IC-Hersteller AnDAPT Inc
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Details
| Topologie | Abwärtswandler |
| IC-Revision | 1.0 |
Beschreibung
The AmP™ device is an FPGA based platform for creating a custom Power Management Integrated Circuit (PMIC). The AmP device is customized by adding available Power Components designs based on system requirements. AmP device customization is as easy as using WebAmp™ application software to produce a customized PMIC in a very short period of time. AmP devices can be used to power FPGAs, Processors, Microcontrollers, and ASICs by integrating multiple power rails into single chip designs. The AmP device input voltage range is 4.5V to 20V. The AmP device is targeted for wall-powered applications or 2S-4S Li-Ion battery packs. AmP devices have up to 4 additional integrated LDOs of which two are fixed output voltages (3.3V and 1.2V) and two are user programmable.
Eigenschaften
- Enables On-Demand power management
- Integrate application targeted Power Components
- Power Blocks for a variety of topologies
- Scalable Integrated N-channel MOSFETs (SIM)
- Current sense for protection, telemetry, regulation
- Build Switching topologies - Buck, Boost, Buck-Boost
- Build Linear topologies - LDO, Load Switch
- Build Mixed topologies - Battery Charger
- Build BLDC (Motor Control) topologies – H-Bridge
- Sensor Blocks, sensing voltages and currents
- Regulation, protection and telemetry
- Adaptive Digitizer (ADi)
- Threshold Comparators (ThC)
- Summation Amplifier (SuM)
- Noise-Immune Reference (Nref) Array
- Analog fabric connectivity for sensor signals
- Digital μLogic fabric connectivity: Analog/Digital Blocks
- Analog and Digital GPIOs, LUTs for logic & Interface
- Integrated Compensator RAM (CRAM)
- On-demand POL control loops and interfaces
- Precision Modulation Timer Array
- Industry first: Analog Proficiency – Digital Flexibility
Typische Anwendungen
- Power Component Integrator / Digital power management IC / Battery Charger
Weiterführende Informationen
Artikeldaten
Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | λDom typ.(nm) | Emittierte Farbe | λPeak typ.(nm) | IV typ.(mcd) | VF typ.(V) | Chiptechnologie | 2θ50% typ.(°) | C | Tol. C | VR(V (DC)) | Bauform | Betriebstemperatur | DF(%) | RISO | Keramiktyp | L(mm) | B(mm) | H(mm) | Fl(mm) | Verpackung | L(µH) | IRP,40K(A) | ISAT,10%(A) | ISAT,30%(A) | RDC(mΩ) | fres(MHz) | Material | Endurance(h) | IRIPPLE(mA) | Z(mΩ) | ILeak(µA) | Ø D(mm) | Pins | Mittelstift Ø (Value)(mm) | Plug OD(mm) | Typ | IR(A) | Arbeitsspannung(V (DC)) | Montageart | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | WL-SMCW SMT Mono-color Chip LED Waterclear, 525 nm, Grün | Downloads26 Dateien Strahldaten
| Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWL-SMCW SMT Mono-color Chip LED Waterclear | dominante Wellenlänge [typ.]525 nm | Emittierte FarbeGrün | Spitzen-Wellenlänge [typ.]515 nm | Lichtstärke [typ.]430 mcd | Durchlassspannung [typ.]3.2 V | ChiptechnologieInGaN | Abstrahlwinkel Phi 0° [typ.]140 ° | – | – | – | Bauform0603 | Betriebstemperatur -40 °C up to +85 °C | – | – | – | Länge1.6 mm | Breite0.8 mm | Höhe0.7 mm | – | VerpackungTape and Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | MontageartSMT | |||
| WL-SMCW SMT Mono-color Chip LED Waterclear, 625 nm, Rot | Downloads26 Dateien Strahldaten
| Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWL-SMCW SMT Mono-color Chip LED Waterclear | dominante Wellenlänge [typ.]625 nm | Emittierte FarbeRot | Spitzen-Wellenlänge [typ.]630 nm | Lichtstärke [typ.]250 mcd | Durchlassspannung [typ.]2 V | ChiptechnologieAlInGaP | Abstrahlwinkel Phi 0° [typ.]140 ° | – | – | – | Bauform0603 | Betriebstemperatur -40 °C up to +85 °C | – | – | – | Länge1.6 mm | Breite0.8 mm | Höhe0.7 mm | – | VerpackungTape and Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | MontageartSMT | |||
 | WE-HCI SMT-Hochstrominduktivität, –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWE-HCI SMT-Hochstrominduktivität | – | – | – | – | – | – | – | – | – | – | Bauform5040 | Betriebstemperatur -40 °C up to +150 °C | – | – | – | Länge5.5 mm | Breite5.3 mm | Höhe4 mm | – | – | Induktivität1 µH | Performance Nennstrom14.8 A | Sättigungsstrom 15.5 A | Sättigungsstrom @ 30%11.5 A | Gleichstromwiderstand4.75 mΩ | Eigenresonanzfrequenz158 MHz | MaterialSuperflux | – | – | – | – | – | Pins2 | – | – | – | – | – | MontageartSMT | ||||
 | WCAP-ASLI Aluminium-Elektrolytkondensatoren, –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-ASLI Aluminium-Elektrolytkondensatoren | – | – | – | – | – | – | – | Kapazität220 µF | Kapazität±20% | Nennspannung35 V (DC) | Bauform8.0 x 10.5 | Betriebstemperatur -55 °C up to +105 °C | Verlustfaktor14 % | Isolationswiderstand0.454545 MΩ | – | Länge10.5 mm | Breite8.3 mm | – | – | Verpackung15" Tape & Reel | – | – | – | – | – | – | – | Endurance 2000 | Rippelstrom570 mA | Impedanz210 mΩ | Leckstrom77 µA | Durchmesser8 mm | – | – | – | – | – | – | MontageartV-Chip SMT | ||||
| WCAP-CSGP MLCCs 50 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | Kapazität100 nF | Kapazität±10% | Nennspannung50 V (DC) | Bauform0603 | Betriebstemperatur -55 °C up to +125 °C | Verlustfaktor3 % | Isolationswiderstand5 GΩ | KeramiktypX7R Klasse II | Länge1.6 mm | Breite0.8 mm | Höhe0.8 mm | Pad Dimension0.4 mm | Verpackung7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 50 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | Kapazität100 nF | Kapazität±10% | Nennspannung50 V (DC) | Bauform0805 | Betriebstemperatur -55 °C up to +125 °C | Verlustfaktor2.5 % | Isolationswiderstand5 GΩ | KeramiktypX7R Klasse II | Länge2 mm | Breite1.25 mm | Höhe0.8 mm | Pad Dimension0.5 mm | Verpackung7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | |||||
 | WR-DC Power Jacks, –, – | Simulation– | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWR-DC Power Jacks | – | – | – | – | – | – | – | – | – | – | – | Betriebstemperatur -40 °C up to +85 °C | – | Isolationswiderstand100 MΩ | – | – | – | – | – | VerpackungTape and Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | Mittelstift Ø2.5 mm | Recommended Plug outer Ø5.5 mm | TypAbgewinkelt | Nennstrom5 A | Arbeitsspannung24 V (DC) | MontageartSMT | |||
 | WR-PHD Stiftleisten - Einreihig, –, – | Simulation– | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWR-PHD Stiftleisten - Einreihig | – | – | – | – | – | – | – | – | – | – | – | Betriebstemperatur -40 °C up to +105 °C | – | Isolationswiderstand1000 MΩ | – | Länge7.62 mm | – | – | – | VerpackungBeutel | – | – | – | – | – | – | – | – | – | – | – | – | Pins3 | – | – | TypGerade | Nennstrom3 A | Arbeitsspannung250 V (DC) | MontageartTHT | |||
 | WR-PHD Stiftleisten - Zweireihig, –, – | Simulation– | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWR-PHD Stiftleisten - Zweireihig | – | – | – | – | – | – | – | – | – | – | – | Betriebstemperatur -40 °C up to +105 °C | – | Isolationswiderstand1000 MΩ | – | Länge5.08 mm | – | – | – | VerpackungBeutel | – | – | – | – | – | – | – | – | – | – | – | – | Pins4 | – | – | TypGerade | Nennstrom3 A | Arbeitsspannung250 V (DC) | MontageartTHT |