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STMicroelectronics L99DZ200G | Demoboard AEK-MOT-TK200G1

Getting started with the AEK-MOT-TK200G1 evaluation board for car opening/ closing systems

Overview

TopologyMotor Drive
IC revision1

Description

The AEK-MOT-TK200G1 evaluation board has been developed to drive the opening/closing systems of the car power lift gates,ensuring high levels of safety and reliability.The board offers the possibility of driving three different motors. Two motors raise and lower the car tailgate, while the third motor locks the trunk.The board also allows driving two different high input capacity loads, that is, two strings of LEDs. One string lights up the interior of the trunk when it is open, while the other one lights up the car license plate.The AEK-MOT-TK200G1 evaluation board can be used as a small ECU that meets the typical requirements of a car lift gate.The board hosts:-a Chorus 1M ASIL-B microcontroller (SPC582B60E1), which communicates with the multimotor driver (L99DZ200G)through the SPI;-an L99DZ200G device that controls all the loads connected to the board;-a CAN connector that allows a domain controller to interact remotely with the AEK-MOT-TK200G1.Moreover, to support DC motor positioning and increase actuation safety, a circuitry for the current sensing of the L99DZ200G H-bridges outputs has been added. On the board, this circuit is coupled by two connectors dedicated to Hall sensor feedback coming from the motors. These two features can be combined or used alternatively.To achieve a higher level of safety, a service key mechanism is provided. This mechanism consists of a continuouscommunication interaction between the MCU and the L99DZ200G chip. This safety feature is concurrent with all the other communications between the MCU and the L99DZ200G.For a proper management of the L99DZ200G, the service key mechanism must be satisfied within a configurable temporal window. When the service key fails, the L99DZ200G switches off all the outputs and enters the fail-safe mode. The service key temporal window can be configured in real-time, too.

Features

  • AEC-Q100 qualified
  • High performance e200z2 single core:
  • 32-bit Power Architecture technology CPU
  • Core frequency up to 80 MHz
  • 1088 KB (1024 KB code flash memory + 64 KB data flash) on-chip flash memory: supports reading during program and erase operations, and multiple blocks allow performing the EEPROM emulation
  • 96 KB on-chip general-purpose SRAM
  • Comprehensive new generation ASIL-B safety concept:
  • ASIL-B of ISO 26262
  • FCCU for collection and reaction to failure notifications
  • Memory error management unit (MEMU) for collection and reporting of error events in the memories
  • One enhanced 12-bit SAR analog-to-digital converter unit:
  • up to 27 channels (two channels for the power lift gate application to monitor the linear actuator position)
  • enhanced diagnostic features (such as current sensing current monitoring)
  • Seven CAN interfaces
  • Four serial peripheral interface (DSPI) modules (a DSPI is used for the communication between the MCUand the L99DZ200G chip).

