IC manufacturers Microchip

IC manufacturers (103)

Microchip MPFS250T-FCVG484 | Demoboard MPFS-ICICLE-KIT

PolarFire SoC FPGA Icicle Kit

Overview

TopologyFPGA
IC revision1.0

Description

The PolarFire SoC Icicle kit is a low-cost development platform that enables evaluation of the five-core Linux capable RISC-V microprocessor subsystem, innovative Linux, and real-time execution, low-power capabilities and the rich set of peripherals of the PolarFire SoC FPGA.PolarFire SoC is ideally suited for secure, reliable and power-efficient compute across a wide range of applications including Imaging, AI/ML, Industrial automation, IoT, Wireline Access Networks, Aerospace, and Defense & Automotive.The Icicle kit features onboard memories (LPDDR4, SPI, and eMMC flash) to run Linux off-the-shelf; a multi-rail power sensor to monitor various power domains; PCIe root port, Raspberry pi, and mikroBUS expansion ports and a host of wired connectivity options for quick prototyping and fast time to market.

Features

  • PolarFire SoC FPGA (MPFS250T-FCVG484EES)
  • SiFive E51 Monitor core (1 x RV64IMAC)
  • SiFive U54 Application cores (4 x RV64GC)
  • Secure boot
  • Memory and Storage
  • 2 GB LPDDR4 x 32
  • 1 Gb SPI flash
  • 8 GB eMMC flash & SD card slot (multiplexed)
  • Programming & Debugging
  • Onboard JTAG connector or onboard embedded FlashPro (multiplexed)
  • UART via micro USB
  • 52 x test points
  • Interfaces
  • 4 x 12.7 Gbps SERDES
  • PCIe Gen2 Rootport
  • 2 x Gigabit Ethernet
  • Micro USB 2.0 Hi-Speed OTG
  • 4 x UART (via single micro USB)
  • 2 x CAN
  • 2 x SPI
  • 2 x I²C
  • Expansion
  • Raspberry Pi compatible 40-pin header
  • mikroBUS socket

Typical applications

  • Imaging, AI/ML, Industrial automation, IoT
  • Automotive, Aerospace
  • Wireline Access Networks

