AEK-POW-BMS63EM is a battery management system (BMS) evaluation board that can handle from 1 to 31 Li-ion battery nodes. Each battery node manages from 4 to 14 battery cells, for a voltage range from 48 to 64 V.Thanks to the two embedded transceivers, the board can be used as the first node in a BMS daisy chain, connected to a battery pack of 6, or 10 (in configuration A or B, as detailed in UM3185), or 14 cells, and in a dual access ring BMS chain.The board monitors state of charge (SoC) and state of health (SOH) of each battery and manages battery balancing by passive discharge, thanks to the software already preloaded on the on-board SPC58NN84E7 microcontroller.The board is equipped with two CAN ports featuring the versatile CAN2.0 protocol that facilitates integration into several systems and efficient component communication.It hosts the following devices: SPC58NN84E7, L9963F, L9963T, LM2902W, and STGAP2GS.The SPC58NN84E7 automotive grade microcontroller is responsible for calculating the SoC and the SOH of the battery pack connected, based on the measurement provided by the L9963F through the L9963T ISOSPI<>SPI transceiver.The power management integrated circuit (PMIC) supplies the entire board except for the BMS (first node) module only.The PMIC consists of four DC/DC converters: three buck converters (5, 3.3 and 0.97 V) and one boost controller (9.5 V). In addition, it features two LDOs, both at 5 V.The step-down converter 5 V output is used to power the microcontroller and other main peripherals such as the L9963T, while the LDO is used to power the microcontroller ADC. NVM procedure is also available but not exploited on this board. Thus, the default ST value is used.Thanks to the L9963T transceiver, the MCU and the L9963F communicate through the ISOSPI protocol, implementing differential communication for higher noise immunity.The L9963F is designed for operation in both hybrid (HEV) and full electric (BEV) vehicles using lithium battery packs, but its use can be extended to other transportation and industrial applications.The main activity of the L9963F is monitoring cells and battery node status through stack voltage measurement, cell voltage measurement, temperature measurement, and coulomb counting.Measurement and diagnostic tasks can be executed either on demand or periodically, with a programmable cycle interval. Measurement data are available for the onboard SPC58NN84E7 microcontroller to perform charge balancing and to compute the state of charge (SoC) and the state of health (SOH).The L9963T general-purpose SPI to isolated SPI bidirectional transceiver can transfer incoming communication data from a classical 4-wire based SPI interface to a 2-wire isolated interface (and vice versa). In our board, the two transceivers are configured as slaves.The LM2902W is used to sense the temperature in the battery ecosystem (that is, the temperature in the battery pack) through NTCs.The STGAP2GS keeps the control circuit and power circuit electrically separate (isolated), increasing system safety, and robustness. It therefore protects the control section (for example, the microcontroller) from overvoltage or faults that may occur in the power section.In our application, to connect different battery holders with a variable number of battery cells to the first node, we short-circuited the missing cells on the battery pack as well as the unused cells of the L9963F device, through MOSFETs driven by the STGAP2GS gate driver.The unused cells are disabled via software to avoid incorrect readings of the remaining cells and the related diagnostics, and to prevent potential failures (such as cell undervoltage).A standard BMS primarily monitors and protects the battery pack. The protection function brings the system to a safe state in case of under/overvoltage and overheating.The board safety features include overload and overvoltage protection, against potential issues that could compromise battery integrity, alongside overdischarge protection to prevent excessive discharge and extend battery life.The board core features ensure battery health and longevity. Continuous voltage monitoring provides real-time information about battery status, enabling quick detection of deviations from ideal voltage levels, ensuring reliability, and preventing potential issues.The AEK-POW-BMS63EM provides an elaborate monitoring network to sense the voltage, current, and temperature of each cell. This sensing allows elaborating the SoC of each battery cell and, consequently, the state of charge of all battery packs. The SoC allows assessing the remaining battery capacity, which equates to the remaining driving range.As previously mentioned, the AEK-POW-BMS63EM can work into two different topologies: daisy chain and dual access ring.In the daisy chain configuration, a series of BMS is connected to the AEK-POW-BMS63EM, configured as the first node of the chain.The onboard MCU communicates with the hosted L9963T transceiver through the SPI protocol. The transceiver converts these signals into ISO SPI signals to communicate with the other BMS nodes of the chain.Converting SPI signals into isolated SPI signals, the transceiver reduces the number of necessary wires from 4 to 2 and implements differential communication for higher noise immunity.A dual-access ring configuration is also possible thanks to the second onboard transceiver that makes the communication bidirectional. The secondary ring is used as a backup in case the primary ring fails. Data moves in opposite directions around the rings, and each ring remains independent of the other unless the primary ring fails. The two rings are connected to continue the flow of data traffic.In our application, the AEK-POW-BMS63EM is the first node of the chain, while the additional nodes can be other BMS boards of our portfolio.In the AutoDevKit ecosystem software package, we developed an example demo application based on the SPC58NN84E7 MCU for dual access ring configuration to estimate the SoC of 14 cells in a BMS node connected to an AEK-POW-BMS63EM evaluation board, using Li-ion batteries (LG INR 18650 MJ1).The results of SoC estimation, cell voltage, battery pack temperatures and current can be printed via the serial port to a terminal on the PC with a speed rate of 115200 bps.

