IC-Hersteller Texas Instruments

IC-Hersteller (96)

Texas Instruments MSP430F5529 | Demoboard TIDA-00662

High Performance Capacitive Sensor Front End Reference Design

Details

TopologieSonstige Topologie
Eingangsspannung5 V
Schaltfrequenz25000 kHz
IC-RevisionA

Beschreibung

The Texas Instruments MSP430 family of ultra-low-power MCUs consists of several devices featuringdifferent sets of peripherals targeted for various applications. The architecture, combined with extensivelow-power modes, is optimized to achieve extended battery life in portable measurement applications. Thedevice features a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute tomaximum code efficiency. The digitally controlled oscillator (DCO) allows wake-up from low-power modesto active mode in 3.5 μs (typical). The MSP430F5529 is a MCU configuration with integrated USB andPHY supporting USB 2.0, four 16-bit timers, a high performance 12-bit ADC, two universal serialcommunication interfaces (USCI), hardware multiplier, DMA, real-time clock module with alarmcapabilities, and 63 I/O pins (see Figure 19). Typical applications include analog and digital sensorsystems, data loggers, and others that require connectivity to various USB hosts.

Eigenschaften

  • Low supply-voltage range: 3.6 V down to 1.8 V
  • Ultra-low-power consumption– Active mode (AM):
  • All system clocks active
  • 290 μA/MHz at 8 MHz, 3.0 V, flash program execution (typ)
  • 150 μA/MHz at 8 MHz, 3.0 V, RAM program execution (typ)– Standby Mode (LPM3):
  • Real-time clock with crystal, watchdog, and supply supervisor operational, full RAM Retention,fast wake-up: 1.9 μA at 2.2 V, 2.1 μA at 3.0 V (typ)
  • Low-power oscillator (VLO), general-purpose counter, watchdog, and supply supervisoroperational, full RAM retention, fast wake-up: 1.4 μA at 3.0 V (typ)– Off Mode (LPM4):
  • Full RAM Retention, Supply Supervisor Operational, Fast Wake-up: 1.1 μA at 3.0 V (typ)– Shutdown Mode (LPM4.5): 0.18 μA at 3.0 V (typ)
  • Wake-up from standby mode in 3.5 μs (typ)
  • 16-Bit RISC architecture, extended memory, up to 25-MHz system clock
  • Flexible power management system– Fully Integrated LDO with programmable regulated core supply voltage– Supply voltage supervision, monitoring, and brownout
  • Unified Clock System– FLL control loop for frequency stabilization– Low-power low-frequency internal clock source (VLO)– Low-frequency trimmed internal reference source (REFO)– 32-kHz watch crystals (XT1)– High-frequency crystals up to 32 MHz (XT2)
  • 16-Bit Timer TA0, Timer_A with five capture and compare registers
  • 16-Bit Timer TA1, Timer_A with three capture and compare registers
  • 16-Bit Timer TA2, Timer_A with three capture and compare registers
  • 16-Bit Timer TB0, Timer_B with seven capture and compare shadow registers
  • Two universal serial communication interfaces– USCI_A0 and USCI_A1 each support:
  • Enhanced UART supports auto-baudrate detection
  • IrDA encoder and decoder
  • Synchronous SPI– USCI_B0 and USCI_B1 each support:
  • I2CTM
  • Synchronous SPI– Full-speed universal serial bus (USB)
  • Integrated USB-PHY
  • Integrated 3.3-V and 1.8-V USB power system
  • Integrated USB-PLL
  • Eight I/O endpoints– 12-Bit ADC with internal reference, sample-and-hold, and autoscan feature– Comparator– Hardware multiplier supporting 32-bit operations– Serial onboard programming, no external programming voltage needed– Three channel internal DMA– Basic timer with real-time clock feature

