IC manufacturers Nexperia

IC manufacturers (104)

Nexperia GAN039-650NTB(A) | Demoboard NX-DP-GAN039-TSC

Overview

TopologyHalf-Bridge Converter symmetrical isolated
Input voltage450 V
Output 1450 V
IC revision1.0

Description

The NX-DP-GAN039-TSC half-bridge evaluation board enables double-pulse testing of GaN FETsin a top-side cooled copper-clip package (CCPAK). It is optimized for low inductance and features ahigh bandwidth current shunt that can be used to evaluate the switching performance with maximumprecision. In addition, it can be used for thermal investigations and continuous operation up to severalkilowatts. This user manual aims to support laboratory setup of the evaluation board and gives and anoverview on testing capabilities and typical results.

Features

  • Very low switching losses
  • Rugged gate with high threshold voltage, Vth = 4 V, enables single supply gate drive voltage0 V…10 - 12 V.
  • Very good QGD/QGS << 1 ratio, protects against parasitic turn-on
  • Minimal reverse-recovery
  • Very low Rth in top-side cooling for SMD
  • Best in class third-quadrant off-state conduction performance for wide-bandgap devices
  • Very low package inductance (≈1.3 nH @ 100 MHz)

Typical applications

  • Bridgeless totempole PFC
  • PV and UPS inverters
  • Servo motor drives, Hard and soft switching converters for industrial and datacom power

Products

Order Code Data­sheet Simu­lation Downloads Status Product seriesISAT,10%
(A)
ISAT,30%
(A)
fres
(MHz)
IRP,40K
(A)
MountλDom typ.
(nm)
Emitting ColorλPeak typ.
(nm)
IV typ.
(mcd)
VF typ.
(V)
Chip Technology50% typ.
(°)
CTol. CSizeDF
(%)
RISOCeramic TypeL
(mm)
W
(mm)
Fl
(mm)
PackagingSW
(mm)
ToPins
(pcs)
Pitch
(mm)
RowsGenderTypeWorking Voltage
(V (AC))
PCB/Cable/PanelContact Resistance
(mΩ)
Tol. RH
(mm)
Ø OD
(mm)
IR
(A)
TiTl
(mm)
Winding StyleL
(µH)
Z @ 100 MHz
(Ω)
IR
(mA)
RDC max.
(mΩ)
VR
(V)
VT
(V (AC))
Samples
78438336047SPEC
9 files Active i| Production is active. Expected lifetime: >10 years.WE-MAIA SMT Power Inductor 2.4 5.15 30 2.4 SMT 3020 3 3 2 2 bifilar 4.7 158
744235801SPEC
9 files Active i| Production is active. Expected lifetime: >10 years.WE-CNSW SMT Common Mode Line Filter SMT 1812 4.5 3.2 4 2.8 bifilar 1.3 800 1000 120 60 125
150080VS75000SPEC
7 files Active i| Production is active. Expected lifetime: >10 years.WL-SMCW SMT Mono-color Chip LED Waterclear SMT 570 Bright Green 572 40 2 AlInGaP 140 0805 2 1.25 Tape and Reel 0.7
61900311121SPEC
7 files Active i| Production is active. Expected lifetime: >10 years.WR-WTB 2.54 mm Male Header THT1000 MΩ 7.62 Bag 3 2.54 Male Vertical 250 PCB 20 max. 3 3000
971650485SPEC
3 files Active i| Production is active. Expected lifetime: >10 years.WA-SPAIE Plastic Spacer Stud, metric, internal/ external 65 Bag 8 M4 M4
61300211121SPEC
7 files Active i| Production is active. Expected lifetime: >10 years.WR-PHD Pin Header - Single THT1000 MΩ 5.08 Bag 2 2.54 Single Pin Header Straight 250 20 max. 3000
61300311121SPEC
7 files Active i| Production is active. Expected lifetime: >10 years.WR-PHD Pin Header - Single THT1000 MΩ 7.62 Bag 3 2.54 Single Pin Header Straight 250 20 max. 3000
885342208021SPEC
8 files Active i| Production is active. Expected lifetime: >10 years.WCAP-CSMH Mid and High Voltage10 nF ±10% 1206 2.510 GΩ X7R Class II 3.2 1.6 0.6 7" Tape & Reel 1.25 1000
746600330RSPEC
6 files Active i| Production is active. Expected lifetime: >10 years.WP-SMBU REDCUBE SMT with internal through-hole thread SMT Tape and Reel 3 7 50 M3 4 50000
Samples
Order Code Data­sheet Simu­lation Downloads Status Product seriesISAT,10%
(A)
ISAT,30%
(A)
fres
(MHz)
IRP,40K
(A)
MountλDom typ.
(nm)
Emitting ColorλPeak typ.
(nm)
IV typ.
(mcd)
VF typ.
(V)
Chip Technology50% typ.
(°)
CTol. CSizeDF
(%)
RISOCeramic TypeL
(mm)
W
(mm)
Fl
(mm)
PackagingSW
(mm)
ToPins
(pcs)
Pitch
(mm)
RowsGenderTypeWorking Voltage
(V (AC))
PCB/Cable/PanelContact Resistance
(mΩ)
Tol. RH
(mm)
Ø OD
(mm)
IR
(A)
TiTl
(mm)
Winding StyleL
(µH)
Z @ 100 MHz
(Ω)
IR
(mA)
RDC max.
(mΩ)
VR
(V)
VT
(V (AC))
Samples