Typical applications

  • Power liftgate

Parts approved by STMicroelectronics

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Product series
Pins
Application
PCB/Cable/Panel
Modularity
Type
Wire Section
λDom typ.(nm)
Emitting Color
λPeak typ.(nm)
IV typ.(mcd)
VF typ.(V)
Chip Technology
2θ50% typ.(°)
Gender
Contact Plating
IR(A)
Working Voltage(V (AC))
Contact Resistance(mΩ)
Packaging
Qty.(pcs)
Stranded Wire Section (AWG)
Stranded Wire Section (Metric)
f
Tol. f
Stability(ppm)
Cload(pF)
Operating Temperature
C
Tol. C
VR(V (DC))
Size
DF(%)
RISO
L(mm)
W(mm)
Fl(mm)
Ceramic Type
Q
SW(mm)
Ti
Flammability Rating
Endurance(h)
IRIPPLE(mA)
Z(mΩ)
ILeak(µA)
Ø D(mm)
Version
Mount
Color
Polarity
IR(A)
H(mm)
Operation Force(g)
Electrical Life(Cycles)
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Vaporphase process
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Contact PlatingGold 
Rated Current3 A
Working Voltage250 V (AC)
Contact Resistance20 mΩ
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Length2.44 mm
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Insulation Resistance1000 MΩ
Length5.6 mm
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TypeHorizontal Cable Entry 
Wire Section 14 to 30 (AWG) 2.08 to 0.0509 (mm²)
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Contact PlatingTin over Nickel 
Rated Current14 A
Working Voltage250 V (AC)
Contact Resistance20 mΩ
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Stranded Wire Section (AWG)14 to 30 (AWG) 
Stranded Wire Section (Metric)2.08 to 0.0509 (mm²) 
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Rated Current3 A
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Contact Resistance20 mΩ
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Length5.08 mm
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Rated Current3 A
Working Voltage250 V (AC)
Contact Resistance20 mΩ
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Insulation Resistance1000 MΩ
Length5.08 mm
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ModularityYes 
TypeHorizontal 
Wire Section 22 to 14 (AWG) 0.75 to 1.5 (mm²)
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Rated Current17.5 A
Working Voltage250 V (AC)
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Stranded Wire Section (AWG)22 to 14 (AWG) 
Stranded Wire Section (Metric)0.75 to 1.5 (mm²) 
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Length10 mm
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Rated Current3 A
Working Voltage250 V (AC)
Contact Resistance20 mΩ
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Insulation Resistance1000 MΩ
Length7.62 mm
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ColorBeige 
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Rated Current3 A
Working Voltage250 V (AC)
Contact Resistance20 mΩ
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Insulation Resistance1000 MΩ
Length7.62 mm
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Product seriesWR-BHD 2.54 mm Male
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TypeStraight 
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Contact PlatingGold 
Rated Current3 A
Working Voltage250 V (AC)
Contact Resistance20 mΩ
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Insulation Resistance1000 MΩ
Length25.44 mm
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VersionLow Profile 
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Dominant Wavelength [typ.]625 nm
Emitting ColorRed 
Peak Wavelength [typ.]630 nm
Luminous Intensity [typ.]150 mcd
Forward Voltage [typ.]2 V
Chip TechnologyAlInGaP 
Viewing Angle Phi 0° [typ.]140 °
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PackagingTape and Reel 
Packaging Unit4000 pcs
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Operating Temperature -40 °C up to +85 °C
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Size0805 
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Length2 mm
Width1.25 mm
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Dominant Wavelength [typ.]590 nm
Emitting ColorYellow 
Peak Wavelength [typ.]595 nm
Luminous Intensity [typ.]120 mcd
Forward Voltage [typ.]2 V
Chip TechnologyAlInGaP 
Viewing Angle Phi 0° [typ.]140 °
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PackagingTape and Reel 
Packaging Unit4000 pcs
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Width1.25 mm
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SPECWL-SMCW SMT Mono-color Chip LED Waterclear, –, –
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Dominant Wavelength [typ.]525 nm
Emitting ColorGreen 
Peak Wavelength [typ.]515 nm
Luminous Intensity [typ.]450 mcd
Forward Voltage [typ.]3.2 V
Chip TechnologyInGaN 
Viewing Angle Phi 0° [typ.]140 °
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PackagingTape and Reel 
Packaging Unit4000 pcs
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Size0805 
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Length2 mm
Width1.25 mm
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SPECWL-SMCW SMT Mono-color Chip LED Waterclear, –, –
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Dominant Wavelength [typ.]470 nm
Emitting ColorBlue 
Peak Wavelength [typ.]465 nm
Luminous Intensity [typ.]145 mcd
Forward Voltage [typ.]3.2 V
