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STMicroelectronics STWBC-EP | Demoboard STEVAL - ISB044V1
Qi MP-A10 15 W wireless charger TX evaluation kit based on STWBC-EP
Details
| Topologie | Drahtlose Energieübertragung |
Beschreibung
The STEVAL-ISB044V1 evaluation kit has been designed for devices, such as smartphones or tablets, requiring high power levels. It supports wireless battery charging up to 15 W. The embedded STWBC-EP digital controller transmitter is based on a cost-effective half-bridge topology providing external interfaces via UART and I²C. The kit also includes STWBC-EP firmware, a graphical interface for debug, schematics, layout files and bill of materials. There are specific tools for the STEVALISB044V1 available on www.st.com which give runtime information, such as the power delivered, the regulation error or the protocol status as well as parameter tuning.
Eigenschaften
- STWBC-EP digital controller
- 15 W output power
- Qi MP-A10 reference design
- WPC Qi1.2.3 standard compliant
- Robust demodulation algorithm, with triplepath (V, I, f)
- Foreign object detection (FOD)
- Accurate power control
- Active presence detection
- UART protocol to control and monitor thesystem
- Complete reference design (evaluationboard, IC, firmware and tools)
- 2-layer PCB for easy design
- Flash memory-based
- RoHS compliant
Weiterführende Informationen
Artikeldaten
| Artikel Nr. | Datenblatt | Simulation | Downloads | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Betriebstemperatur | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | ISAT (A) | RDC (mΩ) | IRP,40K (A) | ISAT,30% (A) | RDC typ. (mΩ) | V (V) | Montageart | Version | Anwendung | Interface typ | IR 1 (mA) | Arbeitsspannung (V (AC)) | Z @ 100 MHz (Ω) | Zmax (Ω) | Testbedingung Zmax | IR 2 (mA) | RDC max. (Ω) | Typ | Compliance | Bauform | L (µH) | IR (mA) | fres (MHz) | Q (%) | Pins | Reihen | H (mm) | Gender | Verpackung | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 155124VS73200 | SPEC | 6 Dateien | WL-SMSW SMT Mono-color Side View Waterclear | 573 | Hellgrün | 575 | 50 | 2 | AlInGaP | 120 | – | – | – | -40 °C up to +85 °C | – | – | – | 3.2 | 1.5 | – | – | – | – | – | – | – | SMT | – | – | – | – | – | – | – | – | – | – | – | – | 1204 | – | – | – | – | – | – | 1 | – | Tape and Reel | ||
| 155124RS73200 | SPEC | 6 Dateien | WL-SMSW SMT Mono-color Side View Waterclear | 624 | Rot | 632 | 130 | 2 | AlInGaP | 120 | – | – | – | -40 °C up to +85 °C | – | – | – | 3.2 | 1.5 | – | – | – | – | – | – | – | SMT | – | – | – | – | – | – | – | – | – | – | – | – | 1204 | – | – | – | – | – | – | 1 | – | Tape and Reel | ||
 | 74279262 | SPEC | 9 Dateien | WE-CBF SMT-Ferrit | – | – | – | – | – | – | – | – | – | – | -55 °C up to +125 °C | – | – | – | 1.6 | 0.8 | 0.3 | – | – | – | – | – | – | SMT | SMT | – | – | 500 | – | 120 | 200 | 510 MHz | 1350 | 0.3 | Breitband | – | 0603 | – | 500 | – | – | – | – | 0.8 | – | – | ||
 | 74404054022 | SPEC | 8 Dateien | WE-LQS SMT-Speicherdrossel | – | – | – | – | – | – | – | – | – | – | -40 °C up to +125 °C | – | – | – | 5 | 5 | – | 5.3 | 19 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 5040 | 2.2 | 3800 | – | – | – | – | 4 | – | – | ||
