Intel 5CSXFC6D6F31C6N

Beschreibung

The Cyclone® V devices are designed to simultaneously accommodate the shrinking power consumption, cost, and time-to-market requirements; and the increasing bandwidth requirements for high-volume and cost-sensitive applications. Enhanced with integrated transceivers and hard memory controllers, the Cyclone V devices are suitable for applications in the industrial, wireless and wireline, military, and automotive markets.

Eigenschaften

• TSMC's 28-nm low-power (28LP) process technology
• 1.1 V core voltage
• Wirebond low-halogen packages
• Multiple device densities with compatible package footprints for seamless migrationbetween different device densities
• RoHS-compliant optionsEnhanced 8-input ALM with four registers
• M10K—10-kilobits (Kb) memory blocks with soft error correction code (ECC)
• Memory logic array block (MLAB)—640-bit distributed LUTRAM where you canuse up to 25% of the ALMs as MLAB memory
• Native support for up to three signal processing precision levels(three 9 x 9, two 18 x 18, or one 27 x 27 multiplier) in the samevariable-precision DSP block
• 64-bit accumulator and cascade
• Embedded internal coefficient memory
• Preadder/subtractor for improved efficiencyDDR3, DDR2, and LPDDR2 with 16 and 32 bit ECC supportPCI Express® (PCIe®) Gen2 and Gen1 (x1, x2, or x4) hard IP withmultifunction support, endpoint, and root port
• Up to 550 MHz global clock network
• Global, quadrant, and peripheral clock networks
• Clock networks that are not used can be powered down to reduce dynamic power
• Precision clock synthesis, clock delay compensation, and zero delay buffering (ZDB)
• Integer mode and fractional mode
• 875 megabits per second (Mbps) LVDS receiver and 840 Mbps LVDS transmitter
• 400 MHz/800 Mbps external memory interface
• On-chip termination (OCT)
• 3.3 V support with up to 16 mA drive strength
• 614 Mbps to 5.0 Gbps integrated transceiver speed
• Transmit pre-emphasis and receiver equalization
• Dynamic partial reconfiguration of individual channels
• Single or dual-core ARM Cortex-A9 MPCore processor-up to 800 MHz maximumfrequency with support for symmetric and asymmetric multiprocessing
• Interface peripherals—10/100/1000 Ethernet media access control (EMAC), USB 2.0On-The-GO (OTG) controller, quad serial peripheral interface (QSPI) flash controller,NANDflash controller, Secure Digital/MultiMediaCard (SD/MMC) controller, UART,controller area network (CAN), serial peripheral interface (SPI), I2C interface, andup to 85 HPS GPIO interfaces
• System peripherals—general-purpose timers, watchdog timers, direct memory access(DMA) controller, FPGA configuration manager, and clock and reset managers
• On-chip RAM and boot ROM
• HPS–FPGA bridges—include the FPGA-to-HPS, HPS-to-FPGA, and lightweightHPS-to-FPGA bridges that allow the FPGA fabric to issue transactions to slaves inthe HPS, and vice versa
• FPGA-to-HPS SDRAM controller subsystem—provides a configurable interface tothe multiport front end (MPFE) of the HPS SDRAM controller
• ARM CoreSight™ JTAG debug access port, trace port, and on-chip trace storage
• Tamper protection—comprehensive design protection to protect your valuable IPinvestments
• Enhanced advanced encryption standard (AES) design security features
• CvP
• Partial and dynamic reconfiguration of the FPGA
• Active serial (AS) x1 and x4, passive serial (PS), JTAG, and fast passive parallel (FPP)x8 and x16 configuration options

Weiterführende Informationen

• Datenblatt