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IC manufacturers AnDAPT Inc

IC manufacturers (84)

AnDAPT Inc AMP8DSQF65 | Demoboard AnD8300EB

Overview

TopologyBuck Converter
IC revision1.0

Description

The AmP™ device is an FPGA based platform for creating a custom Power Management Integrated Circuit (PMIC). The AmP device is customized by adding available Power Components designs based on system requirements. AmP device customization is as easy as using WebAmp™ application software to produce a customized PMIC in a very short period of time. AmP devices can be used to power FPGAs, Processors, Microcontrollers, and ASICs by integrating multiple power rails into single chip designs. The AmP device input voltage range is 4.5V to 20V. The AmP device is targeted for wall-powered applications or 2S-4S Li-Ion battery packs. AmP devices have up to 4 additional integrated LDOs of which two are fixed output voltages (3.3V and 1.2V) and two are user programmable.

Features

  • Enables On-Demand power management
  • Integrate application targeted Power Components
  • Power Blocks for a variety of topologies
    • Scalable Integrated N-channel MOSFETs (SIM)
    • Current sense for protection, telemetry, regulation
    • Build Switching topologies - Buck, Boost, Buck-Boost
    • Build Linear topologies - LDO, Load Switch
    • Build Mixed topologies - Battery Charger
    • Build BLDC (Motor Control) topologies – H-Bridge
  • Sensor Blocks, sensing voltages and currents
    • Regulation, protection and telemetry
    • Adaptive Digitizer (ADi)
    • Threshold Comparators (ThC)
    • Summation Amplifier (SuM)
    • Noise-Immune Reference (Nref) Array
  • Analog fabric connectivity for sensor signals
  • Digital μLogic fabric connectivity: Analog/Digital Blocks
    • Analog and Digital GPIOs, LUTs for logic & Interface
    • Integrated Compensator RAM (CRAM)
    • On-demand POL control loops and interfaces
    • Precision Modulation Timer Array
  • Industry first: Analog Proficiency – Digital Flexibility

Typical applications

  • Power Component Integrator / Digital power management IC / Battery Charger

More information

Products

Order Code Data­sheet Simu­lation Downloads Product seriesλDom typ.
(nm)
Emitting ColorλPeak typ.
(nm)
IV typ.
(mcd)
VF typ.
(V)
Chip Technology50% typ.
(°)
CVR
(V (DC))
Endurance
(h)
Operating TemperatureIRIPPLE
(mA)
Z
(Ω)
ILeak
(µA)
DF
(%)
Ø D
(mm)
L
(mm)
Technical ReferenceMountIR
(A)
Working Voltage
(V (AC))
Tol. CSizeOperating TemperatureRISOCeramic TypeW
(mm)
H
(mm)
Fl
(mm)
L
(µH)
LR
(µH)
ISAT
(A)
RDC
(mΩ)
fres
(MHz)
MaterialVersionPinsRowsGenderTypeIR
(A)
Packaging Samples
150060GS75000SPEC
7 files WL-SMCW SMT Mono-color Chip LED Waterclear 525 Green 515 430 3.2 InGaN 140 -40 °C up to +85 °C 1.6 SMT 0603 -40 up to +85 °C 0.8 0.7 Tape and Reel
150060RS75000SPEC
7 files WL-SMCW SMT Mono-color Chip LED Waterclear 625 Red 630 250 2 AlInGaP 140 -40 °C up to +85 °C 1.6 SMT 0603 -40 up to +85 °C 0.8 0.7 Tape and Reel
744316100SPEC
9 files WE-HCI SMT Flat Wire High Current Inductor -40 °C up to +150 °C 5.5 SMT 5040 -40 up to +150 °C 5.3 4 1 0.65 11.5 4.75 158 Superflux SMT 2 11.5
865080553014SPEC
7 files WCAP-ASLI Aluminum Electrolytic Capacitors220 µF 35 2000 -55 °C up to +105 °C 570 0.21 77 14 8 10.5 ASEE105221M035DVCTEB000 ±20%0.454545 MΩ SMT
885012206095SPEC
7 files WCAP-CSGP MLCCs 50 V(DC)100 nF 50 3 1.6 X7R0603104K050DFCT10000 ±10% 0603 -55 up to +125 °C5 GΩ X7R Class II 0.8 0.8 0.4
885012207098SPEC
7 files WCAP-CSGP MLCCs 50 V(DC)100 nF 50 2.5 2 X7R0805104K050DFCT10000 ±10% 0805 -55 up to +125 °C5 GΩ X7R Class II 1.25 0.8 0.5
694108106102SPEC
6 files WR-DC DC Power Jack Right Angled SMT Ø 6.4 with 4 soldering pads & pegs -40 °C up to +85 °C SMT 5 24 -40 up to +85 °C100 MΩ Right Angled 5 Tape and Reel
61300311121SPEC
6 files WR-PHD 2.54 mm THT Pin Header 7.62 THT 250 -40 up to +105 °C1000 MΩ 3 Single Pin Header Straight 3 Bag
61300421121SPEC
6 files WR-PHD 2.54 mm THT Dual Pin Header 5.08 THT 250 -40 up to +105 °C1000 MΩ 4 Dual Pin Header Board Stacker 3 Bag
Samples
Order Code Data­sheet Simu­lation Downloads Product seriesλDom typ.
(nm)
Emitting ColorλPeak typ.
(nm)
IV typ.
(mcd)
VF typ.
(V)
Chip Technology50% typ.
(°)
CVR
(V (DC))
Endurance
(h)
Operating TemperatureIRIPPLE
(mA)
Z
(Ω)
ILeak
(µA)
DF
(%)
Ø D
(mm)
L
(mm)
Technical ReferenceMountIR
(A)
Working Voltage
(V (AC))
Tol. CSizeOperating TemperatureRISOCeramic TypeW
(mm)
H
(mm)
Fl
(mm)
L
(µH)
LR
(µH)
ISAT
(A)
RDC
(mΩ)
fres
(MHz)
MaterialVersionPinsRowsGenderTypeIR
(A)
Packaging Samples