IC manufacturers EPC

IC manufacturers (103)

EPC EPC2361 | Demoboard EPC91202

Overview

TopologyMotor Drive
Input voltage14-76 V
IC revision1.1

Description

The EPC91202 demonstration board is a 3-phase BLDC motor drive inverter board featuring the EPC2361 eGaN FET 0.75 mΩ typical RDS(on) 100 V maximum device voltage intended for batteries up to 76 V. The EPC91202 can deliver up to 70 Apk (50 ARMS) maximum output current. The board supports PWM switching frequencies up to 150 kHz in motor drive applications.The EPC91202 contains all the necessary critical functions circuits to support a complete motor drive inverter including gate drivers, regulated auxiliary power rails for housekeeping supplies, voltage, and temperature sense, accurate current sense, and protection functions.The EPC91202 mates with an assortment of compatible controllers, supported by various manufacturers leveraging existing resources for quick development purposes, that can quickly be configured as a motor drive inverter.The EPC91202 also ships with one (1) EPC9147E controller board

Features

3-phase inverter based on EPC2361 GaN FET with wide input DC voltage ranging from 14 V to 76 VDimensions: L x W = 130 mm x 100 mm (including connector)Low distortion switching that keeps motor audio emission low and reduces torque rippledv/dt optimized for motor drives less than 10 V/nsCurrent sense, voltage sense, temperature monitoring circuitProtection features including: over-current and input supply under voltage lockoutShaft encoder/Hall sensors interface connector for motor drive application with two voltage levels selection option

