IC manufacturers Microchip

IC manufacturers (103)

Microchip MCP1755 | Demoboard EV40T43A

Half Bridge Evaluation Board

Overview

TopologyOther Topology
Input voltage12 V
Output 15 V / 0.1 A
IC revision1

Description

The Half Bridge Board (HBB) is a robust, high-performance evaluation board is a versatile and efficient platform for testing and characterizing mSiC™ MOSFETs. Whether you're optimizing your design or pushing the limits of SiC technology, our HBB works seamlessly with the PMB-FET board to streamline your evaluation process. Our board supports two discrete SiC MOSFETs in a TO-247-4L half-bridge configuration, giving you the flexibility to fine-tune switching performance. With support for two Single-Channel Discrete Gate Driver (SCDGD) boards, you can quickly swap gate drivers and adjust parameters for precision control.We know that thermal management is critical for high-power applications, which is why we've integrated a heatsink and fan to keep your system running efficiently and reliably. Plus, our built-in PWM logic protection prevents cross-conduction events, ensuring stable operation even in demanding conditions. With an operating voltage of up to 800V and a current capacity of up to 20A, the HBB is engineered to handle high-performance SiC MOSFET testing and evaluation. Whether you're developing next-generation power electronics, conducting SiC research, or enhancing learning and teaching, this board delivers the performance, flexibility, and reliability you need.

Features

Half-bridge design for two discrete SiC MOSFETs in a TO-247-4L packageSupports Single-Channel Discrete Gate Driver (SCDGD) boards for quick gate drive tuningInterleaved bus connections to reduce stray inductance and enhance efficiencyIntegrated thermal solution with a heatsink and fan for improved heat dissipationPWM logic protection to prevent inadvertent cross-conduction eventsHigh-power capability – operates up to 800V and 20A

Typical applications

  • Smoke Detectors
  • Pagers and Cellular Phones
  • CO2 Detectors
  • Portable Digital Assistant (PDA)
  • Consumer Products
  • Battery-Powered Devices
  • Microcontroller Power
  • Smart Battery Packs
  • Battery-Powered Data Loggers
  • Battery-Powered Alarm Circuits
  • Digital Cameras