Features

Hosts:L9963F AEC-Q100 qualified automotive multicell battery monitoring and balancing ICTwo L9963T AEC-Q100 qualified automotive general-purpose SPI to isolated SPI bidirectional transceiversTwo CAN-FD transceivers supporting high-speed applications up to 8 MbpsSPC58NN84E7 ASIL-D MCU, featuring five cores and a hardware security module for system robustness, safety and integrity, to perform charge balancing and to compute the state of charge (SoC) and the state of health (SOH)Two STGAP2GS isolated gate drivers to isolate the microcontroller from overvoltage or faults and to allow different battery pack connections by driving the MOSFETs that short-circuit unused cellsLM2902W low-power quad operational amplifier to sense the battery pack temperatureFour battery pack connections are possible with 6, or 10 (in configuration A or B), or 14 cells, using the AEK-POW-BMS63EM as first nodeVoltage monitoring of up to 14 battery cellsCurrent sensing of the entire battery nodeThanks to the two embedded L9963T ISOSPI transceivers, the board allows configuring two different topologies: daisy chain and dual access ring4 configurable GPIOs, pluggable with NTCs for temperature measurement through an external temperature sensor3 embedded NTCs to sense the BMS node temperature3 additional NTCs hosted on the battery holder connectorSPI interface to communicate with the MCUPassive balancingJTAG module for board firmware debugging/programmingDebug mode for board testingCompact size: 183 x 78 mmIncluded in the AutoDevKit ecosystem

Typical applications

  • Industrial tools, motor drives and equipment
  • Electro-mobility

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Q-Factor840 
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Insulation Resistance10 GΩ
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Length1.6 mm
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Dissipation Factor2.5 %
Insulation Resistance10 GΩ
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Insulation Resistance10 GΩ
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Capacitance4.7 nF
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Dissipation Factor2.5 %
Insulation Resistance10 GΩ
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Length1.6 mm
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Dissipation Factor2.5 %
Insulation Resistance10 GΩ
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Capacitance10 nF
Capacitance±10% 
Size0603 
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Pad Dimension0.4 mm
Height0.8 mm
Rated Voltage50 V (DC)
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SPECWCAP-CSGP MLCCs 50 V(DC), –, –
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Availability
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Packaging Unit4000 pcs
Operating Temperature -55 °C up to +125 °C
Capacitance47 nF
Capacitance±10% 
Size0603 
Dissipation Factor3 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Pad Dimension0.4 mm
Height0.8 mm
Rated Voltage50 V (DC)
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SPECWCAP-CSGP MLCCs 50 V(DC), –, –
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Availability
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Packaging Unit4000 pcs
Operating Temperature -55 °C up to +125 °C
Capacitance68 nF
Capacitance±10% 
Size0603 
Dissipation Factor3 %
Insulation Resistance7.4 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Pad Dimension0.4 mm
Height0.8 mm
Rated Voltage50 V (DC)
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SPECWCAP-CSGP MLCCs 50 V(DC), –, –
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Availability
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Packaging Unit4000 pcs
Operating Temperature -55 °C up to +125 °C
Capacitance100 nF
Capacitance±10% 
Size0603 
Dissipation Factor3 %
Insulation Resistance5 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Pad Dimension0.4 mm
Height0.8 mm
Rated Voltage50 V (DC)
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SPECWCAP-CSGP MLCCs 25 V(DC), –, –
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Availability
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Packaging Unit3000 pcs
