IC manufacturers Onsemi

IC manufacturers (103)

Onsemi NFAM5065L4B | Demoboard STR-MDK-4KW-65SPM31-GEVK

4kW 650V Industrial Motor Control

Overview

TopologyPositive to Negative Converter
Input voltage15 V

Description

The STR-MDK-4KW-65SPM31-GEVK is a Motor Development Kit (MDK) for three-phase motor drives. The kit features the NFAM5065L4B Intelligent Power Module in a DIP39 package and rated for 400 VDC input, delivering up to 4 kW of power. The board is fully compatible with the Universal Controller Board (UCB), based on theXilinx® Zynq®-7000 SoC, which embeds FPGA logic and two ARM® Cortex-A9 processors , and part of the Motor Development Kit (MDK) family. As such, the system is fit for high-end control strategies and enables operation of a variety of motor technologies (AC induction motor, PMSM, BLDC, etc.). As part of the Motor Development Kit (MDK), the Compact IPM Motor Drive is compatible with the powerful Universal Controller Board (UCB), enabling high-end control strategies and AI capabilities for industrial motor control. The Strata graphical user interface ensures an easy startup for evaluation purposes like controlling motor voltage/frequency,choosing between closed loop Field Oriented Control (FOC) and open loop V/F, etc. Through Strata, the developercan do full evaluation and access datasheets, BOMs, schematics, and other collateral they may need.

Features

  • Motor Development Kit (MDK)
  • Compatible with the Universal Controller Board (UCB) FPGA/ARM
  • Fully compatible with Xilinx® development tools for Zynq®-7000
  • Downloadable V/f and FOC control use cases for the UCB
  • 4 kW motor control solution supplied up to 410 VDC
  • MDK FPGA-controller based on Xilinx® Zynq®-7000 SoC, including a dual 667 MHz CPU Cortex A9 core with freelyconfigurable digital peripheral, 32 Mbyte Flash, up to 1 GB RAM, USB / UART / JTAG interface, on-board Ethernetphy, bootloader capability via micro SD card, 10 ADC channel, using NCD98011, and 12 complementary PWMchannels, capable of delivering advanced networked motor and motion control systems
  • Highly integrated power module NFAM5065L4B containing an inverter power stage for a high voltage 3-phase inverter in a DIP39 package delivering
  • DC/DC converter producing auxiliary power supply 15 VDC - non-isolated buck converter using NCP1063, DC/DC converter producing auxiliary power supply 5 VDC - non-isolated buck converter using NCV890100MWTXG, and LDO producing auxiliary power supply 3.3 VDC - using NCP718
  • Three-phase current measurement using 3 x NCS20166 operational amplifiers
  • Three-phase inverter voltage and DC-Link voltage measurement – using resistive voltage divider circuit
  • 512 kB EEPROM I2C - using CAT24C512
  • Encoder Interface compatible with either 3-HALL sensors 1 Channel Quadrature encoder
  • Temperature sensing via build in thermistor
  • Over current protection using NCS2250 comparator
  • Xilinx® development tools and environments are available for the MDK, such as Vitis and Vivado to program the FPGA

Typical applications

  • White goods (Washing machines)
  • Industrial fans, Industrial Motor Control, Industrial automation

