IC manufacturers Texas Instruments

IC manufacturers (103)

Texas Instruments XAM2434BSFGHIALV | Demoboard TMDS243EVM

Overview

TopologyOther Topology
IC revisionC

Description

The TMDS243 evaluation module (EVM) is a standalone test and development platform for evaluating AM243x functionality and developing prototypes for a variety of applications. TMDS243EVM is equipped with the larger form factor Sitara™ AM2434 ALV microcontroller unit (MCU) and additional components that allow the user to make use of the security features on the MCU, as well as various device interfaces, including industrial Ethernet, standard Ethernet, peripheral component interconnect express (PCIe), fast serial interface (FSI) and others to easily create prototypes. This EVM provides a larger peripheral set than the LP-AM243 LaunchPad™ as it is equipped with the larger form factor AM243 ALV package.An onboard display makes use of AM243x serial peripheral interface (SPI) ports to provide the ability for local visual outputs in addition to the LEDs. Onboard current-measurement capabilities are available to monitor power consumption for power-conscious applications.The supplied USB cable, paired with embedded emulation logic, allows for emulation and debugging using standard development tools, such as the Code Composer Studio™ integrated development environment (IDE) (CCSTUDIO).Note that TMDS243EVM is the newest version of TMS243GPEVM. TMDS243EVM includes high-security field-securable (HS-FS) silicon to customize keys and encryption for security applicationsFeaturesThree RJ45 Ethernet ports capable of 1Gb or 100Mb speedsReal-time, low-pin-count FSI interface for easy connection with C2000™ MCUs1-in display and LEDs for convenient visual outputsFour-lane PCIe connector to interface one-lane PCIe cardOnboard power-measurement capabilities

