IC-Hersteller Onsemi
IC-Hersteller (103)
- Alle Hersteller
Analog Devices
Infineon Technologies
Microchip
Onsemi
Renesas
ROHM
STMicroelectronics
Texas Instruments
- 3peak incorporated (28)
- Ablic (23)
- Acco Semiconductor (1)
- Advanced Power (4)
- Allegro Microsystems (100)
- Alpha & Omega Semiconductor (37)
- AnalogySemi (3)
- AnDAPT Inc (204)
- Anpec (13)
- AXElite (2)
- Backward (6)
- Bright Power Semiconductor (1)
- Broadcom (46)
- Cambridge GaN Devices (18)
- Chipanalog Micro (10)
- Cologne Chips (1)
- Convenient Power (1)
- Dialog Semiconductor (12)
- Diodes Incorporated (259)
- Divimath (8)
- Elmos AG (1)
- EPC (140)
- e-Peas Semiconductors (1)
- Eta Solutions Co. Ltd. (9)
- GaN Systems (8)
- GaNPower (3)
- Giantec (1)
- Gstek Wuxi (1)
- Helix Semiconductor (7)
- IKON (1)
- Indie Semiconductor (8)
- Innovision Semiconductor Inc (2)
- Intel (68)
- Inventchip Technology (3)
- ISSI (51)
- JoulWatt (20)
- KDPOF (3)
- Kinetic Technology (8)
- Lattice semiconductor Corporation (38)
- Littelfuse (1)
- Lumissil Microsystems (8)
- M3 Technology (M3Tek) (7)
- Macnica (22)
- Marvell Semiconductor (1)
- MaxLinear (181)
- Menlo Micro (1)
- MikroE (25)
- MindCet (2)
- Monolithic Power Systems (980)
- Navitas Semiconductor Inc (6)
- NewEdge Technologies, Inc. (1)
- Nexperia (267)
- Nisshinbo Micro Device Inc. (10)
- Novosense Micro (1)
- NXP (337)
- O2 Micro International Ltd (10)
- On Bright (7)
- Panasonic (2)
- PN Junction Semiconductor (2)
- Power Integrations (117)
- Powermat (1)
- Pulsiv (19)
- Qorvo (97)
- Realsil SuRealsil(tek) Microelectronics (1)
- Richtek (297)
- Sanken Electric Co., Ltd. (16)
- Sckipio (6)
- Semtech (86)
- SG-Micro (58)
- SiFive (2)
- Silanna Semiconductor (9)
- Silergy Corporation (33)
- Silicon Laboratory Inc. (108)
- Silicontent Technology (59)
- Silvertel (59)
- Skycore Semiconductors (1)
- Skyworks (33)
- Southchip (14)
- Summit Wireless (1)
- Tagore Tech (7)
- Taiwan Semiconductor (1)
- TDK Corporation (1)
- Tempo Semiconductor (1)
- Torex (37)
- Toshiba (25)
- Transphorm (21)
- TransSIP (2)
- Union (21)
- uPI Semiconductor (2)
- Valens Semiconductor (31)
- Wise Integration (3)
- Wolfspeed (23)
- Xilinx (22)
- XL Semiconductor (3)
- XYSemi (62)
Details
| Topologie | Inverswandler |
| Eingangsspannung | 15 V |
Beschreibung
The STR-MDK-4KW-65SPM31-GEVK is a Motor Development Kit (MDK) for three-phase motor drives. The kit features the NFAM5065L4B Intelligent Power Module in a DIP39 package and rated for 400 VDC input, delivering up to 4 kW of power. The board is fully compatible with the Universal Controller Board (UCB), based on theXilinx® Zynq®-7000 SoC, which embeds FPGA logic and two ARM® Cortex-A9 processors , and part of the Motor Development Kit (MDK) family. As such, the system is fit for high-end control strategies and enables operation of a variety of motor technologies (AC induction motor, PMSM, BLDC, etc.). As part of the Motor Development Kit (MDK), the Compact IPM Motor Drive is compatible with the powerful Universal Controller Board (UCB), enabling high-end control strategies and AI capabilities for industrial motor control. The Strata graphical user interface ensures an easy startup for evaluation purposes like controlling motor voltage/frequency,choosing between closed loop Field Oriented Control (FOC) and open loop V/F, etc. Through Strata, the developercan do full evaluation and access datasheets, BOMs, schematics, and other collateral they may need.