Operating Temperature -55 °C up to +125 °C
Capacitance2.2 µF
Capacitance±10% 
Size0805 
Dissipation Factor10 %
Insulation Resistance0.05 GΩ
Ceramic TypeX7R Class II 
Length2 mm
Width1.25 mm
Pad Dimension0.5 mm
Height1.25 mm
Rated Voltage25 V (DC)
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SPECWCAP-CSGP MLCCs 50 V(DC), –, –
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Availability
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Packaging Unit3000 pcs
Operating Temperature -55 °C up to +125 °C
Capacitance1 µF
Capacitance±10% 
Size0805 
Dissipation Factor10 %
Insulation Resistance0.1 GΩ
Ceramic TypeX7R Class II 
Length2 mm
Width1.25 mm
Pad Dimension0.5 mm
Height1.25 mm
Rated Voltage50 V (DC)
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SPECWCAP-CSGP MLCCs 25 V(DC), –, –
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Availability
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Packaging Unit3000 pcs
Operating Temperature -55 °C up to +85 °C
Capacitance3.3 µF
Capacitance±20% 
Size0805 
Dissipation Factor10 %
Insulation Resistance0.03 GΩ
Ceramic TypeX5R Class II 
Length2 mm
Width1.25 mm
Pad Dimension0.5 mm
Height1.25 mm
Rated Voltage25 V (DC)
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SPECWCAP-CSGP MLCCs 25 V(DC), –, –
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Availability
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Packaging Unit3000 pcs
Operating Temperature -55 °C up to +85 °C
Capacitance4.7 µF
Capacitance±20% 
Size0805 
Dissipation Factor10 %
Insulation Resistance0.02 GΩ
Ceramic TypeX5R Class II 
Length2 mm
Width1.25 mm
Pad Dimension0.5 mm
Height1.25 mm
Rated Voltage25 V (DC)
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SPECWCAP-CSGP MLCCs 25 V(DC), –, –
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Availability
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Packaging Unit2000 pcs
Operating Temperature -55 °C up to +125 °C
Capacitance3.3 µF
Capacitance±10% 
Size1206 
Dissipation Factor3.5 %
Insulation Resistance0.2 GΩ
Ceramic TypeX7R Class II 
Length3.2 mm
Width1.6 mm
Pad Dimension0.6 mm
Height1.6 mm
Rated Voltage25 V (DC)
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SPECWCAP-CSGP MLCCs 50 V(DC), –, –
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Availability
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Packaging Unit2000 pcs
Operating Temperature -55 °C up to +125 °C
Capacitance4.7 µF
Capacitance±10% 
Size1206 
Dissipation Factor10 %
Insulation Resistance0.02 GΩ
Ceramic TypeX7R Class II 
Length3.2 mm
Width1.6 mm
Pad Dimension0.5 mm
Height1.6 mm
Rated Voltage50 V (DC)
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SPECWCAP-CSGP MLCCs 16 V(DC), –, –
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Availability
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Packaging Unit1000 pcs
Operating Temperature -55 °C up to +85 °C
Capacitance47 µF
Capacitance±20% 
Size1210 
Dissipation Factor10 %
Insulation Resistance0.002 GΩ
Ceramic TypeX5R Class II 
Length3.2 mm
Width2.5 mm
Pad Dimension0.75 mm
Height2.5 mm
Rated Voltage16 V (DC)
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SPECWS-TASV SMT Tact Switch 6x6 mm, –, –
Simu­lation
Availability
Status Activei| Production is active. Expected lifetime: >10 years.
Contact PlatingSilver 
PackagingTape and Reel 
Packaging Unit1000 pcs
Operating Temperature -40 °C up to +85 °C
Insulation Resistance100 MΩ
Diameter3.5 mm
Height4.3 mm
Operation Force260 g
Electrical Life200000 Cycles
Actuator ColorWhite 
Vaporphase processnot specified 
Rated Current0.05 A
Rated Voltage12 V (DC)
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SPECWA-SPAII Plastic Spacer Stud, metric, internal/ internal, –, –
Simu­lation
Availability
Status Activei| Production is active. Expected lifetime: >10 years.
PackagingBag 
Operating Temperature -30 °C up to +110 °C
Length10 mm
SW6 mm
Inner ThreadM3 
Flammability RatingUL94 HB 
ColorBlack 
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SPECWR-WTB 2.00 mm Female Dual Row Crimp Contact, –, Cable
Simu­lation
Availability
Status Activei| Production is active. Expected lifetime: >10 years.