Typical applications

  • test and development platform for evaluating AM243x functionality

Products

Order Code
Data­sheet
Simu­lation
Downloads
Status
Product series
λDom typ.(nm)
Emitting Color
λPeak typ.(nm)
IV typ.(mcd)
VF typ.(V)
Chip Technology
50% typ.(°)
RDC(mΩ)
C
Tol. C
VR(V (DC))
Size
Operating Temperature
Q(%)
DF(%)
RISO
Ceramic Type
L(mm)
W(mm)
Fl(mm)
Packaging
L(µH)
IRP,40K(A)
ISAT,30%(A)
RDC typ.(mΩ)
fres(MHz)
VOP(V)
Mount
ISAT,10%(A)
Material
Z @ 100 MHz(Ω)
Zmax(Ω)
Test Condition Zmax
IR 2(mA)
RDC max.(Ω)
Type
IR(mA)
Z @ 1 GHz(Ω)
H(mm)
Samples
WL-SMCW SMT Mono-color Chip LED Waterclear, 570 nm, Bright Green
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Dominant Wavelength [typ.]570 nm
Emitting ColorBright Green 
Peak Wavelength [typ.]572 nm
Luminous Intensity [typ.]40 mcd
Forward Voltage [typ.]2 V
Chip TechnologyAlInGaP 
Viewing Angle Phi 0° [typ.]140 °
Size0603 
Operating Temperature -40 °C up to +85 °C
Length1.6 mm
Width0.8 mm
PackagingTape and Reel 
MountSMT 
Height0.7 mm
WL-SMCW SMT Mono-color Chip LED Waterclear, 570 nm, Bright Green
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Dominant Wavelength [typ.]570 nm
Emitting ColorBright Green 
Peak Wavelength [typ.]572 nm
Luminous Intensity [typ.]40 mcd
Forward Voltage [typ.]2 V
Chip TechnologyAlInGaP 
Viewing Angle Phi 0° [typ.]140 °
Size0805 
Operating Temperature -40 °C up to +85 °C
Length2 mm
Width1.25 mm
PackagingTape and Reel 
MountSMT 
Height0.7 mm
WL-SMCD SMT Mono-color Chip LED Diffused, 624 nm, Red
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Dominant Wavelength [typ.]624 nm
Emitting ColorRed 
Peak Wavelength [typ.]632 nm
Luminous Intensity [typ.]90 mcd
Forward Voltage [typ.]2 V
Chip TechnologyAlInGaP 
Viewing Angle Phi 0° [typ.]140 °
Size0603 
Operating Temperature -40 °C up to +85 °C
Length1.6 mm
Width0.8 mm
PackagingTape and Reel 
MountSMT 
Height0.4 mm
WL-SMCW SMT Mono-color Chip LED Waterclear, 625 nm, Red
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Dominant Wavelength [typ.]625 nm
Emitting ColorRed 
Peak Wavelength [typ.]630 nm
Luminous Intensity [typ.]150 mcd
Forward Voltage [typ.]2 V
Chip TechnologyAlInGaP 
Viewing Angle Phi 0° [typ.]140 °
Size0805 
Operating Temperature -40 °C up to +85 °C
Length2 mm
Width1.25 mm
PackagingTape and Reel 
MountSMT 
Height0.7 mm
WE-CBF SMT EMI Suppression Ferrite Bead, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Size0402 
Operating Temperature -55 °C up to +125 °C
Length1 mm
Width0.5 mm
Pad Dimension0.25 mm
MountSMT 
Impedance @ 100 MHz220 Ω
Maximum Impedance360 Ω
Maximum Impedance450 MHz 
Rated Current 2900 mA
DC Resistance0.35 Ω
TypeWide Band 
Rated Current300 mA
Impedance @ 1 GHz200 Ω
Height0.5 mm
WE-MPSB EMI Multilayer Power Suppression Bead, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Size0603 
Operating Temperature -55 °C up to +125 °C
Length1.6 mm
Width0.8 mm
Pad Dimension0.3 mm
DC Resistance5 mΩ
MountSMT 
Impedance @ 100 MHz26 Ω
Maximum Impedance39 Ω
Maximum Impedance515 MHz 
Rated Current 26500 mA
DC Resistance0.008 Ω
TypeHigh Current 
Rated Current6500 mA
Impedance @ 1 GHz33 Ω
Height0.8 mm
WE-MAPI SMT Power Inductor, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Size3020 
Operating Temperature -40 °C up to +125 °C
Length3 mm
Width3 mm
Inductance10 µH
Performance Rated Current1.65 A
Saturation Current @ 30%3 A
DC Resistance280 mΩ
Self Resonant Frequency18 MHz
Operating Voltage80 V
MountSMT 
Saturation Current @ 10%1.55 A
DC Resistance0.322 Ω
Rated Current1200 mA
Height2 mm
WE-HCI SMT Flat Wire High Current Inductor, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
DC Resistance4.75 mΩ
Size5040 
Operating Temperature -40 °C up to +150 °C
Length5.5 mm
Width5.3 mm
Inductance1 µH
Performance Rated Current14.8 A
Saturation Current @ 30%11.5 A
Self Resonant Frequency158 MHz
MountSMT 
Saturation Current @ 10%5.5 A
MaterialSuperflux 
DC Resistance0.005225 Ω
Height4 mm
WE-LHMI SMT Power Inductor, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Size7030 
Operating Temperature -40 °C up to +125 °C
Length7.3 mm
Width6.6 mm
Inductance0.47 µH
Performance Rated Current16.6 A
Saturation Current @ 30%37.8 A
DC Resistance4 mΩ
Self Resonant Frequency91 MHz
Operating Voltage120 V
MountSMT 
Saturation Current @ 10%21.4 A
DC Resistance0.0042 Ω
Rated Current11500 mA
Height2.8 mm
WCAP-CSGP MLCCs 16 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance10 pF
Capacitance±5% 
Rated Voltage16 V (DC)
Size0402 