Typische Anwendungen

  • Sensors and Field Transmitters
  • Factory Automation and Process Control

Weiterführende Informationen

Artikeldaten

Artikel Nr. Daten­blatt Simu­lation Downloads ProduktserieλDom typ.
(nm)
FarbeλPeak typ.
(nm)
IV typ.
(mcd)
VF typ.
(V)
Chiptechnologie50% typ.
(°)
CTol. CBauformBetriebstemperaturQ
(%)
DF
(%)
RISOKeramiktypL
(mm)
W
(mm)
Fl
(mm)
Interface typMontageartIR 1
(mA)
Arbeitsspannung
(V (AC))
Z @ 100 MHz
(Ω)
Zmax
(Ω)
Testbedingung ZmaxIR 2
(mA)
RDC max.
(Ω)
TypL
(µH)
IR
(mA)
VR
(V (DC))
AnwendungPinsReihenH
(mm)
GenderVerpackung Muster
150120RS75000SPEC
7 Dateien WL-SMCW SMT Mono-color Chip LED Waterclear 625 Rot 630 150 2 AlInGaP 140 1206 -40 °C up to +85 °C 3.2 1.6 SMT 0.68 Tape and Reel
742792651SPEC
9 Dateien WE-CBF SMT-Ferrit 0603 -55 °C up to +125 °C 1.6 0.8 0.3 SMT 1000 600 800 200 MHz 1000 0.2 High Current 800 0.8
744232090SPEC
9 Dateien WE-CNSW Stromkompensierter SMT Line Filter 1206 -40 °C up to +125 °C 90 0.111 370
885012005025SPEC
8 Dateien WCAP-CSGP MLCCs 16 V(DC)10 pF ±5% 0402 -55 °C up to +125 °C 60010 GΩ NP0 Klasse I 1 0.5 0.25 16 0.5 7" Tape & Reel
885012005043SPEC
8 Dateien WCAP-CSGP MLCCs 25 V(DC)33 pF ±5% 0402 -55 °C up to +125 °C 100010 GΩ NP0 Klasse I 1 0.5 0.25 25 0.5 7" Tape & Reel
885012005056SPEC
8 Dateien WCAP-CSGP MLCCs 50 V(DC)15 pF ±5% 0402 -55 °C up to +125 °C 70010 GΩ NP0 Klasse I 1 0.5 0.25 50 0.5 7" Tape & Reel
885012205027SPEC
8 Dateien WCAP-CSGP MLCCs 16 V(DC)2.2 nF ±10% 0402 -55 °C up to +125 °C 3.510 GΩ X7R Klasse II 1 0.5 0.25 16 0.5 7" Tape & Reel
885012205031SPEC
8 Dateien WCAP-CSGP MLCCs 16 V(DC)10 nF ±10% 0402 -55 °C up to +125 °C 3.510 GΩ X7R Klasse II 1 0.5 0.25 16 0.5 7" Tape & Reel
885012205035SPEC
5 Dateien WCAP-CSGP MLCCs 16 V(DC)47 nF ±10% 0402 -55 °C up to +125 °C 510 GΩ X7R Klasse II 1 0.5 0.25 16 0.5 7" Tape & Reel
885012205037SPEC
5 Dateien WCAP-CSGP MLCCs 16 V(DC)100 nF ±10% 0402 -55 °C up to +125 °C 55 GΩ X7R Klasse II 1 0.5 0.25 16 0.5 7" Tape & Reel
885012206046SPEC
8 Dateien WCAP-CSGP MLCCs 16 V(DC)100 nF ±10% 0603 -55 °C up to +125 °C 3.55 GΩ X7R Klasse II 1.6 0.8 0.4 16 0.8 7" Tape & Reel
885012206048SPEC
8 Dateien WCAP-CSGP MLCCs 16 V(DC)220 nF ±10% 0603 -55 °C up to +125 °C 52.3 GΩ X7R Klasse II 1.6 0.8 0.4 16 0.8 7" Tape & Reel
885012206050SPEC
8 Dateien WCAP-CSGP MLCCs 16 V(DC)470 nF ±10% 0603 -55 °C up to +125 °C 51.1 GΩ X7R Klasse II 1.6 0.8 0.4 16 0.8 7" Tape & Reel
885012206051SPEC
8 Dateien WCAP-CSGP MLCCs 16 V(DC)680 nF ±10% 0603 -55 °C up to +125 °C 100.7 GΩ X7R Klasse II 1.6 0.8 0.4 16 0.8 7" Tape & Reel
885012206052SPEC
8 Dateien WCAP-CSGP MLCCs 16 V(DC)1 µF ±10% 0603 -55 °C up to +125 °C 100.1 GΩ X7R Klasse II 1.6 0.8 0.4 16 0.8 7" Tape & Reel
885012207025SPEC
8 Dateien WCAP-CSGP MLCCs 10 V(DC)4.7 µF ±10% 0805 -55 °C up to +125 °C 100.02 GΩ X7R Klasse II 2 1.25 0.5 10 1.25 7" Tape & Reel
629105136821SPEC
6 Dateien WR-COM Micro USB 2.0 SMT Type B Horizontal 5 Contacts -40 °C up to +105 °C1000 MΩ Type B SMT 1000 30 Horizontal 1000 Micro USB 2.0 5 Receptacle Tape and Reel
61300211121SPEC
6 Dateien WR-PHD 2.54 mm THT Pin Header -40 °C up to +105 °C1000 MΩ 5.08 THT 250 Gerade 3000 2 Single Pin Header Beutel
61300311121SPEC
6 Dateien WR-PHD 2.54 mm THT Pin Header -40 °C up to +105 °C1000 MΩ 7.62 THT 250 Gerade 3000 3 Single Pin Header Beutel
Muster
Artikel Nr. Daten­blatt Simu­lation Downloads ProduktserieλDom typ.
(nm)
FarbeλPeak typ.
(nm)
IV typ.
(mcd)
VF typ.
(V)
Chiptechnologie50% typ.
(°)
CTol. CBauformBetriebstemperaturQ
(%)
DF
(%)
RISOKeramiktypL
(mm)
W
(mm)
Fl
(mm)
Interface typMontageartIR 1
(mA)
Arbeitsspannung
(V (AC))
Z @ 100 MHz
(Ω)
Zmax
(Ω)
Testbedingung ZmaxIR 2
(mA)
RDC max.
(Ω)
TypL
(µH)
IR
(mA)
VR
(V (DC))
AnwendungPinsReihenH
(mm)
GenderVerpackung Muster