PCB/Cable/PanelCable 
Wire Section 28 to 22 (AWG) 0.081 to 0.326 (mm²)
GenderFemale 
Contact PlatingTin 
Working Voltage250 V (AC)
Contact Resistance20 mΩ
PackagingBag 
Packaging Unit100 pcs
Stranded Wire Section (AWG)28 to 22 (AWG) 
Stranded Wire Section (Metric)0.081 to 0.326 (mm²) 
Operating Temperature -25 °C up to +85 °C
Insulation Resistance1000 MΩ
Rated Current3 A
TypeCrimp Terminal 
Rated Current3 A
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SPECWR-WTB 2.54 mm Female Crimp Contact, –, Cable
Simu­lation
Availability
Status Activei| Production is active. Expected lifetime: >10 years.
PCB/Cable/PanelCable 
Wire Section 28 to 22 (AWG) 0.081 to 0.326 (mm²)
GenderFemale 
Contact PlatingTin 
Working Voltage250 V (AC)
Contact Resistance20 mΩ
PackagingBag 
Packaging Unit100 pcs
Stranded Wire Section (AWG)28 to 22 (AWG) 
Stranded Wire Section (Metric)0.081 to 0.326 (mm²) 
Operating Temperature -40 °C up to +105 °C
Rated Current3 A
TypeCrimp Terminal 
Rated Current3 A
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SPECWCAP-CSGP MLCCs 100 V(DC), –, –
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Availability
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Packaging Unit4000 pcs
Operating Temperature -55 °C up to +125 °C
Capacitance100 pF
Capacitance±10% 
Size0603 
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Pad Dimension0.4 mm
Height0.8 mm
Rated Voltage100 V (DC)
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SPECWCAP-PSLP Aluminum Polymer Capacitors, –, –
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Availability
Status Activei| Production is active. Expected lifetime: >10 years.
MountV-Chip SMT 
Packaging15" Tape & Reel 
Operating Temperature -55 °C up to +105 °C
Capacitance47 µF
Capacitance±20% 
Size6.3 x 7.7 
Dissipation Factor12 %
Length7.7 mm
Width6.6 mm
Endurance 2000
Ripple Current1600 mA
ESR50 mΩ
Leakage Current600 µA
Diameter6.3 mm
Rated Voltage35 V (DC)
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SPECWCAP-CSGP MLCCs 100 V(DC), –, –
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Availability
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Operating Temperature -55 °C up to +125 °C
Capacitance100 nF
Capacitance±10% 
Size0603 
Dissipation Factor5 %
Insulation Resistance1 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Pad Dimension0.4 mm
Height0.8 mm
Rated Voltage100 V (DC)
Check availability
SPECWCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Availability
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Operating Temperature -55 °C up to +125 °C
Capacitance10 µF
Capacitance±10% 
Size1210 
Dissipation Factor10 %
Insulation Resistance0.01 GΩ
Ceramic TypeX7R Class II 
Length3.2 mm
Width2.5 mm
Pad Dimension0.6 mm
Height2.5 mm
Rated Voltage50 V (DC)
Check availability
SPECWCAP-CSGP MLCCs 50 V(DC), –, –
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Availability
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Operating Temperature -55 °C up to +85 °C
Capacitance10 µF
Capacitance±10% 
Size1206 
Dissipation Factor10 %
Insulation Resistance0.005 GΩ
Ceramic TypeX5R Class II 
Length3.2 mm
Width1.6 mm
Pad Dimension0.6 mm
Height1.6 mm
Rated Voltage50 V (DC)
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SPECWL-SMCW SMT Mono-color Chip LED Waterclear, –, –
Simu­lation
Availability
Status Activei| Production is active. Expected lifetime: >10 years.
MountSMT 
Dominant Wavelength [typ.]605 nm
Emitting ColorAmber 
Peak Wavelength [typ.]610 nm
Luminous Intensity [typ.]130 mcd
Forward Voltage [typ.]2 V
Chip TechnologyAlInGaP 
Viewing Angle Phi 0° [typ.]140 °
PackagingTape and Reel 
Packaging Unit4000 pcs
Operating Temperature -40 °C up to +85 °C
Size0805 
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SPECWE-LHCA Low Profile High Current Inductor, –, –
Simu­lation
Availability
Status Activei| Production is active. Expected lifetime: >10 years.
