IC manufacturers EPC

IC manufacturers (103)

EPC EPC2304 | Demoboard EPC9196

Overview

TopologyPositive to Negative Converter
Input voltage30-170 V
IC revision1.0

Description

The EPC9196 evaluation board is a 3-phase BLDC motor drive inverter board featuring the EPC2304 GaN FET 11 (5.0 mΩ maximum RDS(on), 200 V maximum device voltage) intended for 150 V batteries. The EPC9196 can deliver up to 35 Apk (25 ARMS) maximum output current. The board supports PWM switching frequencies up to 150 kHz in motor drive applications.The EPC9196 contains all the necessary critical functions circuits to support a complete motor drive inverter including regulated auxiliary power rails for housekeeping supplies, voltage, and temperature sense, accurate current sense, and protection functions.The EPC9196 mates with an assortment of compatible controllers, supported by various manufacturers leveraging existing resources for quick development purposes, that can quickly be configured as a motor drive inverter.

Features

3-phase inverter based with wide input DC voltage ranging from 30 V to 170 VDimensions: L x W = 130 x 100 mm (including connector)Low distortion switching that keeps motor audio emission low and reduces torque rippledv/dt optimized for motor drives less than 10 V/nsAll current sense with high accuracy and bandwidthAll phases voltage senseVoltage sense for the DC supply to the driveHousekeeping power for the various circuits and external controller derived from the main power supply to the EPC9196Temperature monitoring circuitProtection features including: over-current and input supply under voltage lockoutShaft encoder/Hall sensors interface connector for motor drive application with two voltage levels selection option

Typical applications

  • BLDC Motor Drives_Robotics
  • BLDC Motor Drives_Drones
  • BLDC Motor Drives_e-Mobility