Eigenschaften
- Motor Development Kit (MDK)
- Compatible with the Universal Controller Board (UCB) FPGA/ARM
- Fully compatible with Xilinx® development tools for Zynq®-7000
- Downloadable V/f and FOC control use cases for the UCB
- 4 kW motor control solution supplied up to 410 VDC
- MDK FPGA-controller based on Xilinx® Zynq®-7000 SoC, including a dual 667 MHz CPU Cortex A9 core with freelyconfigurable digital peripheral, 32 Mbyte Flash, up to 1 GB RAM, USB / UART / JTAG interface, on-board Ethernetphy, bootloader capability via micro SD card, 10 ADC channel, using NCD98011, and 12 complementary PWMchannels, capable of delivering advanced networked motor and motion control systems
- Highly integrated power module NFAM5065L4B containing an inverter power stage for a high voltage 3-phase inverter in a DIP39 package delivering
- DC/DC converter producing auxiliary power supply 15 VDC - non-isolated buck converter using NCP1063, DC/DC converter producing auxiliary power supply 5 VDC - non-isolated buck converter using NCV890100MWTXG, and LDO producing auxiliary power supply 3.3 VDC - using NCP718
- Three-phase current measurement using 3 x NCS20166 operational amplifiers
- Three-phase inverter voltage and DC-Link voltage measurement – using resistive voltage divider circuit
- 512 kB EEPROM I2C - using CAT24C512
- Encoder Interface compatible with either 3-HALL sensors 1 Channel Quadrature encoder
- Temperature sensing via build in thermistor
- Over current protection using NCS2250 comparator
- Xilinx® development tools and environments are available for the MDK, such as Vitis and Vivado to program the FPGA
Typische Anwendungen
- White goods (Washing machines)
- Industrial fans, Industrial Motor Control, Industrial automation
Weiterführende Informationen
Artikeldaten
Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | C | Tol. C | VR(V (DC)) | Bauform | Qmin. | DF(%) | RISO | Keramiktyp | L(mm) | B(mm) | H(mm) | Fl(mm) | Verpackung | Betriebstemperatur | Q(%) | Endurance(h) | IRIPPLE(mA) | ILeak(µA) | Raster(mm) | Ø D(mm) | RESR(mΩ) | Montageart | IR(A) | Stranded Wire Section (AWG) | Arbeitsspannung(V (AC)) | Pins | PCB/Kabel/Panel | Modularity | Typ | Wire Section | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| WCAP-CSGP MLCCs 50 V(DC), 100 pF, ±5% | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 50 V(DC) | Kapazität100 pF | Kapazität±5% | Nennspannung50 V (DC) | Bauform0603 | – | – | Isolationswiderstand10 GΩ | KeramiktypNP0 Klasse I | Länge1.6 mm | Breite0.8 mm | Höhe0.8 mm | Pad Dimension0.4 mm | Verpackung7" Tape & Reel | Betriebstemperatur -55 °C up to +125 °C | Güte1000 % | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 50 V(DC), 1 nF, ±10% | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 50 V(DC) | Kapazität1 nF | Kapazität±10% | Nennspannung50 V (DC) | Bauform0603 | Güte [1]600 | Verlustfaktor2.5 % | Isolationswiderstand10 GΩ | KeramiktypX7R Klasse II | Länge1.6 mm | Breite0.8 mm | Höhe0.8 mm | Pad Dimension0.4 mm | Verpackung7" Tape & Reel | Betriebstemperatur -55 °C up to +125 °C | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 50 V(DC), 15 nF, ±10% | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 50 V(DC) | Kapazität15 nF | Kapazität±10% | Nennspannung50 V (DC) | Bauform0603 | Güte [1]600 | Verlustfaktor2.5 % | Isolationswiderstand10 GΩ | KeramiktypX7R Klasse II | Länge1.6 mm | Breite0.8 mm | Höhe0.8 mm | Pad Dimension0.4 mm | Verpackung7" Tape & Reel | Betriebstemperatur -55 °C up to +125 °C | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 25 V(DC), 100 nF, ±10% | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 25 V(DC) | Kapazität100 nF | Kapazität±10% | Nennspannung25 V (DC) | Bauform0603 | Güte [1]600 | Verlustfaktor3.5 % | Isolationswiderstand5 GΩ | KeramiktypX7R Klasse II | Länge1.6 mm | Breite0.8 mm | Höhe0.8 mm | Pad Dimension0.4 mm | Verpackung7" Tape & Reel | Betriebstemperatur -55 °C up to +125 °C | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 25 V(DC), 100 nF, ±10% | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 25 V(DC) | Kapazität100 nF | Kapazität±10% | Nennspannung25 V (DC) | Bauform0805 | Güte [1]600 | Verlustfaktor3.5 % | Isolationswiderstand5 GΩ | KeramiktypX7R Klasse II | Länge2 mm | Breite1.25 mm | Höhe0.8 mm | Pad Dimension0.5 mm | Verpackung7" Tape & Reel | Betriebstemperatur -55 °C up to +125 °C | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | |||||