Operating Temperature -55 °C up to +125 °C
Q-Factor600 %
Insulation Resistance10 GΩ
Ceramic TypeNP0 Class I 
Length1 mm
Width0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Height0.5 mm
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance15 pF
Capacitance±5% 
Rated Voltage25 V (DC)
Size0402 
Operating Temperature -55 °C up to +125 °C
Q-Factor700 %
Insulation Resistance10 GΩ
Ceramic TypeNP0 Class I 
Length1 mm
Width0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Height0.5 mm
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance33 pF
Capacitance±5% 
Rated Voltage50 V (DC)
Size0402 
Operating Temperature -55 °C up to +125 °C
Q-Factor1000 %
Insulation Resistance10 GΩ
Ceramic TypeNP0 Class I 
Length1 mm
Width0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Height0.5 mm
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance10 nF
Capacitance±10% 
Rated Voltage25 V (DC)
Size0402 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1 mm
Width0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Height0.5 mm
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance15 nF
Capacitance±10% 
Rated Voltage25 V (DC)
Size0402 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1 mm
Width0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Height0.5 mm
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance150 pF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0402 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1 mm
Width0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Height0.5 mm
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance4.7 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0402 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1 mm
Width0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Height0.5 mm
WCAP-CSGP MLCCs 10 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 µF
Capacitance±20% 
Rated Voltage10 V (DC)
Size0402 
Operating Temperature -55 °C up to +85 °C
Dissipation Factor15 %
Insulation Resistance0.05 GΩ
Ceramic TypeX5R Class II 
Length1 mm
Width0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Height0.5 mm
WCAP-CSGP MLCCs 10 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance2.2 µF
Capacitance±20% 
Rated Voltage10 V (DC)
Size0402 
Operating Temperature -55 °C up to +85 °C
Dissipation Factor10 %
Insulation Resistance0.05 GΩ
Ceramic TypeX5R Class II 
Length1 mm
Width0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Height0.5 mm
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Capacitance±20% 
Rated Voltage25 V (DC)
Size0402 
Operating Temperature -55 °C up to +85 °C
Dissipation Factor10 %
Insulation Resistance5 GΩ
Ceramic TypeX5R Class II 
Length1 mm
Width0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Height0.5 mm
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance470 nF
Capacitance±10% 
Rated Voltage25 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor10 %
Insulation Resistance1.1 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
Height0.8 mm
WCAP-CSGP MLCCs 10 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance22 µF
Capacitance±20% 
Rated Voltage10 V (DC)
Size0805 
Operating Temperature -55 °C up to +85 °C
Dissipation Factor10 %
Insulation Resistance0.005 GΩ
Ceramic TypeX5R Class II 
Length2 mm
Width1.25 mm
Pad Dimension0.5 mm
Packaging7" Tape & Reel 
Height1.25 mm
WE-XHMI SMT Power Inductor, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
DC Resistance17.6 mΩ
Size6060 
Operating Temperature -40 °C up to +125 °C
Length6.65 mm
Width6.45 mm
Inductance6.8 µH
Performance Rated Current8.1 A
Saturation Current @ 30%11.3 A
DC Resistance17.6 mΩ
Self Resonant Frequency22 MHz
Operating Voltage120 V
MountSMT 
Saturation Current @ 10%5.65 A
DC Resistance0.01936 Ω
Rated Current6500 mA
Height6.1 mm
WCAP-CSGP MLCCs 100 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance8.2 pF
Capacitance±0.5pF 
Rated Voltage100 V (DC)
Size0402 
Operating Temperature -55 °C up to +125 °C
Q-Factor564 %
Insulation Resistance10 GΩ
Ceramic TypeNP0 Class I 
Length1 mm
Width0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Height0.5 mm
WE-CBA SMT EMI Suppression Ferrite Bead, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
DC Resistance50 mΩ
Size0603 
Operating Temperature -55 °C up to +125 °C
Length1.6 mm
Width0.8 mm
Pad Dimension0.3 mm
MountSMT 
Impedance @ 100 MHz120 Ω
Maximum Impedance180 Ω
Maximum Impedance400 MHz 
TypeHigh Current 
Rated Current2000 mA
Height0.8 mm