Products

Order Code
Data­sheet
Simu­lation
Downloads
Status
Product series
C
Tol. C
VR(V (DC))
Size
Qmin.
DF(%)
RISO
Ceramic Type
L(mm)
W(mm)
H(mm)
Fl(mm)
Packaging
Operating Temperature
Q(%)
L(µH)
IRP,40K(A)
ISAT,10%(A)
ISAT,30%(A)
fres(MHz)
Mount
xPxC
Ports
Shielding
Tab
EMI
LED
Application System
IR(mA)
Working Voltage(V (AC))
Interface Type
Gender
Pins
PCB Thickness(mm)
Z @ 100 MHz(Ω)
Zmax(Ω)
Test Condition Zmax
IR 2(mA)
RDC max.(Ω)
Type
Samples
WCAP-CSGP MLCCs 50 V(DC), 22 pF, ±5%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance22 pF
Capacitance±5% 
Rated Voltage50 V (DC)
Size0402 
Insulation Resistance10 GΩ
Ceramic TypeNP0 Class I 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Operating Temperature -55 °C up to +125 °C
Q-Factor840 %
WCAP-CSGP MLCCs 50 V(DC), 33 pF, ±5%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance33 pF
Capacitance±5% 
Rated Voltage50 V (DC)
Size0402 
Insulation Resistance10 GΩ
Ceramic TypeNP0 Class I 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Operating Temperature -55 °C up to +125 °C
Q-Factor1000 %
WCAP-CSGP MLCCs 50 V(DC), 100 pF, ±5%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 pF
Capacitance±5% 
Rated Voltage50 V (DC)
Size0402 
Insulation Resistance10 GΩ
Ceramic TypeNP0 Class I 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Operating Temperature -55 °C up to +125 °C
Q-Factor1000 %
WCAP-CSGP MLCCs 50 V(DC), 1 nF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0402 
Q-Factor [1]600 
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Operating Temperature -55 °C up to +125 °C
WCAP-CSMH Mid and High Voltage, 1 nF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 nF
Capacitance±10% 
Rated Voltage3000 V (DC)
Size1812 
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length4.5 mm
Width3.2 mm
Height2 mm
Pad Dimension0.5 mm
Packaging7" Tape & Reel 
Operating Temperature -55 °C up to +125 °C
Q-Factor600 %
WCAP-CSGP MLCCs 50 V(DC), 2.2 nF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance2.2 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0402 
Q-Factor [1]600 
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Operating Temperature -55 °C up to +125 °C
WCAP-CSGP MLCCs 16 V(DC), 10 nF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance10 nF
Capacitance±10% 
Rated Voltage16 V (DC)
Size0402 
Q-Factor [1]600 
Dissipation Factor3.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Operating Temperature -55 °C up to +125 °C
WCAP-CSGP MLCCs 50 V(DC), 10 nF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance10 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0402 
Q-Factor [1]600 
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Operating Temperature -55 °C up to +125 °C
WCAP-CSGP MLCCs 16 V(DC), 100 nF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Capacitance±10% 
Rated Voltage16 V (DC)
Size0402 
Q-Factor [1]600 
Dissipation Factor5 %
Insulation Resistance5 GΩ
Ceramic TypeX7R Class II 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Operating Temperature -55 °C up to +125 °C
WCAP-CSGP MLCCs 50 V(DC), 100 nF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0603 
Q-Factor [1]600 
Dissipation Factor3 %
Insulation Resistance5 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
Operating Temperature -55 °C up to +125 °C
WCAP-CSGP MLCCs 10 V(DC), 1 µF, ±20%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 µF
Capacitance±20% 
Rated Voltage10 V (DC)
Size0402 
Q-Factor [1]600 
Dissipation Factor15 %
Insulation Resistance0.05 GΩ
Ceramic TypeX5R Class II 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Operating Temperature -55 °C up to +85 °C
WCAP-CSGP MLCCs 16 V(DC), 1 µF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 µF
Capacitance±10% 
Rated Voltage16 V (DC)
Size0603 
Q-Factor [1]600 
Dissipation Factor10 %
Insulation Resistance0.1 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
Operating Temperature -55 °C up to +125 °C
WCAP-CSGP MLCCs 6.3 V(DC), 2.2 µF, ±20%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance2.2 µF
Capacitance±20% 
Rated Voltage6.3 V (DC)
Size0402 
Dissipation Factor20 %
Insulation Resistance0.02 GΩ
Ceramic TypeX5R Class II 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Operating Temperature -55 °C up to +85 °C
WCAP-CSGP MLCCs 16 V(DC), 2.2 µF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance2.2 µF
Capacitance±10% 
Rated Voltage16 V (DC)
Size0805 
Q-Factor [1]600 
Dissipation Factor10 %
Insulation Resistance0.05 GΩ
Ceramic TypeX7R Class II 
Length2 mm
Width1.25 mm
Height1.25 mm
Pad Dimension0.5 mm
Packaging7" Tape & Reel 
Operating Temperature -55 °C up to +125 °C