 | WCAP-CSMH Mid and High Voltage, 100 nF, ±10% | Downloads8 Dateien | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSMH Mid and High Voltage | Kapazität100 nF | Kapazität±10% | Nennspannung630 V (DC) | Bauform1812 | – | Verlustfaktor2.5 % | Isolationswiderstand1 GΩ | KeramiktypX7R Klasse II | Länge4.5 mm | Breite3.2 mm | Höhe2 mm | Pad Dimension0.5 mm | Verpackung7" Tape & Reel | Betriebstemperatur -55 °C up to +125 °C | Güte600 % | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | |||
 | WCAP-PSLC Aluminium-Polymer-Kondensatoren, 330 µF, ±20% | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-PSLC Aluminium-Polymer-Kondensatoren | Kapazität330 µF | Kapazität±20% | Nennspannung35 V (DC) | Bauform10.0 x 12.4 | – | Verlustfaktor12 % | – | – | Länge12.4 mm | Breite10.3 mm | – | – | Verpackung15" Tape & Reel | Betriebstemperatur -55 °C up to +105 °C | – | Endurance 2000 | Rippelstrom4400 mA | Leckstrom2310 µA | – | Durchmesser10 mm | ESR (Serienersatzwiderstand)20 mΩ | MontageartV-Chip SMT | – | – | – | – | – | – | – | – | ||||
 | WCAP-AI3H Aluminium-Elektrolytkondensatoren, 470 µF, ±20% | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-AI3H Aluminium-Elektrolytkondensatoren | Kapazität470 µF | Kapazität±20% | Nennspannung450 V (DC) | Bauform35.0 x 50.0 | – | Verlustfaktor20 % | – | – | Länge52 mm | – | – | – | VerpackungTray | Betriebstemperatur -25 °C up to +105 °C | – | Endurance 3000 | Rippelstrom1850 mA | Leckstrom1379.67 µA | Raster10 mm | Durchmesser35 mm | ESR (Serienersatzwiderstand)195 mΩ | – | – | – | – | – | – | – | – | – | ||||
 | WR-BHD 2.00 mm Wannenstiftleiste, –, – | Simulation– | Downloads7 Dateien | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWR-BHD 2.00 mm Wannenstiftleiste | – | – | – | – | – | – | Isolationswiderstand1000 MΩ | – | Länge27.2 mm | – | – | – | VerpackungTray | Betriebstemperatur -40 °C up to +125 °C | – | – | – | – | Raster2 mm | – | – | MontageartTHT | Nennstrom2 A | – | Arbeitsspannung250 V (AC) | Pins20 | PCB/Kabel/PanelPCB | – | TypGerade | – | ||
 | WR-TBL Serie 314 - 5.08 mm Close PCB Header, –, – | Simulation– | Downloads6 Dateien | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWR-TBL Serie 314 - 5.08 mm Close PCB Header | – | – | – | – | – | – | – | – | Länge16.64 mm | – | – | – | VerpackungKarton | Betriebstemperatur -40 °C up to +105 °C | – | – | – | – | Raster5.08 mm | – | – | MontageartTHT | Nennstrom20 A | – | Arbeitsspannung320 V (AC) | Pins3 | PCB/Kabel/PanelPCB | ModularityNein | Typ45° | – | ||
 | WR-TBL Serie 351 - 5.08 mm Vertical, –, – | Simulation– | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWR-TBL Serie 351 - 5.08 mm Vertical | – | – | – | – | – | – | – | – | Länge15.24 mm | – | – | – | VerpackungKarton | Betriebstemperatur -40 °C up to +105 °C | – | – | – | – | Raster5.08 mm | – | – | MontageartKabel | Nennstrom20 A | Stranded Wire Section (AWG)12 to 24 (AWG) | Arbeitsspannung320 V (AC) | Pins3 | PCB/Kabel/PanelKabel | ModularityNein | TypVertikal | Wire Section 12 to 24 (AWG) 3.31 to 0.205 (mm²) | |||
 | WR-PHD Stiftleisten - Einreihig, –, – | Simulation– | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWR-PHD Stiftleisten - Einreihig | – | – | – | – | – | – | Isolationswiderstand1000 MΩ | – | Länge12.7 mm | – | – | – | VerpackungBeutel | Betriebstemperatur -40 °C up to +105 °C | – | – | – | – | Raster2.54 mm | – | – | MontageartTHT | Nennstrom3 A | – | Arbeitsspannung250 V (AC) | Pins5 | – | – | TypGerade | – |