Topologie | Inverswandler |
Eingangsspannung | 30-170 V |
IC-Revision | 1.0 |
The EPC9196 evaluation board is a 3-phase BLDC motor drive inverter board featuring the EPC2304 GaN FET 11 (5.0 mΩ maximum RDS(on), 200 V maximum device voltage) intended for 150 V batteries. The EPC9196 can deliver up to 35 Apk (25 ARMS) maximum output current. The board supports PWM switching frequencies up to 150 kHz in motor drive applications.The EPC9196 contains all the necessary critical functions circuits to support a complete motor drive inverter including regulated auxiliary power rails for housekeeping supplies, voltage, and temperature sense, accurate current sense, and protection functions.The EPC9196 mates with an assortment of compatible controllers, supported by various manufacturers leveraging existing resources for quick development purposes, that can quickly be configured as a motor drive inverter.
3-phase inverter based with wide input DC voltage ranging from 30 V to 170 VDimensions: L x W = 130 x 100 mm (including connector)Low distortion switching that keeps motor audio emission low and reduces torque rippledv/dt optimized for motor drives less than 10 V/nsAll current sense with high accuracy and bandwidthAll phases voltage senseVoltage sense for the DC supply to the driveHousekeeping power for the various circuits and external controller derived from the main power supply to the EPC9196Temperature monitoring circuitProtection features including: over-current and input supply under voltage lockoutShaft encoder/Hall sensors interface connector for motor drive application with two voltage levels selection option
Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | W (mm) | To | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | DF (%) | RISO | Keramiktyp | L (mm) | Fl (mm) | L (µH) | ISAT (A) | RDC (mΩ) | fres (MHz) | Version | Ø ID (mm) | VPE | κ (W/(m*K)) | Verstärkung | Farbe | IRIPPLE (mA) | ILeak (µA) | RESR (mΩ) | Ø D (mm) | f | Montageart | Mittelkontakt | H (mm) | Ø OD (mm) | IR 1 (mA) | Ti | Tl (mm) | Z @ 100 MHz (Ω) | Zmax (Ω) | Testbedingung Zmax | IR 2 (mA) | RDC max. (Ω) | Typ | Pins (pcs) | Reihen | Gender | IR (mA) | Verpackung | Muster | |
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![]() | 885012207128 | SPEC | 7 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 100 V(DC) | – | – | – | – | – | – | – | 1.25 | – | 100 nF | ±10% | 100 | 0805 | -55 °C up to +125 °C | 2.5 | 1 GΩ | X7R Klasse II | 2 | 0.5 | – | – | – | – | – | – | 3000 | – | – | – | – | – | – | – | – | – | – | 1.25 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 7" Tape & Reel | ||
![]() | 7466005R | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WP-SMBU REDCUBE SMT with internal through-hole thread | – | – | – | – | – | – | – | – | – | – | – | – | – | -55 °C up to +150 °C | – | – | – | – | – | – | – | – | – | – | – | 600 | – | – | – | – | – | – | – | – | SMT | – | 5 | 9 | 70000 | M5 | 6 | – | – | – | – | – | – | – | – | – | 70000 | Tape and Reel | |
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![]() | 885012206095R | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | 0.8 | – | 100 nF | ±10% | 50 | 0603 | -55 °C up to +125 °C | 3 | 5 GΩ | X7R Klasse II | 1.6 | 0.4 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 0.8 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 13" Tape & Reel | ||
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![]() | 40006005 | SPEC | – | 3 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-TGF Wärmeleitfähiges Füllstoffpolster | – | – | – | – | – | – | – | 400 | – | – | – | – | – | -50 °C up to +150 °C | – | – | – | 200 | – | – | – | – | – | – | – | – | 6 | Nein | Grau | – | – | – | – | – | – | – | 0.5 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | |
![]() | 875585553004 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-HSAH Advanced High Temperature 125°C | – | – | – | – | – | – | – | 8.3 | – | 220 µF | ±20% | 25 | – | -55 °C up to +125 °C | 14 | – | – | 10.5 | – | – | – | – | – | – | – | – | – | – | – | 1600 | 55 | 27 | 8 | – | V-Chip SMT | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 15" Tape & Reel |
Muster |
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Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | W (mm) | To | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | DF (%) | RISO | Keramiktyp | L (mm) | Fl (mm) | L (µH) | ISAT (A) | RDC (mΩ) | fres (MHz) | Version | Ø ID (mm) | VPE | κ (W/(m*K)) | Verstärkung | Farbe | IRIPPLE (mA) | ILeak (µA) | RESR (mΩ) | Ø D (mm) | f | Montageart | Mittelkontakt | H (mm) | Ø OD (mm) | IR 1 (mA) | Ti | Tl (mm) | Z @ 100 MHz (Ω) | Zmax (Ω) | Testbedingung Zmax | IR 2 (mA) | RDC max. (Ω) | Typ | Pins (pcs) | Reihen | Gender | IR (mA) | Verpackung | Muster |
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