 | 7447714047 | SPEC | 8 Dateien | WE-PD SMT-Speicherdrossel | – | – | – | – | – | – | – | – | – | – | -40 °C up to +150 °C | – | – | – | 10 | 10 | – | 8 | – | – | – | – | 120 | SMT | Performance | – | – | – | – | – | – | – | – | 0.0124 | – | – | 1050 | 4.7 | 7000 | 34 | – | 2 | – | 5 | – | – | ||
 | 74438323100 | SPEC | 8 Dateien | WE-MAPI SMT-Speicherdrossel | – | – | – | – | – | – | – | – | – | – | -40 °C up to +125 °C | – | – | – | 2.5 | 2 | – | 1.35 | – | 0.9 | 1.7 | 733 | 80 | SMT | SMT | – | – | – | – | – | – | – | – | 0.843 | – | – | 2510 | 10 | 600 | 25 | – | 2 | – | 1 | – | – | ||
 | 760308104113 | SPEC | 7 Dateien | WE-WPCC Wireless Power Transfer Transmitter Spule | – | – | – | – | – | – | – | – | – | – | -20 °C up to +105 °C | – | – | – | 59.5 | 52 | – | 12 | – | – | – | – | – | THT | THT | – | – | – | – | – | – | – | – | 0.072 | – | Qi - A13 | 60 x 52 x 4 mm | 12 | 8000 | 16 | 120 | 2 | – | 6 | – | – | ||
 | 885012108021 | SPEC | 8 Dateien | WCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | 10 µF | ±20% | 25 | -55 °C up to +85 °C | 10 | 0.01 GΩ | X5R Klasse II | 3.2 | 1.6 | 0.6 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 1206 | – | – | – | – | – | – | 1.6 | – | 7" Tape & Reel | ||
| 885012109014 | SPEC | 8 Dateien | WCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | 22 µF | ±20% | 25 | -55 °C up to +85 °C | 5 | 0.005 GΩ | X5R Klasse II | 3.2 | 2.5 | 0.6 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 1210 | – | – | – | – | – | – | 2.5 | – | 7" Tape & Reel | ||
 | 629105150521 | SPEC | – | 6 Dateien | WR-COM Micro USB 2.0 SMT Type B Horizontal 5 Contacts High Current | – | – | – | – | – | – | – | – | – | – | -40 °C up to +85 °C | – | 1000 MΩ | – | – | – | – | – | – | – | – | – | – | SMT | – | Micro USB 2.0 | Type B | 3000 | 30 | – | – | – | – | – | Horizontal | – | – | – | 3000 | – | – | 5 | – | – | Receptacle | Tape and Reel | |
 | 61300311121 | SPEC | – | 6 Dateien | WR-PHD 2.54 mm THT Pin Header | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | 1000 MΩ | – | 7.62 | – | – | – | – | – | – | – | – | THT | – | – | – | – | 250 | – | – | – | – | – | Gerade | – | – | – | 3000 | – | – | 3 | Single | – | Pin Header | Beutel | |
 | 61400416021 | SPEC | – | 6 Dateien | WR-COM USB 2.0 Type A Horizontal | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | 1000 MΩ | – | – | – | – | – | – | – | – | – | – | THT | – | USB 2.0 | Type A | 1500 | 30 | – | – | – | – | – | Horizontal | – | – | – | 1500 | – | – | 4 | – | – | Receptacle | Tray |
| Muster |
|---|
| Artikel Nr. | Datenblatt | Simulation | Downloads | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Betriebstemperatur | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | ISAT (A) | RDC (mΩ) | IRP,40K (A) | ISAT,30% (A) | RDC typ. (mΩ) | V (V) | Montageart | Version | Anwendung | Interface typ | IR 1 (mA) | Arbeitsspannung (V (AC)) | Z @ 100 MHz (Ω) | Zmax (Ω) | Testbedingung Zmax | IR 2 (mA) | RDC max. (Ω) | Typ | Compliance | Bauform | L (µH) | IR (mA) | fres (MHz) | Q (%) | Pins | Reihen | H (mm) | Gender | Verpackung | Muster |
|---|