IC-Hersteller Texas Instruments
IC-Hersteller (103)
- Alle Hersteller
Analog Devices
Infineon Technologies
Microchip
Onsemi
Renesas
ROHM
STMicroelectronics
Texas Instruments
- 3peak incorporated (28)
- Ablic (24)
- Acco Semiconductor (1)
- Advanced Power (4)
- Allegro Microsystems (95)
- Alpha & Omega Semiconductor (37)
- AnalogySemi (3)
- AnDAPT Inc (184)
- Anpec (13)
- AXElite (2)
- Backward (6)
- Bright Power Semiconductor (1)
- Broadcom (47)
- Cambridge GaN Devices (22)
- Chipanalog Micro (10)
- Cologne Chips (1)
- Convenient Power (1)
- Dialog Semiconductor (12)
- Diodes Incorporated (239)
- Divimath (8)
- Elmos AG (1)
- EPC (128)
- e-Peas Semiconductors (1)
- Eta Solutions Co. Ltd. (9)
- GaN Systems (8)
- GaNPower (3)
- Giantec (1)
- Gstek Wuxi (1)
- Helix Semiconductor (7)
- Ikanos (3)
- IKON (1)
- Indie Semiconductor (8)
- Innovision Semiconductor Inc (2)
- Intel (80)
- Inventchip Technology (3)
- ISSI (51)
- JoulWatt (20)
- KDPOF (3)
- Kinetic Technology (10)
- Lattice semiconductor Corporation (20)
- Littelfuse (1)
- Lumissil Microsystems (8)
- M3 Technology (M3Tek) (7)
- Macnica (22)
- Marvell Semiconductor (1)
- MaxLinear (178)
- Menlo Micro (1)
- MikroE (19)
- MindCet (2)
- Monolithic Power Systems (946)
- Navitas Semiconductor Inc (6)
- NewEdge Technologies, Inc. (1)
- Nexperia (34)
- Nisshinbo Micro Device Inc. (10)
- Novosense Micro (1)
- NXP (321)
- O2 Micro International Ltd (10)
- On Bright (7)
- Panasonic (2)
- PN Junction Semiconductor (2)
- Power Integrations (114)
- Powermat (1)
- Pulsiv (19)
- Qorvo (95)
- Realsil SuRealsil(tek) Microelectronics (1)
- Richtek (297)
- Sanken Electric Co., Ltd. (16)
- Sckipio (6)
- Semtech (90)
- SG-Micro (33)
- Silanna Semiconductor (9)
- Silergy Corporation (30)
- Silicon Laboratory Inc. (105)
- Silicontent Technology (59)
- Silvertel (60)
- Skycore Semiconductors (1)
- Skyworks (33)
- Southchip (8)
- Summit Wireless (1)
- Tagore Tech (7)
- Taiwan Semiconductor (1)
- TDK Corporation (1)
- Tempo Semiconductor (1)
- Torex (37)
- Toshiba (25)
- Transphorm (21)
- TransSIP (2)
- Union (21)
- uPI Semiconductor (2)
- Valens Semiconductor (30)
- Wise Integration (1)
- Wolfspeed (17)
- Xilinx (22)
- XL Semiconductor (3)
- XYSemi (62)
Details
| Topologie | Sonstige Topologie |
| IC-Revision | C |
Beschreibung
The TMDS243 evaluation module (EVM) is a standalone test and development platform for evaluating AM243x functionality and developing prototypes for a variety of applications. TMDS243EVM is equipped with the larger form factor Sitara™ AM2434 ALV microcontroller unit (MCU) and additional components that allow the user to make use of the security features on the MCU, as well as various device interfaces, including industrial Ethernet, standard Ethernet, peripheral component interconnect express (PCIe), fast serial interface (FSI) and others to easily create prototypes. This EVM provides a larger peripheral set than the LP-AM243 LaunchPad™ as it is equipped with the larger form factor AM243 ALV package.An onboard display makes use of AM243x serial peripheral interface (SPI) ports to provide the ability for local visual outputs in addition to the LEDs. Onboard current-measurement capabilities are available to monitor power consumption for power-conscious applications.The supplied USB cable, paired with embedded emulation logic, allows for emulation and debugging using standard development tools, such as the Code Composer Studio™ integrated development environment (IDE) (CCSTUDIO).Note that TMDS243EVM is the newest version of TMS243GPEVM. TMDS243EVM includes high-security field-securable (HS-FS) silicon to customize keys and encryption for security applicationsFeaturesThree RJ45 Ethernet ports capable of 1Gb or 100Mb speedsReal-time, low-pin-count FSI interface for easy connection with C2000™ MCUs1-in display and LEDs for convenient visual outputsFour-lane PCIe connector to interface one-lane PCIe cardOnboard power-measurement capabilities
Typische Anwendungen
- test and development platform for evaluating AM243x functionality
Weiterführende Informationen
Artikeldaten
