IC manufacturers AnDAPT Inc

IC manufacturers (103)

AnDAPT Inc AMP8DSQF65 | Demoboard AnD8300EB

Overview

TopologyBuck Converter
IC revision1.0

Description

The AmP™ device is an FPGA based platform for creating a custom Power Management Integrated Circuit (PMIC). The AmP device is customized by adding available Power Components designs based on system requirements. AmP device customization is as easy as using WebAmp™ application software to produce a customized PMIC in a very short period of time. AmP devices can be used to power FPGAs, Processors, Microcontrollers, and ASICs by integrating multiple power rails into single chip designs. The AmP device input voltage range is 4.5V to 20V. The AmP device is targeted for wall-powered applications or 2S-4S Li-Ion battery packs. AmP devices have up to 4 additional integrated LDOs of which two are fixed output voltages (3.3V and 1.2V) and two are user programmable.

Features

  • Enables On-Demand power management
  • Integrate application targeted Power Components
  • Power Blocks for a variety of topologies
    • Scalable Integrated N-channel MOSFETs (SIM)
    • Current sense for protection, telemetry, regulation
    • Build Switching topologies - Buck, Boost, Buck-Boost
    • Build Linear topologies - LDO, Load Switch
    • Build Mixed topologies - Battery Charger
    • Build BLDC (Motor Control) topologies – H-Bridge
  • Sensor Blocks, sensing voltages and currents
    • Regulation, protection and telemetry
    • Adaptive Digitizer (ADi)
    • Threshold Comparators (ThC)
    • Summation Amplifier (SuM)
    • Noise-Immune Reference (Nref) Array
  • Analog fabric connectivity for sensor signals
  • Digital μLogic fabric connectivity: Analog/Digital Blocks
    • Analog and Digital GPIOs, LUTs for logic & Interface
    • Integrated Compensator RAM (CRAM)
    • On-demand POL control loops and interfaces
    • Precision Modulation Timer Array
  • Industry first: Analog Proficiency – Digital Flexibility

Typical applications

  • Power Component Integrator / Digital power management IC / Battery Charger

More information

Products

Order Code
Data­sheet
Simu­lation
Downloads
Status
Product series
λDom typ.(nm)
Emitting Color
λPeak typ.(nm)
IV typ.(mcd)
VF typ.(V)
Chip Technology
50% typ.(°)
C
Tol. C
VR(V (DC))
Size
Operating Temperature
DF(%)
RISO
Ceramic Type
L(mm)
W(mm)
H(mm)
Fl(mm)
Packaging
L(µH)
IRP,40K(A)
ISAT,10%(A)
ISAT,30%(A)
RDC(mΩ)
fres(MHz)
Material
Endurance(h)
IRIPPLE(mA)
Z(mΩ)
ILeak(µA)
Ø D(mm)
Pins
Center pin Ø (Value)(mm)
Plug OD(mm)
Type
IR(A)
Working Voltage(V (DC))
Mount
Samples
WL-SMCW SMT Mono-color Chip LED Waterclear, 525 nm, Green
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Dominant Wavelength [typ.]525 nm
Emitting ColorGreen 
Peak Wavelength [typ.]515 nm
Luminous Intensity [typ.]430 mcd
Forward Voltage [typ.]3.2 V
Chip TechnologyInGaN 
Viewing Angle Phi 0° [typ.]140 °
Size0603 
Operating Temperature -40 °C up to +85 °C
Length1.6 mm
Width0.8 mm
Height0.7 mm
PackagingTape and Reel 
MountSMT 
WL-SMCW SMT Mono-color Chip LED Waterclear, 625 nm, Red
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Dominant Wavelength [typ.]625 nm
Emitting ColorRed 
Peak Wavelength [typ.]630 nm
Luminous Intensity [typ.]250 mcd
Forward Voltage [typ.]2 V
Chip TechnologyAlInGaP 
Viewing Angle Phi 0° [typ.]140 °
Size0603 
Operating Temperature -40 °C up to +85 °C
Length1.6 mm
Width0.8 mm
Height0.7 mm
PackagingTape and Reel 
MountSMT 
WE-HCI SMT Flat Wire High Current Inductor, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Size5040 
Operating Temperature -40 °C up to +150 °C
Length5.5 mm
Width5.3 mm
Height4 mm
Inductance1 µH
Performance Rated Current14.8 A
Saturation Current @ 10%5.5 A
Saturation Current @ 30%11.5 A
DC Resistance4.75 mΩ
Self Resonant Frequency158 MHz
MaterialSuperflux 
Pins
MountSMT 
WCAP-ASLI Aluminum Electrolytic Capacitors, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance220 µF
Capacitance±20% 
Rated Voltage35 V (DC)
Size8.0 x 10.5 
Operating Temperature -55 °C up to +105 °C
Dissipation Factor14 %
Insulation Resistance0.454545 MΩ
Length10.5 mm
Width8.3 mm
Packaging15" Tape & Reel 
Endurance 2000
Ripple Current570 mA
Impedance210 mΩ
Leakage Current77 µA
Diameter8 mm
MountV-Chip SMT 
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3 %
Insulation Resistance5 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0805 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Insulation Resistance5 GΩ
Ceramic TypeX7R Class II 
Length2 mm
Width1.25 mm
Height0.8 mm
Pad Dimension0.5 mm
Packaging7" Tape & Reel 
WR-DC Power Jacks, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Product seriesWR-DC Power Jacks
Operating Temperature -40 °C up to +85 °C
Insulation Resistance100 MΩ
PackagingTape and Reel 
Center pin Ø2.5 mm
Recommended Plug outer Ø5.5 mm
TypeRight Angled 
Rated Current5 A
Working Voltage24 V (DC)
MountSMT 
WR-PHD Pin Header - Single, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Operating Temperature -40 °C up to +105 °C
Insulation Resistance1000 MΩ
Length7.62 mm
PackagingBag 
Pins
TypeStraight 
Rated Current3 A
Working Voltage250 V (DC)
MountTHT 
WR-PHD Pin Header - Dual, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Operating Temperature -40 °C up to +105 °C
Insulation Resistance1000 MΩ
Length5.08 mm
PackagingBag 
Pins
TypeStraight 
Rated Current3 A
Working Voltage250 V (DC)
MountTHT