Saturation Current19.2 A
Self Resonant Frequency52 MHz
Operating Temperature -55 °C up to +155 °C
Size7030 
Length6.95 mm
Width6.6 mm
Performance Rated Current11.6 A
Saturation Current @ 10%7.5 A
DC Resistance0.0063 Ω
Height2.8 mm
DC Resistance0.0076 Ω
Inductance1 µH
Rated Current12.8 A
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SPECWCAP-CSGP MLCCs 100 V(DC), –, –
Simu­lation
Availability
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Operating Temperature -55 °C up to +125 °C
Capacitance2.2 µF
Capacitance±10% 
Size1210 
Dissipation Factor5 %
Insulation Resistance0.05 GΩ
Ceramic TypeX7R Class II 
Length3.2 mm
Width2.5 mm
Pad Dimension0.75 mm
Height2.5 mm
Rated Voltage100 V (DC)
Check availability
SPECWA-SCRW Pan Head Screw w. cross slot M3, –, –
Simu­lation
Availability
Status Activei| Production is active. Expected lifetime: >10 years.
PackagingBulk 
Packaging Unit2000 pcs
Operating Temperature -30 °C up to +85 °C
Length6 mm
Flammability RatingUL94 V-0 
ColorNatural 
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176881212
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Availability
Downloads
Status Activei| Production is active. Expected lifetime: >10 years.
Product series
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SPECWE-XTAL Quartz Crystal, –, –
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Availability
Status Activei| Production is active. Expected lifetime: >10 years.
MountSMT 
Frequency12 MHz
Frequency±30ppm 
Stability30 ppm
Load Capacitance18 pF
Operating Temperature -40 °C up to +85 °C
SizeCFPX-104 
Length5 mm
Width3.2 mm
Height1 mm
ApplicationProcessor, USB, CAN 
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SPECWE-XTAL Quartz Crystal, –, –
Simu­lation
Availability
Status Activei| Production is active. Expected lifetime: >10 years.
MountSMT 
Frequency40 MHz
Frequency±20ppm 
Stability30 ppm
Load Capacitance18 pF
Operating Temperature -40 °C up to +85 °C
SizeCFPX-104 
Length5 mm
Width3.2 mm
Height1 mm
ApplicationProcessor, USB, 3G/4G/5G, CAN, Wi-Fi 
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SPECWCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Availability
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Operating Temperature -55 °C up to +125 °C
Capacitance22 µF
Capacitance±10% 
Size1210 
Dissipation Factor10 %
Insulation Resistance0.005 GΩ
Ceramic TypeX7R Class II 
Length3.2 mm
Width2.5 mm
Pad Dimension0.6 mm
Height2.5 mm
Rated Voltage25 V (DC)
Check availability
SPECWE-CBA SMT EMI Suppression Ferrite Bead, –, –
Simu­lation
Availability
Status Activei| Production is active. Expected lifetime: >10 years.
MountSMT 
DC Resistance0.3 Ω
Operating Temperature -55 °C up to +125 °C
Size0805 
Length2 mm
Width1.2 mm
Height0.9 mm
Impedance @ 100 MHz1500 Ω
Maximum Impedance1800 Ω
Maximum Impedance70 MHz 
TypeHigh Current 
Rated Current1 A
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SPECWCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Availability
Status Activei| Production is active. Expected lifetime: >10 years.
Packaging7" Tape & Reel 
Operating Temperature -55 °C up to +125 °C
Capacitance220 nF
Capacitance±5% 
Size0603 
Dissipation Factor10 %
Insulation Resistance2.3 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Pad Dimension0.4 mm
Height0.8 mm
Rated Voltage50 V (DC)
Check availability
SPECWL-OCPT SOP-4, –, –
Simu­lation
Availability
Status Activei| Production is active. Expected lifetime: >10 years.
Product seriesWL-OCPT SOP-4
MountSMT 
Forward Voltage [typ.]1.24 V
Operating Temperature -55 °C up to +110 °C
SizeSOP4 
Length4.4 mm
Width3.6 mm
PackageSOP 4 
InputDC 
Collector Emitter Voltage35 V
Forward Current60 mA
IF = 5 mA
VCE = 5 V
Current Transfer Ratio [min.]200 %
Current Transfer Ratio [max.]400 %
Isolation Voltage3750 V (RMS)
Height2 mm
TypeOptocoupler Phototransistor 
Check availability