IC manufacturers Texas Instruments

IC manufacturers (103)

Texas Instruments MSP430F5529 | Demoboard TIDA-00662

High Performance Capacitive Sensor Front End Reference Design

Overview

TopologyOther Topology
Input voltage5 V
Switching frequency25000 kHz
IC revisionA

Description

The Texas Instruments MSP430 family of ultra-low-power MCUs consists of several devices featuringdifferent sets of peripherals targeted for various applications. The architecture, combined with extensivelow-power modes, is optimized to achieve extended battery life in portable measurement applications. Thedevice features a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute tomaximum code efficiency. The digitally controlled oscillator (DCO) allows wake-up from low-power modesto active mode in 3.5 μs (typical). The MSP430F5529 is a MCU configuration with integrated USB andPHY supporting USB 2.0, four 16-bit timers, a high performance 12-bit ADC, two universal serialcommunication interfaces (USCI), hardware multiplier, DMA, real-time clock module with alarmcapabilities, and 63 I/O pins (see Figure 19). Typical applications include analog and digital sensorsystems, data loggers, and others that require connectivity to various USB hosts.

Features

  • Low supply-voltage range: 3.6 V down to 1.8 V
  • Ultra-low-power consumption– Active mode (AM):
  • All system clocks active
  • 290 μA/MHz at 8 MHz, 3.0 V, flash program execution (typ)
  • 150 μA/MHz at 8 MHz, 3.0 V, RAM program execution (typ)– Standby Mode (LPM3):
  • Real-time clock with crystal, watchdog, and supply supervisor operational, full RAM Retention,fast wake-up: 1.9 μA at 2.2 V, 2.1 μA at 3.0 V (typ)
  • Low-power oscillator (VLO), general-purpose counter, watchdog, and supply supervisoroperational, full RAM retention, fast wake-up: 1.4 μA at 3.0 V (typ)– Off Mode (LPM4):
  • Full RAM Retention, Supply Supervisor Operational, Fast Wake-up: 1.1 μA at 3.0 V (typ)– Shutdown Mode (LPM4.5): 0.18 μA at 3.0 V (typ)
  • Wake-up from standby mode in 3.5 μs (typ)
  • 16-Bit RISC architecture, extended memory, up to 25-MHz system clock
  • Flexible power management system– Fully Integrated LDO with programmable regulated core supply voltage– Supply voltage supervision, monitoring, and brownout
  • Unified Clock System– FLL control loop for frequency stabilization– Low-power low-frequency internal clock source (VLO)– Low-frequency trimmed internal reference source (REFO)– 32-kHz watch crystals (XT1)– High-frequency crystals up to 32 MHz (XT2)
  • 16-Bit Timer TA0, Timer_A with five capture and compare registers
  • 16-Bit Timer TA1, Timer_A with three capture and compare registers
  • 16-Bit Timer TA2, Timer_A with three capture and compare registers
  • 16-Bit Timer TB0, Timer_B with seven capture and compare shadow registers
  • Two universal serial communication interfaces– USCI_A0 and USCI_A1 each support:
  • Enhanced UART supports auto-baudrate detection
  • IrDA encoder and decoder
  • Synchronous SPI– USCI_B0 and USCI_B1 each support:
  • I2CTM
  • Synchronous SPI– Full-speed universal serial bus (USB)
  • Integrated USB-PHY
  • Integrated 3.3-V and 1.8-V USB power system
  • Integrated USB-PLL
  • Eight I/O endpoints– 12-Bit ADC with internal reference, sample-and-hold, and autoscan feature– Comparator– Hardware multiplier supporting 32-bit operations– Serial onboard programming, no external programming voltage needed– Three channel internal DMA– Basic timer with real-time clock feature