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | RDC (mΩ) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q (%) | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | Verpackung | L (µH) | IRP,40K (A) | ISAT,30% (A) | RDC typ. (mΩ) | fres (MHz) | VOP (V) | Montageart | ISAT,10% (A) | Material | Z @ 100 MHz (Ω) | Zmax (Ω) | Testbedingung Zmax | IR 2 (mA) | RDC max. (Ω) | Typ | IR (mA) | Z @ 1 GHz (Ω) | H (mm) | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 150060VS75000 | SPEC | 7 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WL-SMCW SMT Mono-color Chip LED Waterclear | 570 | Hellgrün | 572 | 40 | 2 | AlInGaP | 140 | – | – | – | – | 0603 | -40 °C up to +85 °C | – | – | – | – | 1.6 | 0.8 | – | Tape and Reel | – | – | – | – | – | – | SMT | – | – | – | – | – | – | – | – | – | – | 0.7 | ||
 | 150080VS75000 | SPEC | 7 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WL-SMCW SMT Mono-color Chip LED Waterclear | 570 | Hellgrün | 572 | 40 | 2 | AlInGaP | 140 | – | – | – | – | 0805 | -40 °C up to +85 °C | – | – | – | – | 2 | 1.25 | – | Tape and Reel | – | – | – | – | – | – | SMT | – | – | – | – | – | – | – | – | – | – | 0.7 | ||
 | 150060RS55040 | SPEC | 25 Dateien Strahldaten
| Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WL-SMCD SMT Mono-color Chip LED Diffused | 624 | Rot | 632 | 90 | 2 | AlInGaP | 140 | – | – | – | – | 0603 | -40 °C up to +85 °C | – | – | – | – | 1.6 | 0.8 | – | Tape and Reel | – | – | – | – | – | – | SMT | – | – | – | – | – | – | – | – | – | – | 0.4 | ||
| 150080RS75000 | SPEC | 7 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WL-SMCW SMT Mono-color Chip LED Waterclear | 625 | Rot | 630 | 150 | 2 | AlInGaP | 140 | – | – | – | – | 0805 | -40 °C up to +85 °C | – | – | – | – | 2 | 1.25 | – | Tape and Reel | – | – | – | – | – | – | SMT | – | – | – | – | – | – | – | – | – | – | 0.7 | ||
 | 742792780 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-CBF SMT-Ferrit | – | – | – | – | – | – | – | – | – | – | – | 0402 | -55 °C up to +125 °C | – | – | – | – | 1 | 0.5 | 0.25 | – | – | – | – | – | – | – | SMT | – | – | 220 | 360 | 450 MHz | 900 | 0.35 | Breitband | 300 | 200 | 0.5 | ||
 | 74279228260 | SPEC | 10 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-MPSB EMI Multilayer Power Suppression Bead | – | – | – | – | – | – | – | – | – | – | – | 0603 | -55 °C up to +125 °C | – | – | – | – | 1.6 | 0.8 | 0.3 | – | – | – | – | 5 | – | – | SMT | – | – | 26 | 39 | 515 MHz | 6500 | 0.008 | Hochstrom | 6500 | 33 | 0.8 | ||
 | 74438336100 | SPEC | 10 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-MAPI SMT-Speicherdrossel | – | – | – | – | – | – | – | – | – | – | – | 3020 | -40 °C up to +125 °C | – | – | – | – | 3 | 3 | – | – | 10 | 1.65 | 3 | 280 | 18 | 80 | SMT | 1.55 | – | – | – | – | – | 0.322 | – | 1200 | – | 2 | ||
 | 744316100 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-HCI SMT-Hochstrominduktivität | – | – | – | – | – | – | – | 4.75 | – | – | – | 5040 | -40 °C up to +150 °C | – | – | – | – | 5.5 | 5.3 | – | – | 1 | 14.8 | 11.5 | – | 158 | – | SMT | 5.5 | Superflux | – | – | – | – | 0.005225 | – | – | – | 4 | ||
 | 744373460047 | SPEC Anstehende PCNAufgrund einer anstehenden PCN wird in Kürze eine Änderung am Bauteil durchgeführt. Anbei finden Sie die entsprechende PCN. Bei weiteren Fragen wenden Sie sich bitte an Ihren Vertriebsmitarbeiter. | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-LHMI SMT Speicherdrossel | – | – | – | – | – | – | – | – | – | – | – | 7030 | -40 °C up to +125 °C | – | – | – | – | 7.3 | 6.6 | – | – | 0.47 | 16.6 | 37.8 | 4 | 91 | 120 | SMT | 21.4 | – | – | – | – | – | 0.0042 | – | 11500 | – | 2.8 | ||
 | 885012005025 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 16 V(DC) | – | – | – | – | – | – | – | – | 10 pF | ±5% | 16 | 0402 | -55 °C up to +125 °C | 600 | – | 10 GΩ | NP0 Klasse I | 1 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 0.5 | ||
| 885012005041 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | – | 15 pF | ±5% | 25 | 0402 | -55 °C up to +125 °C | 700 | – | 10 GΩ | NP0 Klasse I | 1 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 0.5 | ||
| 885012005058 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | – | 33 pF | ±5% | 50 | 0402 | -55 °C up to +125 °C | 1000 | – | 10 GΩ | NP0 Klasse I | 1 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 0.5 | ||
| 885012205050 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | – | 10 nF | ±10% | 25 | 0402 | -55 °C up to +125 °C | – | 3.5 | 10 GΩ | X7R Klasse II | 1 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 0.5 | ||
