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Details
| Topologie | Gegentaktwandler (Halbbrücken) |
| Eingangsspannung | 450 V |
| Ausgang 1 | 450 V |
| IC-Revision | 1.0 |
Beschreibung
The NX-DP-GAN039-TSC half-bridge evaluation board enables double-pulse testing of GaN FETsin a top-side cooled copper-clip package (CCPAK). It is optimized for low inductance and features ahigh bandwidth current shunt that can be used to evaluate the switching performance with maximumprecision. In addition, it can be used for thermal investigations and continuous operation up to severalkilowatts. This user manual aims to support laboratory setup of the evaluation board and gives and anoverview on testing capabilities and typical results.
Eigenschaften
- Very low switching losses
- Rugged gate with high threshold voltage, Vth = 4 V, enables single supply gate drive voltage0 V…10 - 12 V.
- Very good QGD/QGS << 1 ratio, protects against parasitic turn-on
- Minimal reverse-recovery
- Very low Rth in top-side cooling for SMD
- Best in class third-quadrant off-state conduction performance for wide-bandgap devices
- Very low package inductance (≈1.3 nH @ 100 MHz)
Typische Anwendungen
- Servo motor drives, Hard and soft switching converters for industrial and datacom power
- Bridgeless totempole PFC
- PV and UPS inverters
Weiterführende Informationen
Artikeldaten
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | ISAT,10% (A) | ISAT,30% (A) | fres (MHz) | IRP,40K (A) | Montageart | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | Raster (mm) | Arbeitsspannung (V (AC)) | PCB/Kabel/Panel | Kontaktwiderstand (mΩ) | Tol. R | L (mm) | C | Tol. C | Bauform | Betriebstemperatur | DF (%) | RISO | Keramiktyp | W (mm) | Fl (mm) | Schlüsselweite (mm) | To | H (mm) | Ø OD (mm) | IR 1 (A) | Ti | Tl (mm) | Wicklungstyp | L (µH) | Z @ 100 MHz (Ω) | IR (mA) | RDC max. (mΩ) | VR (V) | VT (V (AC)) | Pins (pcs) | Reihen | Gender | Typ | Verpackung | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 78438336047 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-MAIA SMT Speicherdrossel | 2.4 | 5.15 | 30 | 2.4 | SMT | – | – | – | – | – | – | – | – | – | – | – | – | 3 | – | – | 3020 | – | – | – | – | 3 | – | – | – | 2 | – | – | – | – | bifilar | 4.7 | – | – | 158 | – | – | 2 | – | – | – | – | ||
 | 744235801 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-CNSW Stromkompensierter SMT Line Filter | – | – | – | – | SMT | – | – | – | – | – | – | – | – | – | – | – | – | 4.5 | – | – | 1812 | -40 °C bis zu +125 °C | – | – | – | 3.2 | – | – | – | 2.8 | – | – | – | – | bifiliar | 1.3 | 800 | 1000 | 120 | 60 | 125 | 4 | – | – | – | – | ||
 | 150080VS75000 | SPEC | 7 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WL-SMCW SMT Mono-color Chip LED Waterclear | – | – | – | – | SMT | 570 | Hellgrün | 572 | 40 | 2 | AlInGaP | 140 | – | – | – | – | – | 2 | – | – | 0805 | – | – | – | – | 1.25 | – | – | – | 0.7 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | Tape and Reel | ||
 | 61900311121 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-WTB 2.54 mm Male Locking Header | – | – | – | – | THT | – | – | – | – | – | – | – | 2.54 | 250 | PCB | 20 | max. | 7.62 | – | – | – | -40 °C bis zu +105 °C | – | 1000 MΩ | – | – | – | – | – | – | – | 3 | – | – | – | – | – | 3000 | – | – | – | 3 | – | Männlich | Vertikal | Beutel | |
 | 971650485 | SPEC | – | 3 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WA-SPAIE Plastic Spacer Stud, metric, internal/ external | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 65 | – | – | – | -30 °C bis zu +110°C | – | – | – | – | – | 8 | M4 | – | – | – | M4 | – | – | – | – | – | – | – | – | – | – | – | – | Beutel | |
 | 61300211121 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD 2.54 mm THT Pin Header | – | – | – | – | THT | – | – | – | – | – | – | – | 2.54 | 250 | – | 20 | max. | 5.08 | – | – | – | – | – | 1000 MΩ | – | – | – | – | – | – | – | – | – | – | – | – | – | 3000 | – | – | – | 2 | Single | Pin Header | Gerade | Beutel | |
 | 61300311121 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD 2.54 mm THT Pin Header | – | – | – | – | THT | – | – | – | – | – | – | – | 2.54 | 250 | – | 20 | max. | 7.62 | – | – | – | – | – | 1000 MΩ | – | – | – | – | – | – | – | – | – | – | – | – | – | 3000 | – | – | – | 3 | Single | Pin Header | Gerade | Beutel | |
 | 885342208021 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSMH Mid and High Voltage | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 3.2 | 10 nF | ±10% | 1206 | -55 °C bis zu +125 °C | 2.5 | 10 GΩ | X7R Klasse II | 1.6 | 0.6 | – | – | 1.25 | – | – | – | – | – | – | – | – | – | 1000 | – | – | – | – | – | 7" Tape & Reel | ||
 | 746600330R | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WP-SMBU REDCUBE SMT with internal through-hole thread | – | – | – | – | SMT | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | -55 °C bis zu +150 °C | – | – | – | – | – | – | – | 3 | 7 | 50 | M3 | 4 | – | – | – | 50000 | – | – | – | – | – | – | – | Tape and Reel |
| Artikel Nr. | Datenblatt | Simulation | |
|---|---|---|---|
| 78438336047 | SPEC | |
| 744235801 | SPEC | |
| 150080VS75000 | SPEC | |
| 61900311121 | SPEC | – |
| 971650485 | SPEC | – |
| 61300211121 | SPEC | – |
| 61300311121 | SPEC | – |
| 885342208021 | SPEC | |
| 746600330R | SPEC | – |
| Muster |
|---|
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | ISAT,10% (A) | ISAT,30% (A) | fres (MHz) | IRP,40K (A) | Montageart | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | Raster (mm) | Arbeitsspannung (V (AC)) | PCB/Kabel/Panel | Kontaktwiderstand (mΩ) | Tol. R | L (mm) | C | Tol. C | Bauform | Betriebstemperatur | DF (%) | RISO | Keramiktyp | W (mm) | Fl (mm) | Schlüsselweite (mm) | To | H (mm) | Ø OD (mm) | IR 1 (A) | Ti | Tl (mm) | Wicklungstyp | L (µH) | Z @ 100 MHz (Ω) | IR (mA) | RDC max. (mΩ) | VR (V) | VT (V (AC)) | Pins (pcs) | Reihen | Gender | Typ | Verpackung | Muster |
|---|
