IC manufacturers Nexperia

IC manufacturers (103)

Nexperia GAN111-650WSB | Demoboard NX-HB-GAN111UL

NX-HB-GAN111UL half-bridge evaluation board

Overview

TopologyHalf-Bridge Converter symmetrical isolated
Input voltage400 V
IC revision1

Description

The NX-HB-GAN111UL half-bridge evaluation board provides the elements of a simple buck or boost converter. This enables the basic study of the switching characteristics and efficiency achievable with Nexperia’s 650V Cascode GaN FETs. The circuit is configured for synchronous rectification, in either buck or boost mode. Selection jumpers allow the use of a single logic input or separate high / low level inputs. The voltage input and output can operate at up to 400 VDC, with a power output > 2000 Watts.

Features

  • Simple gate drive (0 V to +10 V or +12 V)
  • Robust gate oxide (±20 V capability)
  • High gate threshold voltage (+4 V) for very good gate bounce immunity
  • Very low source-drain voltage in reverse conduction mode
  • Transient over-voltage capability

Typical applications

  • Solar (PV) inverters
  • Servo motor drives, Hard and soft switching converters for industrial and datacom power, AC/DC Bridgeless totem-pole PFC, DC/DC High-frequency resonant converters, Datacom and telecom (AC/DC and DC/DC) converters
  • TV PSU and LED drivers

Products

Order Code
Data­sheet
Simu­lation
Downloads
Status
Product series
C
Tol. C
VR(V (DC))
Size
Qmin.
DF(%)
RISO
Ceramic Type
L(mm)
W(mm)
Fl(mm)
Packaging
Operating Temperature
Q(%)
SW(mm)
Pins
Type
Mount
IR(A)
Working Voltage(V (AC))
PCB/Cable/Panel
H(mm)
Ø OD(mm)
IR(A)
Ti
Tl(mm)
Samples
WCAP-CSGP MLCCs 100 V(DC), 100 pF, ±5%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 pF
Capacitance±5% 
Rated Voltage100 V (DC)
Size0603 
Q-Factor [1]1000 
Insulation Resistance10 GΩ
Ceramic TypeNP0 Class I 
Length1.6 mm
Width0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
Operating Temperature -55 °C up to +125 °C
Q-Factor1000 %
Height0.8 mm
WCAP-CSGP MLCCs 50 V(DC), 220 pF, ±5%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance220 pF
Capacitance±5% 
Rated Voltage50 V (DC)
Size0603 
Insulation Resistance10 GΩ
Ceramic TypeNP0 Class I 
Length1.6 mm
Width0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
Operating Temperature -55 °C up to +125 °C
Q-Factor1000 %
Height0.8 mm
WCAP-CSMH Mid and High Voltage, 10 nF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance10 nF
Capacitance±10% 
Rated Voltage1000 V (DC)
Size1206 
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length3.2 mm
Width1.6 mm
Pad Dimension0.6 mm
Packaging7" Tape & Reel 
Operating Temperature -55 °C up to +125 °C
Q-Factor600 %
Height1.25 mm
WCAP-CSGP MLCCs 50 V(DC), 100 nF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0603 
Q-Factor [1]600 
Dissipation Factor3 %
Insulation Resistance5 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
Operating Temperature -55 °C up to +125 °C
Height0.8 mm
WCAP-CSMH Mid and High Voltage, 100 nF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Capacitance±10% 
Rated Voltage1000 V (DC)
Size2220 
Dissipation Factor2.5 %
Insulation Resistance1 GΩ
Ceramic TypeX7R Class II 
Length5.7 mm
Width5 mm
Pad Dimension0.85 mm
Packaging7" Tape & Reel 
Operating Temperature -55 °C up to +125 °C
Q-Factor600 %
Height2.5 mm
WCAP-CSGP MLCCs 50 V(DC), 1 µF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 µF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0805 
Q-Factor [1]600 
Dissipation Factor10 %
Insulation Resistance0.1 GΩ
Ceramic TypeX7R Class II 
Length2 mm
Width1.25 mm
Pad Dimension0.5 mm
Packaging7" Tape & Reel 
Operating Temperature -55 °C up to +125 °C
Height1.25 mm
WCAP-CSGP MLCCs 25 V(DC), 2.2 µF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance2.2 µF
Capacitance±10% 
Rated Voltage25 V (DC)
Size0805 
Q-Factor [1]600 
Dissipation Factor10 %
Insulation Resistance0.05 GΩ
Ceramic TypeX7R Class II 
Length2 mm
Width1.25 mm
Pad Dimension0.5 mm
Packaging7" Tape & Reel 
Operating Temperature -55 °C up to +125 °C
Height1.25 mm
WCAP-CSGP MLCCs 50 V(DC), 10 µF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance10 µF
Capacitance±10% 
Rated Voltage50 V (DC)
Size1206 
Q-Factor [1]600 
Dissipation Factor10 %
Insulation Resistance0.005 GΩ
Ceramic TypeX5R Class II 
Length3.2 mm
Width1.6 mm
Pad Dimension0.6 mm
Packaging7" Tape & Reel 
Operating Temperature -55 °C up to +85 °C
Height1.6 mm
WR-WTB 2.54 mm Male Header, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Insulation Resistance1000 MΩ
Length7.62 mm
PackagingBag 
Operating Temperature -40 °C up to +105 °C
Pins
TypeVertical 
MountTHT 
Rated Current3 A
Working Voltage250 V (AC)
PCB/Cable/PanelPCB 
Rated Current3 A
WA-SPAII Plastic Spacer Stud, metric, internal/ internal, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Length15 mm
PackagingBag 
Operating Temperature -30 °C up to +110 °C
SW8 mm
Inner ThreadM4 
WR-PHD Pin Header - Single, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Insulation Resistance1000 MΩ
Length7.62 mm
PackagingBag 
Operating Temperature -40 °C up to +105 °C
Pins
TypeStraight 
MountTHT 
Rated Current3 A
Working Voltage250 V (AC)
WP-SMBU REDCUBE SMT with internal through-hole thread, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
PackagingTape and Reel 
Operating Temperature -55 °C up to +150 °C
MountSMT 
Rated Current50 A
Height3 mm
Outer Diameter7 mm
Rated Current50 A
Inner ThreadM3 
Thread Length4 mm
750371702
Inductor, –, –
Simu­lation
Downloads
Status Activei| Production is active. Expected lifetime: >10 years.
Product series Inductor