| 885012205051 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | – | 15 nF | ±10% | 25 | 0402 | -55 °C up to +125 °C | – | 3.5 | 10 GΩ | X7R Klasse II | 1 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 0.5 | ||
| 885012205056 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | – | 150 pF | ±10% | 50 | 0402 | -55 °C up to +125 °C | – | 2.5 | 10 GΩ | X7R Klasse II | 1 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 0.5 | ||
| 885012205065 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | – | 4.7 nF | ±10% | 50 | 0402 | -55 °C up to +125 °C | – | 2.5 | 10 GΩ | X7R Klasse II | 1 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 0.5 | ||
| 885012105012 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 10 V(DC) | – | – | – | – | – | – | – | – | 1 µF | ±20% | 10 | 0402 | -55 °C up to +85 °C | – | 15 | 0.05 GΩ | X5R Klasse II | 1 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 0.5 | ||
| 885012105013 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 10 V(DC) | – | – | – | – | – | – | – | – | 2.2 µF | ±20% | 10 | 0402 | -55 °C up to +85 °C | – | 10 | 0.05 GΩ | X5R Klasse II | 1 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 0.5 | ||
| 885012105018 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | – | 100 nF | ±20% | 25 | 0402 | -55 °C up to +85 °C | – | 10 | 5 GΩ | X5R Klasse II | 1 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 0.5 | ||
| 885012206075 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | – | 470 nF | ±10% | 25 | 0603 | -55 °C up to +125 °C | – | 10 | 1.1 GΩ | X7R Klasse II | 1.6 | 0.8 | 0.4 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 0.8 | ||
| 885012107011 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 10 V(DC) | – | – | – | – | – | – | – | – | 22 µF | ±20% | 10 | 0805 | -55 °C up to +85 °C | – | 10 | 0.005 GΩ | X5R Klasse II | 2 | 1.25 | 0.5 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 1.25 | ||
 | 74439346068 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-XHMI SMT Speicherdrossel | – | – | – | – | – | – | – | 17.6 | – | – | – | 6060 | -40 °C up to +125 °C | – | – | – | – | 6.65 | 6.45 | – | – | 6.8 | 8.1 | 11.3 | 17.6 | 22 | 120 | SMT | 5.65 | – | – | – | – | – | 0.01936 | – | 6500 | – | 6.1 | ||
| 885012005085 | SPEC | 7 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 100 V(DC) | – | – | – | – | – | – | – | – | 8.2 pF | ±0.5pF | 100 | 0402 | -55 °C up to +125 °C | 564 | – | 10 GΩ | NP0 Klasse I | 1 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 0.5 | ||
 | 782631141 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-CBA SMT EMI Suppression Ferrite Bead | – | – | – | – | – | – | – | 50 | – | – | – | 0603 | -55 °C up to +125 °C | – | – | – | – | 1.6 | 0.8 | 0.3 | – | – | – | – | – | – | – | SMT | – | – | 120 | 180 | 400 MHz | – | – | High Current | 2000 | – | 0.8 |
| Artikel Nr. | Datenblatt | Simulation | |
|---|---|---|---|
| 150060VS75000 | SPEC | |
| 150080VS75000 | SPEC | |
| 150060RS55040 | SPEC | |
| 150080RS75000 | SPEC | |
| 742792780 | SPEC | |
| 74279228260 | SPEC | |
| 74438336100 | SPEC | |
| 744316100 | SPEC | |
| 744373460047 | SPEC Anstehende PCNAufgrund einer anstehenden PCN wird in Kürze eine Änderung am Bauteil durchgeführt. Anbei finden Sie die entsprechende PCN. Bei weiteren Fragen wenden Sie sich bitte an Ihren Vertriebsmitarbeiter. | |
| 885012005025 | SPEC | |
| 885012005041 | SPEC | |
| 885012005058 | SPEC | |
| 885012205050 | SPEC | |
| 885012205051 | SPEC | |
| 885012205056 | SPEC | |
| 885012205065 | SPEC | |
| 885012105012 | SPEC | |
| 885012105013 | SPEC | |
| 885012105018 | SPEC | |
| 885012206075 | SPEC | |
| 885012107011 | SPEC | |
| 74439346068 | SPEC | |
| 885012005085 | SPEC | |
| 782631141 | SPEC |
| Muster |
|---|
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | RDC (mΩ) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q (%) | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | Verpackung | L (µH) | IRP,40K (A) | ISAT,30% (A) | RDC typ. (mΩ) | fres (MHz) | VOP (V) | Montageart | ISAT,10% (A) | Material | Z @ 100 MHz (Ω) | Zmax (Ω) | Testbedingung Zmax | IR 2 (mA) | RDC max. (Ω) | Typ | IR (mA) | Z @ 1 GHz (Ω) | H (mm) | Muster |
|---|