Products

Order Code
Data­sheet
Simu­lation
Downloads
Status
Product series
C
Tol. C
VR(V (DC))
Size
Qmin.
DF(%)
RISO
Ceramic Type
L(mm)
W(mm)
H(mm)
Fl(mm)
Packaging
Operating Temperature
Q(%)
Endurance(h)
IRIPPLE(mA)
ILeak(µA)
Pitch(mm)
Ø D(mm)
RESR(mΩ)
Mount
IR(A)
Stranded Wire Section (AWG)
Working Voltage(V (AC))
Pins
PCB/Cable/Panel
Modularity
Type
Wire Section
Samples
WCAP-CSGP MLCCs 50 V(DC), 100 pF, ±5%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 pF
Capacitance±5% 
Rated Voltage50 V (DC)
Size0603 
Insulation Resistance10 GΩ
Ceramic TypeNP0 Class I 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
Operating Temperature -55 °C up to +125 °C
Q-Factor1000 %
WCAP-CSGP MLCCs 50 V(DC), 1 nF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0603 
Q-Factor [1]600 
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
Operating Temperature -55 °C up to +125 °C
WCAP-CSGP MLCCs 50 V(DC), 15 nF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance15 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0603 
Q-Factor [1]600 
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
Operating Temperature -55 °C up to +125 °C
WCAP-CSGP MLCCs 25 V(DC), 100 nF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Capacitance±10% 
Rated Voltage25 V (DC)
Size0603 
Q-Factor [1]600 
Dissipation Factor3.5 %
Insulation Resistance5 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
Operating Temperature -55 °C up to +125 °C
WCAP-CSGP MLCCs 25 V(DC), 100 nF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Capacitance±10% 
Rated Voltage25 V (DC)
Size0805 
Q-Factor [1]600 
Dissipation Factor3.5 %
Insulation Resistance5 GΩ
Ceramic TypeX7R Class II 
Length2 mm
Width1.25 mm
Height0.8 mm
Pad Dimension0.5 mm
Packaging7" Tape & Reel 
Operating Temperature -55 °C up to +125 °C
WCAP-CSMH Mid and High Voltage, 100 nF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Capacitance±10% 
Rated Voltage630 V (DC)
Size1812 
Dissipation Factor2.5 %
Insulation Resistance1 GΩ
Ceramic TypeX7R Class II 
Length4.5 mm
Width3.2 mm
Height2 mm
Pad Dimension0.5 mm
Packaging7" Tape & Reel 
Operating Temperature -55 °C up to +125 °C
Q-Factor600 %
WCAP-PSLC Aluminum Polymer Capacitors, 330 µF, ±20%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance330 µF
Capacitance±20% 
Rated Voltage35 V (DC)
Size10.0 x 12.4 
Dissipation Factor12 %
Length12.4 mm
Width10.3 mm
Packaging15" Tape & Reel 
Operating Temperature -55 °C up to +105 °C
Endurance 2000
Ripple Current4400 mA
Leakage Current2310 µA
Diameter10 mm
ESR20 mΩ
MountV-Chip SMT 
WCAP-AI3H Aluminum Electrolytic Capacitors, 470 µF, ±20%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance470 µF
Capacitance±20% 
Rated Voltage450 V (DC)
Size35.0 x 50.0 
Dissipation Factor20 %
Length52 mm
PackagingTray 
Operating Temperature -25 °C up to +105 °C
Endurance 3000
Ripple Current1850 mA
Leakage Current1379.67 µA
Pitch10 mm
Diameter35 mm
ESR195 mΩ
WR-BHD 2.00 mm Male, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Product seriesWR-BHD 2.00 mm Male
Insulation Resistance1000 MΩ
Length27.2 mm
PackagingTray 
Operating Temperature -40 °C up to +125 °C
Pitch2 mm
MountTHT 
Rated Current2 A
Working Voltage250 V (AC)
Pins20 
PCB/Cable/PanelPCB 
TypeStraight 
WR-TBL Series 314 - 5.08 mm Close PCB Header, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Length16.64 mm
PackagingBox 
Operating Temperature -40 °C up to +105 °C
Pitch5.08 mm
MountTHT 
Rated Current20 A
Working Voltage320 V (AC)
Pins
PCB/Cable/PanelPCB 
ModularityNo 
Type45° 
WR-TBL Series 351 - 5.08 mm Vertical, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Length15.24 mm
PackagingBox 
Operating Temperature -40 °C up to +105 °C
Pitch5.08 mm
MountCable 
Rated Current20 A
Stranded Wire Section (AWG)12 to 24 (AWG) 
Working Voltage320 V (AC)
Pins
PCB/Cable/PanelCable 
ModularityNo 
TypeVertical 
Wire Section 12 to 24 (AWG) 3.31 to 0.205 (mm²)
WR-PHD Pin Header - Single, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Insulation Resistance1000 MΩ
Length12.7 mm
PackagingBag 
Operating Temperature -40 °C up to +105 °C
Pitch2.54 mm
MountTHT 
Rated Current3 A
Working Voltage250 V (AC)
Pins
TypeStraight