Typical applications

  • Sensors and Field Transmitters
  • Factory Automation and Process Control

Products

Order Code
Data­sheet
Simu­lation
Downloads
Status
Product series
λDom typ.(nm)
Emitting Color
λPeak typ.(nm)
IV typ.(mcd)
VF typ.(V)
Chip Technology
50% typ.(°)
C
Tol. C
Size
Operating Temperature
Q(%)
DF(%)
RISO
Ceramic Type
L(mm)
W(mm)
H(mm)
Fl(mm)
Packaging
Interface Type
Variant
Gender
Pins
Mount
Working Voltage(V (AC))
Z @ 100 MHz(Ω)
Zmax(Ω)
Test Condition Zmax
IR 2(mA)
RDC max.(Ω)
Type
Winding Style
L(µH)
IR(mA)
VR(V)
VT(V (DC))
Samples
WL-SMCW SMT Mono-color Chip LED Waterclear, 625 nm, Red
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Dominant Wavelength [typ.]625 nm
Emitting ColorRed 
Peak Wavelength [typ.]630 nm
Luminous Intensity [typ.]150 mcd
Forward Voltage [typ.]2 V
Chip TechnologyAlInGaP 
Viewing Angle Phi 0° [typ.]140 °
Size1206 
Operating Temperature -40 °C up to +85 °C
Length3.2 mm
Width1.6 mm
Height0.68 mm
PackagingTape and Reel 
MountSMT 
WE-CBF SMT EMI Suppression Ferrite Bead, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Size0603 
Operating Temperature -55 °C up to +125 °C
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.3 mm
MountSMT 
Impedance @ 100 MHz600 Ω
Maximum Impedance800 Ω
Maximum Impedance200 MHz 
Rated Current 21000 mA
DC Resistance0.2 Ω
TypeHigh Current 
Rated Current800 mA
WE-CNSW SMT Common Mode Line Filter, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Size1206 
Operating Temperature -40 °C up to +125 °C
Length3.2 mm
Width1.6 mm
Height1.8 mm
Pins
MountSMT 
Impedance @ 100 MHz90 Ω
DC Resistance0.3 Ω
Winding Stylebifilar 
Inductance0.111 µH
Rated Current370 mA
Rated Voltage50 V
Insulation Test Voltage125 V (DC)
WCAP-CSGP MLCCs 16 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance10 pF
Capacitance±5% 
Size0402 
Operating Temperature -55 °C up to +125 °C
Q-Factor600 %
Insulation Resistance10 GΩ
Ceramic TypeNP0 Class I 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Rated Voltage16 V
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance33 pF
Capacitance±5% 
Size0402 
Operating Temperature -55 °C up to +125 °C
Q-Factor1000 %
Insulation Resistance10 GΩ
Ceramic TypeNP0 Class I 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Rated Voltage25 V
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance15 pF
Capacitance±5% 
Size0402 
Operating Temperature -55 °C up to +125 °C
Q-Factor700 %
Insulation Resistance10 GΩ
Ceramic TypeNP0 Class I 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Rated Voltage50 V
WCAP-CSGP MLCCs 16 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance2.2 nF
Capacitance±10% 
Size0402 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Rated Voltage16 V
WCAP-CSGP MLCCs 16 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance10 nF
Capacitance±10% 
Size0402 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Rated Voltage16 V
WCAP-CSGP MLCCs 16 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance47 nF
Capacitance±10% 
Size0402 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Rated Voltage16 V
WCAP-CSGP MLCCs 16 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Capacitance±10% 
Size0402 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor5 %
Insulation Resistance5 GΩ
Ceramic TypeX7R Class II 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Rated Voltage16 V
WCAP-CSGP MLCCs 16 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Capacitance±10% 
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3.5 %
Insulation Resistance5 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
Rated Voltage16 V
WCAP-CSGP MLCCs 16 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance220 nF
Capacitance±10% 
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor5 %
Insulation Resistance2.3 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
Rated Voltage16 V
WCAP-CSGP MLCCs 16 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance470 nF
Capacitance±10% 
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor5 %
Insulation Resistance1.1 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
Rated Voltage16 V
WCAP-CSGP MLCCs 16 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance680 nF
Capacitance±10% 
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor10 %
Insulation Resistance0.7 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
Rated Voltage16 V
WCAP-CSGP MLCCs 16 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 µF
Capacitance±10% 
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor10 %
Insulation Resistance0.1 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
Rated Voltage16 V
WCAP-CSGP MLCCs 10 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance4.7 µF
Capacitance±10% 
Size0805 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor10 %
Insulation Resistance0.02 GΩ
Ceramic TypeX7R Class II 
Length2 mm
Width1.25 mm
Height1.25 mm
Pad Dimension0.5 mm
Packaging7" Tape & Reel 
Rated Voltage10 V
WR-USB Mini/Micro Connectors, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Operating Temperature -40 °C up to +105 °C
Insulation Resistance1000 MΩ
PackagingTape and Reel 
Interface TypeType B 
Variantwith Pads & Pegs 
GenderReceptacle 
Pins
MountSMT 
Working Voltage30 V (AC)
TypeHorizontal 
Rated Current1000 mA
WR-PHD Pin Header - Single, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Operating Temperature -40 °C up to +105 °C
Insulation Resistance1000 MΩ
Length5.08 mm
PackagingBag 
GenderPin Header 
Pins
MountTHT 
Working Voltage250 V (AC)
TypeStraight 
Rated Current3000 mA
WR-PHD Pin Header - Single, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Operating Temperature -40 °C up to +105 °C
Insulation Resistance1000 MΩ
Length7.62 mm
PackagingBag 
GenderPin Header 
Pins
MountTHT 
Working Voltage250 V (AC)
TypeStraight 
Rated Current3000 mA