Typical applications

  • BLDC Motor drives for 76 V battery apps, Power tools, Forklifts

Products

Order Code
Data­sheet
Simu­lation
Downloads
Status
Product series
λDom typ.(nm)
Emitting Color
λPeak typ.(nm)
IV typ.(mcd)
VF typ.(V)
Chip Technology
50% typ.(°)
C
Tol. C
VR(V (DC))
Size
Operating Temperature
DF(%)
RISO
L(mm)
W(mm)
Fl(mm)
Ceramic Type
Packaging
Q(%)
L(µH)
IRP,40K(A)
ISAT(A)
fres(MHz)
Version
Ø ID(mm)
Qty.
H(mm)
Ø OD(mm)
IR(mA)
Ti
Tl(mm)
Z @ 100 MHz(Ω)
Zmax(Ω)
Test Condition Zmax
IR 2(mA)
RDC max.(Ω)
Type
Samples
WL-SMCW SMT Mono-color Chip LED Waterclear, 570 nm, Bright Green
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Dominant Wavelength [typ.]570 nm
Emitting ColorBright Green 
Peak Wavelength [typ.]572 nm
Luminous Intensity [typ.]50 mcd
Forward Voltage [typ.]2 V
Chip TechnologyAlInGaP 
Viewing Angle Phi 0° [typ.]140 °
Size0603 
Operating Temperature -40 °C up to +85 °C
Length1.6 mm
Width0.8 mm
Height0.25 mm
WL-SMCW SMT Mono-color Chip LED Waterclear, 590 nm, Yellow
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Dominant Wavelength [typ.]590 nm
Emitting ColorYellow 
Peak Wavelength [typ.]595 nm
Luminous Intensity [typ.]130 mcd
Forward Voltage [typ.]2 V
Chip TechnologyAlInGaP 
Viewing Angle Phi 0° [typ.]140 °
Size0603 
Operating Temperature -40 °C up to +85 °C
Length1.6 mm
Width0.8 mm
Height0.25 mm
WE-CBF SMT EMI Suppression Ferrite Bead, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Size0805 
Operating Temperature -55 °C up to +125 °C
Length2 mm
Width1.2 mm
Pad Dimension0.5 mm
VersionSMT 
Packaging Unit4000 
Height0.9 mm
Rated Current200 mA
Impedance @ 100 MHz2200 Ω
Maximum Impedance3000 Ω
Maximum Impedance80 MHz 
Rated Current 2800 mA
DC Resistance0.6 Ω
TypeWide Band 
WE-PD SMT Power Inductor, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Size6033 
Operating Temperature -40 °C up to +125 °C
Length5.9 mm
Width6.2 mm
Inductance33 µH
Performance Rated Current1.05 A
Saturation Current0.9 A
Self Resonant Frequency17 MHz
VersionRobust 
Packaging Unit1000 
Height3.3 mm
DC Resistance0.4 Ω
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 µF
Capacitance±10% 
Rated Voltage25 V (DC)
Size0805 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor5 %
Insulation Resistance0.5 GΩ
Length2 mm
Width1.25 mm
Pad Dimension0.5 mm
Ceramic TypeX7R Class II 
Packaging7" Tape & Reel 
Packaging Unit3000 
Height1.25 mm
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance2.2 µF
Capacitance±10% 
Rated Voltage25 V (DC)
Size0805 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor10 %
Insulation Resistance0.05 GΩ
Length2 mm
Width1.25 mm
Pad Dimension0.5 mm
Ceramic TypeX7R Class II 
Packaging7" Tape & Reel 
Packaging Unit3000 
Height1.25 mm
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance680 pF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0805 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Length2 mm
Width1.25 mm
Pad Dimension0.5 mm
Ceramic TypeX7R Class II 
Packaging7" Tape & Reel 
Packaging Unit4000 
Height0.8 mm
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0805 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Length2 mm
Width1.25 mm
Pad Dimension0.5 mm
Ceramic TypeX7R Class II 
Packaging7" Tape & Reel 
Packaging Unit4000 
Height0.8 mm
WA-SMSI SMT Steel Spacer with internal Thread M2, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Operating Temperature -55 °C up to +150 °C
Length1 mm
PackagingTape and Reel 
Inner Diameter2.8 mm
Packaging Unit1500 
Outer Diameter4.35 mm
Inner ThreadM2 
WCAP-CSGP MLCCs 100 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance330 pF
Capacitance±5% 
Rated Voltage100 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Insulation Resistance10 GΩ
Length1.6 mm
Width0.8 mm
Pad Dimension0.4 mm
Ceramic TypeNP0 Class I 
Packaging7" Tape & Reel 
Q-Factor1000 %
Packaging Unit4000 
Height0.8 mm
WCAP-CSGP MLCCs 100 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Capacitance±10% 
Rated Voltage100 V (DC)
Size0805 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Insulation Resistance1 GΩ
Length2 mm
Width1.25 mm
Pad Dimension0.5 mm
Ceramic TypeX7R Class II 
Packaging7" Tape & Reel 
Packaging Unit3000 
Height1.25 mm
WP-SMBU REDCUBE SMT with internal through-hole thread, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Operating Temperature -55 °C up to +150 °C
PackagingTape and Reel 
Packaging Unit600 
Height5 mm
Outer Diameter9 mm
Rated Current70000 mA
Inner ThreadM5 
Thread Length6 mm
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Capacitance±10% 
Rated Voltage25 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3.5 %
Insulation Resistance5 GΩ
Length1.6 mm
Width0.8 mm
Pad Dimension0.4 mm
Ceramic TypeX7R Class II 
Packaging13" Tape & Reel 
Height0.8 mm
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0805 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Insulation Resistance5 GΩ
Length2 mm
Width1.25 mm
Pad Dimension0.5 mm
Ceramic TypeX7R Class II 
Packaging13" Tape & Reel 
Height0.8 mm
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance10000 pF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Length1.6 mm
Width0.8 mm
Pad Dimension0.4 mm
Ceramic TypeX7R Class II 
Packaging13" Tape & Reel 
Height0.8 mm
WCAP-CSST Soft Termination, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance10 nF
Capacitance±10% 
Rated Voltage100 V (DC)
Size0805 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Length2 mm
Width1.25 mm
Pad Dimension0.5 mm
Ceramic TypeX7R Class II 
Packaging7" Tape & Reel 
Height1.25 mm
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3 %
Insulation Resistance5 GΩ
Length1.6 mm
Width0.8 mm
Pad Dimension0.4 mm
Ceramic TypeX7R Class II 
Packaging13" Tape & Reel 
Height0.8 mm
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Length1.6 mm
Width0.8 mm
Pad Dimension0.4 mm
Ceramic TypeX7R Class II 
Packaging13" Tape & Reel 
Height0.8 mm
WCAP-CSGP MLCCs 10 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance22 µF
Capacitance±20% 
Rated Voltage10 V (DC)
Size0603 
Operating Temperature -55 °C up to +85 °C
Dissipation Factor20 %
Insulation Resistance0.002 GΩ
Length1.6 mm
Width0.8 mm
Ceramic TypeX5R Class II 
Packaging7" Tape & Reel 
Height0.8 mm
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance10 µF
Capacitance±10% 
Rated Voltage25 V (DC)
Size0805 
Operating Temperature -55 °C up to +85 °C
Dissipation Factor12.5 %
Insulation Resistance0.005 GΩ
Length2 mm
Width1.25 mm
Pad Dimension0.5 mm
Ceramic TypeX5R Class II 
Packaging7" Tape & Reel 
Height1.25 mm