Products

Order Code
Data­sheet
Simu­lation
Downloads
Status
Product series
λDom typ.(nm)
Emitting Color
λPeak typ.(nm)
IV typ.(mcd)
VF typ.(V)
Chip Technology
50% typ.(°)
C
Tol. C
VR(V (DC))
Size
Operating Temperature
DF(%)
RISO
Ceramic Type
L(mm)
W(mm)
Fl(mm)
Packaging
L(µH)
IR(mA)
ISAT(A)
RDC(mΩ)
fres(MHz)
Version
Ø ID(mm)
Qty.
κ(W/(m*K))
Reinforced
Color
IRIPPLE(mA)
ILeak(µA)
RESR(mΩ)
Ø D(mm)
f
Mount
Center Contact
Pins
Working Voltage(V (AC))
H(mm)
Ø OD(mm)
IR(mA)
Ti
Tl(mm)
Z @ 100 MHz(Ω)
Zmax(Ω)
Test Condition Zmax
IR 2(mA)
RDC max.(Ω)
Type
Samples
WL-SMCW SMT Mono-color Chip LED Waterclear, 470 nm, Blue
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Dominant Wavelength [typ.]470 nm
Emitting ColorBlue 
Peak Wavelength [typ.]465 nm
Luminous Intensity [typ.]150 mcd
Forward Voltage [typ.]3.2 V
Chip TechnologyInGaN 
Viewing Angle Phi 0° [typ.]140 °
Size0603 
Operating Temperature -40 °C up to +85 °C
Length1.6 mm
Width0.8 mm
MountSMT 
Height0.25 mm
WL-SMCW SMT Mono-color Chip LED Waterclear, 570 nm, Bright Green
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Dominant Wavelength [typ.]570 nm
Emitting ColorBright Green 
Peak Wavelength [typ.]572 nm
Luminous Intensity [typ.]50 mcd
Forward Voltage [typ.]2 V
Chip TechnologyAlInGaP 
Viewing Angle Phi 0° [typ.]140 °
Size0603 
Operating Temperature -40 °C up to +85 °C
Length1.6 mm
Width0.8 mm
MountSMT 
Height0.25 mm
WL-SMCW SMT Mono-color Chip LED Waterclear, 590 nm, Yellow
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Dominant Wavelength [typ.]590 nm
Emitting ColorYellow 
Peak Wavelength [typ.]595 nm
Luminous Intensity [typ.]130 mcd
Forward Voltage [typ.]2 V
Chip TechnologyAlInGaP 
Viewing Angle Phi 0° [typ.]140 °
Size0603 
Operating Temperature -40 °C up to +85 °C
Length1.6 mm
Width0.8 mm
MountSMT 
Height0.25 mm
WE-CBF SMT EMI Suppression Ferrite Bead, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Size0805 
Operating Temperature -55 °C up to +125 °C
Length2 mm
Width1.2 mm
Pad Dimension0.5 mm
Rated Current200 mA
VersionSMT 
Packaging Unit4000 
MountSMT 
Height0.9 mm
Rated Current200 mA
Impedance @ 100 MHz2200 Ω
Maximum Impedance3000 Ω
Maximum Impedance80 MHz 
Rated Current 2800 mA
DC Resistance0.6 Ω
TypeWide Band 
WE-LQS SMT Power Inductor, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Size4012 
Operating Temperature -40 °C up to +125 °C
Length4 mm
Width4 mm
Inductance10 µH
Rated Current1320 mA
Saturation Current1 A
DC Resistance168 mΩ
Self Resonant Frequency38 MHz
Packaging Unit4500 
MountSMT 
Height1.2 mm
WCAP-CSGP MLCCs 16 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Capacitance±10% 
Rated Voltage16 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3.5 %
Insulation Resistance5 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
Packaging Unit4000 
Height0.8 mm
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance2.2 µF
Capacitance±10% 
Rated Voltage25 V (DC)
Size0805 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor10 %
Insulation Resistance0.05 GΩ
Ceramic TypeX7R Class II 
Length2 mm
Width1.25 mm
Pad Dimension0.5 mm
Packaging7" Tape & Reel 
Packaging Unit3000 
Height1.25 mm
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0805 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length2 mm
Width1.25 mm
Pad Dimension0.5 mm
Packaging7" Tape & Reel 
Packaging Unit4000 
Height0.8 mm
WA-SMSI SMT Steel Spacer with internal Thread M2, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Operating Temperature -55 °C up to +150 °C
Length1 mm
PackagingTape and Reel 
Inner Diameter2.8 mm
Packaging Unit1500 
Outer Diameter4.35 mm
Inner ThreadM2 
WR-PHD Pin Header - Single, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Operating Temperature -40 °C up to +105 °C
Insulation Resistance1000 MΩ
Length5.08 mm
PackagingBag 
Rated Current3000 mA
MountTHT 
Pins
Working Voltage250 V (AC)
TypeStraight 
WCAP-CSGP MLCCs 100 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Capacitance±10% 
Rated Voltage100 V (DC)
Size0805 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Insulation Resistance1 GΩ
Ceramic TypeX7R Class II 
Length2 mm
Width1.25 mm
Pad Dimension0.5 mm
Packaging7" Tape & Reel 
Packaging Unit3000 
Height1.25 mm
WP-SMBU REDCUBE SMT with internal through-hole thread, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Operating Temperature -55 °C up to +150 °C
PackagingTape and Reel 
Rated Current70000 mA
Packaging Unit600 
MountSMT 
Height5 mm
Outer Diameter9 mm
Rated Current70000 mA
Inner ThreadM5 
Thread Length6 mm
WE-PD SMT Power Inductor, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Size7345 
Operating Temperature -40 °C up to +150 °C
Length7.3 mm
Width7.3 mm
Inductance680 µH
Rated Current360 mA
Saturation Current0.46 A
Self Resonant Frequency2.3 MHz
VersionPerformance 
Packaging Unit1000 
MountSMT 
Height4.5 mm
Rated Current360 mA
DC Resistance2.3 Ω
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0805 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Insulation Resistance5 GΩ
Ceramic TypeX7R Class II 
Length2 mm
Width1.25 mm
Pad Dimension0.5 mm
Packaging13" Tape & Reel 
Height0.8 mm
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance10000 pF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Pad Dimension0.4 mm
Packaging13" Tape & Reel 
Height0.8 mm
WR-MMCX PCB THT/SMT, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Product seriesWR-MMCX PCB THT/SMT
Operating Temperature -55 °C up to +155 °C
Insulation Resistance1000 MΩ
PackagingTape and Reel with Film 
Packaging Unit1000 
Frequency RangeDC~6 GHz 
MountSMT 
Center ContactØ 0.7 
Working Voltage170 V (AC)
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3 %
Insulation Resistance5 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Pad Dimension0.4 mm
Packaging13" Tape & Reel 
Height0.8 mm
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Pad Dimension0.4 mm
Packaging13" Tape & Reel 
Height0.8 mm
WCAP-CSGP MLCCs 10 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance22 µF
Capacitance±20% 
Rated Voltage10 V (DC)
Size0603 
Operating Temperature -55 °C up to +85 °C
Dissipation Factor20 %
Insulation Resistance0.002 GΩ
Ceramic TypeX5R Class II 
Length1.6 mm
Width0.8 mm
Packaging7" Tape & Reel 
Height0.8 mm
WE-TGF Thermal Gap Filler Pad, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Operating Temperature -50 °C up to +150 °C
Length200 mm
Width400 mm
Thermal Conductivity6 W/(m*K)
ReinforcedNo 
ColorGrey 
Height0.5 mm
WCAP-HSAH Advanced High Temperature 125°C, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance220 µF
Capacitance±20% 
Rated Voltage25 V (DC)
Operating Temperature -55 °C up to +125 °C
Dissipation Factor14 %
Length10.5 mm
Width8.3 mm
Packaging15" Tape & Reel 
Ripple Current1600 mA
Leakage Current55 µA
ESR27 mΩ
Diameter8 mm
MountV-Chip SMT