From Additive Manufactured Solder Resist for Printed Circuit Boards to Functional 3D-Surfaces

Presentation by Jürgen Wolf, Product Manager Embedding Technology, on the InPrint Munich 2019 Technical Conference


Date: 14.11.2019

Time: 3.00 pm – 3:30 pm

Event: InPrint Munich 2019 Technical Conference

Language: English

Abstract: In the near future, the conventional way of applying solder resist in purely subtractive processes for printed circuit boards will be replaced by the technology of a digital, functional 3D surface applied in fully additive technology. This presentation shows the approach for the gradual digitalization of printed circuit board production and its processes.

Speaker: Jürgen Wolf, Product Manager Embedding Technology

Place: Munich Trade Fair Centre, Germany

Link: https://www.inprintmunich.com/conference/conference-programme#/