Chip TechnologyInGaN 
Viewing Angle Phi 0° [typ.]140 °
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PackagingTape and Reel 
Packaging Unit4000 pcs
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Size0805 
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Length2 mm
Width1.25 mm
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Height0.7 mm
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Packaging15" Tape & Reel 
Packaging Unit900 pcs
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Operating Temperature -55 °C up to +105 °C
Capacitance47 µF
Capacitance±20% 
Rated Voltage50 V (DC)
Size6.3 x 7.7 
Dissipation Factor12 %
Insulation Resistance2.12766 MΩ
Length7.7 mm
Width6.6 mm
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Endurance 2000
Ripple Current230 mA
Impedance700 mΩ
Leakage Current23.5 µA
Diameter6.3 mm
VersionSMT 
MountV-Chip SMT 
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Packaging Unit500 pcs
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Operating Temperature -55 °C up to +105 °C
Capacitance220 µF
Capacitance±20% 
Rated Voltage50 V (DC)
Size10.0 x 10.5 
Dissipation Factor12 %
Insulation Resistance0.454545 MΩ
Length10.5 mm
Width10.3 mm
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Endurance 2000
Ripple Current650 mA
Impedance230 mΩ
Leakage Current110 µA
Diameter10 mm
VersionSMT 
MountV-Chip SMT 
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Packaging Unit200 pcs
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Operating Temperature -55 °C up to +105 °C
Capacitance330 µF
Capacitance±20% 
Rated Voltage50 V (DC)
Size12.5 x 14.0 
Dissipation Factor12 %
Insulation Resistance0.30303 MΩ
Length14 mm
Width13 mm
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Endurance 5000
Ripple Current800 mA
Impedance210 mΩ
Leakage Current165 µA
Diameter12.5 mm
VersionSMT 
MountV-Chip SMT 
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Packaging7" Tape & Reel 
Packaging Unit4000 pcs
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Operating Temperature -55 °C up to +125 °C
Capacitance10 pF
Capacitance±5% 
Rated Voltage50 V (DC)
Size0603 
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Insulation Resistance10 GΩ
Length1.6 mm
Width0.8 mm
Pad Dimension0.4 mm
Ceramic TypeNP0 Class I 
Q-Factor600 
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Packaging Unit4000 pcs
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Operating Temperature -55 °C up to +125 °C
Capacitance33 pF
Capacitance±5% 
Rated Voltage50 V (DC)
Size0603 
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Insulation Resistance10 GΩ
Length1.6 mm
Width0.8 mm
Pad Dimension0.4 mm
Ceramic TypeNP0 Class I 
Q-Factor1000 
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SPECWCAP-CSGP MLCCs 50 V(DC), –, –
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Packaging Unit4000 pcs
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Operating Temperature -55 °C up to +125 °C
Capacitance47 pF
Capacitance±5% 
Rated Voltage50 V (DC)
Size0603 
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Insulation Resistance10 GΩ
Length1.6 mm
Width0.8 mm
Pad Dimension0.4 mm
Ceramic TypeNP0 Class I 
Q-Factor1000 
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Height0.8 mm
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SPECWCAP-CSGP MLCCs 25 V(DC), –, –
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Packaging Unit4000 pcs
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Operating Temperature -55 °C up to +125 °C
Capacitance1 µF
Capacitance±10% 
Rated Voltage25 V (DC)
Size0603 
Dissipation Factor10 %
Insulation Resistance0.5 GΩ
Length1.6 mm
Width0.8 mm
Pad Dimension0.4 mm
Ceramic TypeX7R Class II 
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Height0.8 mm
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SPECWCAP-CSGP MLCCs 50 V(DC), –, –
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Packaging Unit4000 pcs
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Operating Temperature -55 °C up to +125 °C
Capacitance47 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0603 
Dissipation Factor3 %
Insulation Resistance10 GΩ
Length1.6 mm
Width0.8 mm
Pad Dimension0.4 mm
Ceramic TypeX7R Class II 
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SPECWCAP-CSGP MLCCs 50 V(DC), –, –
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Packaging7" Tape & Reel 
Packaging Unit4000 pcs
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–
–
–
–
–
Operating Temperature -55 °C up to +125 °C
Capacitance100 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0603 
Dissipation Factor3 %
Insulation Resistance5 GΩ
Length1.6 mm
Width0.8 mm
Pad Dimension0.4 mm
Ceramic TypeX7R Class II 
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Height0.8 mm
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–Check availability
SPECWCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Availability
–
Status
ActiveProduction is active. Expected lifetime: >10 years.
iProduction is active. Expected lifetime: >10 years.
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Packaging7" Tape & Reel 
Packaging Unit3000 pcs
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–
–
–
–
–
Operating Temperature -55 °C up to +125 °C
Capacitance2.2 µF