WCAP-CSGP MLCCs 10 V(DC), 10 µF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance10 µF
Capacitance±10% 
Rated Voltage10 V (DC)
Size0805 
Q-Factor [1]600 
Dissipation Factor10 %
Insulation Resistance0.01 GΩ
Ceramic TypeX7R Class II 
Length2 mm
Width1.25 mm
Height1.25 mm
Pad Dimension0.5 mm
Packaging7" Tape & Reel 
Operating Temperature -55 °C up to +125 °C
WCAP-CSGP MLCCs 10 V(DC), 22 µF, ±20%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance22 µF
Capacitance±20% 
Rated Voltage10 V (DC)
Size0805 
Q-Factor [1]600 
Dissipation Factor10 %
Insulation Resistance0.005 GΩ
Ceramic TypeX5R Class II 
Length2 mm
Width1.25 mm
Height1.25 mm
Pad Dimension0.5 mm
Packaging7" Tape & Reel 
Operating Temperature -55 °C up to +85 °C
WCAP-CSGP MLCCs 6.3 V(DC), 47 µF, ±20%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance47 µF
Capacitance±20% 
Rated Voltage6.3 V (DC)
Size0805 
Dissipation Factor10 %
Insulation Resistance0.002 GΩ
Ceramic TypeX5R Class II 
Length2 mm
Width1.25 mm
Height1.25 mm
Pad Dimension0.5 mm
Packaging7" Tape & Reel 
Operating Temperature -55 °C up to +85 °C
WCAP-CSGP MLCCs 10 V(DC), 47 µF, ±20%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance47 µF
Capacitance±20% 
Rated Voltage10 V (DC)
Size1206 
Q-Factor [1]600 
Dissipation Factor10 %
Insulation Resistance0.002 GΩ
Ceramic TypeX5R Class II 
Length3.2 mm
Width1.6 mm
Height1.6 mm
Pad Dimension0.5 mm
Packaging7" Tape & Reel 
Operating Temperature -55 °C up to +85 °C
WCAP-CSGP MLCCs 6.3 V(DC), 100 µF, ±20%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 µF
Capacitance±20% 
Rated Voltage6.3 V (DC)
Size1210 
Dissipation Factor10 %
Insulation Resistance0.001 GΩ
Ceramic TypeX5R Class II 
Length3.2 mm
Width2.5 mm
Height2.5 mm
Pad Dimension0.6 mm
Packaging7" Tape & Reel 
Operating Temperature -55 °C up to +85 °C
WE-CBF SMT EMI Suppression Ferrite Bead, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Size1206 
Length3.2 mm
Width1.6 mm
Height1.1 mm
Pad Dimension0.5 mm
Operating Temperature -55 °C up to +125 °C
MountSMT 
Rated Current2000 mA
Impedance @ 100 MHz120 Ω
Maximum Impedance180 Ω
Maximum Impedance500 MHz 
Rated Current 23000 mA
DC Resistance0.03 Ω
TypeHigh Current 
WE-LHMI SMT Power Inductor, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Size4020 
Length4.45 mm
Width4.06 mm
Height1.8 mm
Operating Temperature -40 °C up to +125 °C
Inductance0.33 µH
Performance Rated Current10.5 A
Saturation Current @ 10%11.2 A
Saturation Current @ 30%22 A
Self Resonant Frequency143 MHz
MountSMT 
ShieldingShielded 
Pins
DC Resistance0.0086 Ω
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Insulation Resistance1000 MΩ
Length50.8 mm
PackagingBag 
Operating Temperature -40 °C up to +105 °C
MountTHT 
Rated Current3000 mA
Working Voltage250 V (AC)
GenderPin Header 
Pins40 
TypeStraight 
WR-MJ Cat 3 Modular Jacks – THT, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Insulation Resistance500 MΩ
PackagingTray 
Operating Temperature -40 °C up to +85 °C
MountTHT 
Number of Pins (xPxC)8P8C 
Ports1x1 
ShieldingShielded 
Tab PositionUp 
EMI FingersYes 
LED (Left-Right)yellow-green 
Application SystemCAT 3 
Rated Current1500 mA
Working Voltage120 V (AC)
TypeHorizontal 
WR-PHD Pin Header - Single, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Insulation Resistance1000 MΩ
Length2.54 mm
PackagingBag 
Operating Temperature -40 °C up to +105 °C
MountTHT 
Rated Current3000 mA
Working Voltage250 V (AC)
GenderPin Header 
Pins
TypeStraight 
WR-PHD Pin Header - Single, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Insulation Resistance1000 MΩ
Length5.08 mm
PackagingBag 
Operating Temperature -40 °C up to +105 °C
MountTHT 
Rated Current3000 mA
Working Voltage250 V (AC)
GenderPin Header 
Pins
TypeStraight 
WR-PHD Pin Header - Single, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Insulation Resistance1000 MΩ
Length7.62 mm
PackagingBag 
Operating Temperature -40 °C up to +105 °C
MountTHT 
Rated Current3000 mA
Working Voltage250 V (AC)
GenderPin Header 
Pins
TypeStraight 
WR-PHD Pin Header - Single, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Insulation Resistance1000 MΩ
Length12.7 mm
PackagingBag 
Operating Temperature -40 °C up to +105 °C
MountTHT 
Rated Current3000 mA
Working Voltage250 V (AC)
GenderPin Header 
Pins
TypeStraight 
WR-USB Mini/Micro Connectors, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Insulation Resistance1000 MΩ
PackagingTape and Reel 
Operating Temperature -40 °C up to +85 °C
MountSMT 
Rated Current1800 mA
Working Voltage30 V (AC)
Interface TypeType AB 
GenderReceptacle 
Pins
PCB Thickness1.2 mm
TypeHorizontal