Products

Order Code
Data­sheet
Simu­lation
Downloads
Status
Product series
R
Tol. R
PRated(W)
TCR(ppm/ °C)
TCR(ppm/ °C)
IR(A)
L(mm)
W(mm)
H(mm)
λDom typ.(nm)
Emitting Color
λPeak typ.(nm)
IV typ.(mcd)
VF typ.(V)
Chip Technology
50% typ.(°)
Gender
Pins
Wire Section
Contact Plating
Working Voltage(V (AC))
Contact Resistance(mΩ)
Packaging
Qty.(pcs)
Stranded Wire Section (AWG)
Stranded Wire Section (Metric)
C
Tol. C
VR(mV)
Size
Operating Temperature
Q(%)
DF(%)
RISO
Ceramic Type
Fl(mm)
L(µH)
ISAT,10%(A)
RDC max.(Ω)
fres(MHz)
Version
VE(V)
Mount
IR(A)
PCB/Cable/Panel
Z @ 100 MHz(Ω)
Zmax(Ω)
Test Condition Zmax
IR 2(mA)
Test Condition IR 2
Z @ 1 GHz(Ω)
Type
Samples
WRIS-KSKE Thick Film Resistors, 1 Ω, ±1%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Resistance1 Ω
Resistance±1% 
Rated Power0.33 W
Temperature Coefficient of Resistance (min.)-100 ppm/ °C
Temperature Coefficient of Resistance (max.)100 ppm/ °C
Rated Current0.57 A
Length2 mm
Width1.25 mm
Height0.6 mm
Packaging Unit5000 pcs
Rated Voltage574.5 mV
Size0805 
Operating Temperature -55 °C up to +155 °C
Pad Dimension0.4 mm
MountSMT 
WRIS-RSKS Thick Film Resistors, 3.3 kΩ, ±1%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Resistance3.3 kΩ
Resistance±1% 
Rated Power0.1 W
Temperature Coefficient of Resistance (min.)-100 ppm/ °C
Temperature Coefficient of Resistance (max.)100 ppm/ °C
Length1.6 mm
Width0.8 mm
Height0.45 mm
Size0603 
Operating Temperature -55 °C up to +155 °C
Limiting Element Voltage75 V
MountSMT 
WRIS-RSKS Thick Film Resistors, 10 kΩ, ±1%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Resistance10 kΩ
Resistance±1% 
Rated Power0.1 W
Temperature Coefficient of Resistance (min.)-100 ppm/ °C
Temperature Coefficient of Resistance (max.)100 ppm/ °C
Length1.6 mm
Width0.8 mm
Height0.45 mm
Size0603 
Operating Temperature -55 °C up to +155 °C
Limiting Element Voltage75 V
MountSMT 
WE-TI Radial Leaded Wire Wound Inductor, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Rated Current0.25 A
Length6 mm
Width6 mm
Height8.5 mm
Packaging Unit400 pcs
Size5075 
Operating Temperature -40 °C up to +125 °C
Inductance680 µH
Saturation Current @ 10%0.3 A
DC Resistance3.7 Ω
Self Resonant Frequency2.4 MHz
VersionHeat Shrinking Tube 
MountTHT 
WL-SMCW SMT Mono-color Chip LED Waterclear, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Length1.6 mm
Width0.8 mm
Height0.7 mm
Dominant Wavelength [typ.]625 nm
Emitting ColorRed 
Peak Wavelength [typ.]630 nm
Luminous Intensity [typ.]250 mcd
Forward Voltage [typ.]2 V
Chip TechnologyAlInGaP 
Viewing Angle Phi 0° [typ.]140 °
PackagingTape and Reel 
Packaging Unit4000 pcs
Size0603 
Operating Temperature -40 °C up to +85 °C
MountSMT 
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Length1.6 mm
Width0.8 mm
Height0.8 mm
Packaging7" Tape & Reel 
Packaging Unit4000 pcs
Capacitance10 pF
Capacitance±5% 
Rated Voltage50000 mV
Size0603 
Operating Temperature -55 °C up to +125 °C
Q-Factor600 %
Insulation Resistance10 GΩ
Ceramic TypeNP0 Class I 
Pad Dimension0.4 mm
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Length1.6 mm
Width0.8 mm
Height0.8 mm
Packaging7" Tape & Reel 
Packaging Unit4000 pcs
Capacitance100 pF
Capacitance±5% 
Rated Voltage50000 mV
Size0603 
Operating Temperature -55 °C up to +125 °C
Q-Factor1000 %
Insulation Resistance10 GΩ
Ceramic TypeNP0 Class I 
Pad Dimension0.4 mm
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Length1.6 mm
Width0.8 mm
Height0.8 mm
Packaging7" Tape & Reel 
Packaging Unit4000 pcs
Capacitance100 nF
Capacitance±10% 
Rated Voltage25000 mV
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3.5 %
Insulation Resistance5 GΩ
Ceramic TypeX7R Class II 
Pad Dimension0.4 mm
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Length1.6 mm
Width0.8 mm
Height0.8 mm
Packaging7" Tape & Reel 
Packaging Unit4000 pcs
Capacitance1 µF
Capacitance±10% 
Rated Voltage25000 mV
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor10 %
Insulation Resistance0.5 GΩ
Ceramic TypeX7R Class II 
Pad Dimension0.4 mm
WR-WTB 2.54 mm Female Terminal Housing, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Length5.6 mm
GenderFemale 
Pins
PackagingBag 
Operating Temperature -40 °C up to +105 °C
Insulation Resistance1000 MΩ
PCB/Cable/PanelCable 
TypeTerminal Housing 
WR-PHD Pin Header - Single, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Rated Current3 A
Length10.16 mm
GenderPin Header 
Pins
Contact PlatingGold 
Working Voltage250 V (AC)
Contact Resistance20 mΩ
PackagingBag 
Operating Temperature -40 °C up to +105 °C
Insulation Resistance1000 MΩ
MountTHT 
TypeStraight 
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Rated Current3 A
Length15.24 mm
GenderPin Header 
Pins
Contact PlatingGold 
Working Voltage250 V (AC)
Contact Resistance20 mΩ
PackagingBag 
Operating Temperature -40 °C up to +105 °C
Insulation Resistance1000 MΩ
MountTHT 
TypeStraight 
WR-WTB 2.54 mm Female Crimp Contact, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Rated Current3 A
GenderFemale 
Wire Section 28 to 22 (AWG) 0.081 to 0.326 (mm²)
Contact PlatingTin 
Working Voltage250 V (AC)
Contact Resistance20 mΩ
PackagingBag 
Packaging Unit100 pcs
Stranded Wire Section (AWG)28 to 22 (AWG) 
Stranded Wire Section (Metric)0.081 to 0.326 (mm²) 
Operating Temperature -40 °C up to +105 °C
Rated Current3 A
PCB/Cable/PanelCable 
TypeCrimp Terminal 
WR-WTB 2.54 mm Male Header, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Rated Current3 A
Length5.08 mm
GenderMale 
Pins
Contact PlatingTin 
Working Voltage250 V (AC)
Contact Resistance20 mΩ
PackagingBag 
Operating Temperature -40 °C up to +105 °C
Insulation Resistance1000 MΩ
MountTHT 
PCB/Cable/PanelPCB 
TypeVertical 
WCAP-CSGP MLCCs 100 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Length1.6 mm
Width0.8 mm
Height0.8 mm
Packaging7" Tape & Reel 
Packaging Unit4000 pcs
Capacitance10 nF
Capacitance±10% 
Rated Voltage100000 mV
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Pad Dimension0.4 mm
WL-SMCW SMT Mono-color Chip LED Waterclear, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Dominant Wavelength [typ.]605 nm
Emitting ColorAmber 
Peak Wavelength [typ.]610 nm
Luminous Intensity [typ.]130 mcd
Forward Voltage [typ.]2 V
Chip TechnologyAlInGaP 
Viewing Angle Phi 0° [typ.]140 °
PackagingTape and Reel 
Packaging Unit4000 pcs
Size0603 
Operating Temperature -40 °C up to +85 °C
MountSMT 
WE-TMSB Tiny Multilayer Suppression Bead, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Rated Current1.5 A
Length1.6 mm
Width0.8 mm
Height0.8 mm
Packaging Unit4000 pcs
Size0603 
Operating Temperature -55 °C up to +125 °C
Pad Dimension0.3 mm
DC Resistance0.1 Ω
MountSMT 
Impedance @ 100 MHz600 Ω
Maximum Impedance634 Ω
Maximum Impedance184 MHz 
Rated Current 21500 mA
Rated Current 2ΔT = 40 K 
Impedance @ 1 GHz170 Ω
TypeHigh Current