Capacitance±10% 
Rated Voltage25 V (DC)
Size0805 
Dissipation Factor10 %
Insulation Resistance0.05 GΩ
Length2 mm
Width1.25 mm
Pad Dimension0.5 mm
Ceramic TypeX7R Class II 
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–
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–
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Height1.25 mm
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–Check availability
SPECWCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Availability
–
Status
ActiveProduction is active. Expected lifetime: >10 years.
iProduction is active. Expected lifetime: >10 years.
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Packaging7" Tape & Reel 
Packaging Unit4000 pcs
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–
–
–
–
–
Operating Temperature -55 °C up to +125 °C
Capacitance10 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0805 
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Length2 mm
Width1.25 mm
Pad Dimension0.5 mm
Ceramic TypeX7R Class II 
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–
–
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Height0.8 mm
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–Check availability
SPECWCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Availability
–
Status
ActiveProduction is active. Expected lifetime: >10 years.
iProduction is active. Expected lifetime: >10 years.
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Packaging7" Tape & Reel 
Packaging Unit4000 pcs
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–
–
–
–
–
Operating Temperature -55 °C up to +125 °C
Capacitance22 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0805 
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Length2 mm
Width1.25 mm
Pad Dimension0.5 mm
Ceramic TypeX7R Class II 
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–
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Height0.8 mm
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–Check availability
SPECWCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Availability
–
Status
ActiveProduction is active. Expected lifetime: >10 years.
iProduction is active. Expected lifetime: >10 years.
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Packaging7" Tape & Reel 
Packaging Unit3000 pcs
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–
–
–
–
–
Operating Temperature -55 °C up to +125 °C
Capacitance470 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0805 
Dissipation Factor3 %
Insulation Resistance1.1 GΩ
Length2 mm
Width1.25 mm
Pad Dimension0.5 mm
Ceramic TypeX7R Class II 
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–
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Height1.25 mm
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–Check availability
SPECWCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Availability
–
Status
ActiveProduction is active. Expected lifetime: >10 years.
iProduction is active. Expected lifetime: >10 years.
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Packaging7" Tape & Reel 
Packaging Unit3000 pcs
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–
–
–
–
–
Operating Temperature -55 °C up to +125 °C
Capacitance1 µF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0805 
Dissipation Factor10 %
Insulation Resistance0.1 GΩ
Length2 mm
Width1.25 mm
Pad Dimension0.5 mm
Ceramic TypeX7R Class II 
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–
–
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Height1.25 mm
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–Check availability
SPECWCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Availability
–
Status
ActiveProduction is active. Expected lifetime: >10 years.
iProduction is active. Expected lifetime: >10 years.
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Packaging7" Tape & Reel 
Packaging Unit1000 pcs
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Operating Temperature -55 °C up to +125 °C
Capacitance4.7 µF
Capacitance±10% 
Rated Voltage50 V (DC)
Size1210 
Dissipation Factor5 %
Insulation Resistance0.02 GΩ
Length3.2 mm
Width2.5 mm
Pad Dimension0.6 mm
Ceramic TypeX7R Class II 
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Height2.5 mm
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–Check availability
SPECWS-TASV SMT Tact Switch 6x6 mm, –, –
Simu­lation–
Availability
–
Status
ActiveProduction is active. Expected lifetime: >10 years.
iProduction is active. Expected lifetime: >10 years.
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Contact PlatingSilver 
Rated Current0.05 A
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PackagingTape and Reel 
Packaging Unit1000 pcs
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Operating Temperature -40 °C up to +85 °C
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Rated Voltage12 V (DC)
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Insulation Resistance100 MΩ
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Diameter3.5 mm
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Height4.3 mm
Operation Force260 g
Electrical Life200000 Cycles
Actuator ColorWhite 
Vaporphase processnot specified 
–Check availability
SPECWA-SPAII Plastic Spacer Stud, metric, internal/ internal, –, –
Simu­lation–
Availability
–
Status
ActiveProduction is active. Expected lifetime: >10 years.
iProduction is active. Expected lifetime: >10 years.
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PackagingBag 
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Operating Temperature -30 °C up to +110 °C
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Length10 mm
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SW6 mm
Inner ThreadM3 
Flammability RatingUL94 HB 
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ColorBlack 
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–Check availability
SPECWR-WTB 2.54 mm Female Crimp Contact, –, –
Simu­lation–
Availability
–
Status
ActiveProduction is active. Expected lifetime: >10 years.
iProduction is active. Expected lifetime: >10 years.
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PCB/Cable/PanelCable 
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TypeCrimp Terminal 
Wire Section 28 to 22 (AWG) 0.081 to 0.326 (mm²)
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GenderFemale 
Contact PlatingTin 
Rated Current3 A
Working Voltage250 V (AC)
Contact Resistance20 mΩ
PackagingBag 
Packaging Unit100 pcs
Stranded Wire Section (AWG)28 to 22 (AWG) 
Stranded Wire Section (Metric)0.081 to 0.326 (mm²) 
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Operating Temperature -40 °C up to +105 °C
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Rated Current3 A
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–Check availability
SPECWCAP-CSGP MLCCs 100 V(DC), –, –
Simu­lation
Availability
–
Status
ActiveProduction is active. Expected lifetime: >10 years.
iProduction is active. Expected lifetime: >10 years.
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Packaging7" Tape & Reel 
Packaging Unit3000 pcs
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Operating Temperature -55 °C up to +125 °C
Capacitance100 nF
Capacitance±10% 
Rated Voltage100 V (DC)
Size0805 
Dissipation Factor2.5 %
Insulation Resistance1 GΩ
Length2 mm
Width1.25 mm
Pad Dimension0.5 mm
Ceramic TypeX7R Class II 
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Height1.25 mm
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–Check availability
SPECWL-SMCW SMT Mono-color Chip LED Waterclear, –, –
Simu­lation
Availability
–
Status
ActiveProduction is active. Expected lifetime: >10 years.
iProduction is active. Expected lifetime: >10 years.
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Dominant Wavelength [typ.]605 nm
Emitting ColorAmber 
Peak Wavelength [typ.]610 nm
Luminous Intensity [typ.]130 mcd
Forward Voltage [typ.]2 V
Chip TechnologyAlInGaP 
Viewing Angle Phi 0° [typ.]140 °
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PackagingTape and Reel 
Packaging Unit4000 pcs
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Operating Temperature -40 °C up to +85 °C
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Size0805 
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MountSMT 
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–Check availability
SPECWA-SCRW Pan Head Screw w. cross slot M3, –, –
Simu­lation–
Availability
–
Status
ActiveProduction is active. Expected lifetime: >10 years.
iProduction is active. Expected lifetime: >10 years.
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PackagingBulk 
Packaging Unit2000 pcs
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Operating Temperature -30 °C up to +85 °C
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Length6 mm
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Flammability RatingUL94 V-2 
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ColorNatural 
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–Check availability
SPECWCAP-CSST Soft Termination, –, –
Simu­lation
Availability
–
Status
ActiveProduction is active. Expected lifetime: >10 years.
iProduction is active. Expected lifetime: >10 years.
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Packaging7" Tape & Reel 
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Operating Temperature -55 °C up to +125 °C
Capacitance220 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0805 
Dissipation Factor3 %
Insulation Resistance2.3 GΩ
Length2 mm
Width1.25 mm
Pad Dimension0.5 mm
Ceramic TypeX7R Class II 
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–
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Height1.25 mm
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–Check availability
SPECWE-XTAL Quartz Crystal, –, Processor, USB, 3G/4G/5G, CAN, Wi-Fi
Simu­lation
Availability
–
Status
ActiveProduction is active. Expected lifetime: >10 years.
iProduction is active. Expected lifetime: >10 years.
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ApplicationProcessor, USB, 3G/4G/5G, CAN, Wi-Fi 
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Frequency40 MHz
Frequency±20ppm 
Stability30 ppm
Load Capacitance18 pF
Operating Temperature -40 °C up to +85 °C
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SizeCFPX-104 
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Length5 mm
Width3.2 mm
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MountSMT 
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Height1 mm
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–Check availability