View into the opened and equipped IST test chamber

Test Methods

Reliable Printed Circuit Boards, Without Fail

Check Reliability, Detect Weak Points, Assure Quality

The printed circuit board is a complex construct made using a wide variety of materials, manufactured by a multitude of processes and it is used for a highly diverse range of applications. Understanding these interrelationships and the possibilities for influencing PCB design are a prerequisite for being able to develop and manufacture reliable PCBs. The process includes a proper specification of the requirements and needs the participation of all involved disciplines.

The manufacturing processes are highly automated and quality-monitored. Quality gates ensure that only defect-free goods are further processed. Final inspection and an electrical test are carried out before delivery.

We carry out the following test procedures:

Electrical test of printed circuit boards
Electrical testing of printed circuit boards is performed on parallel testers with part-specific needle bed adapters or by finger testers on 100% of the delivered products. For the creation of the test program the customer data is converted (CAM data test). All printed circuit boards are tested using the adjacency method.

Coil measurements
It is also possible to perform measurements on coils by agreement.

TDR (time domain reflectometry) impedance measurement
It is possible to measure characteristic impedances for specified transmission lines. For this purpose test coupons are generated and used for representative measurement.

Customized tests
For qualification and release tests, we will be happy to carry out additional tests for you:

  • Thermal cycling test, thermal shock test
  • Interconnect stress test
  • Soldering test reflow
  • Climate storage, salt fog test
  • X-ray tests
  • Pull-off test
  • TMA, DSC, CAF, SIR and FTIR 
  • etc.

Interconnect Stress Test (IST)

At Würth Elektronik, the reliability of the PCBs can be assured immediately after its manufacture by means of the Interconnect Stress Test (IST). 

Download our brochure "Interconnect Stress Test" for more information.


Test Methods

Reliability verification by Interconnect Stress Test - Introduction

In this introductory webinar you will everything you need to know about the application of a modern test procedure for bare boards – the Interconnect Stress Test (IST). With our many years of experience, we will provide you with interesting insights into this test procedure, whether you are a developer, quality manager, purchasing or management.
Without confusing you with too much physics and statistics, we will talk about these topics:

  • Fields of application of the IST
  • Avoidance of downtime costs, proof of reliability
  • Securing new technologies through statistical evaluation of the measurement data
  • Test procedure from planning to result
  • Opportunities for rapid and targeted design optimization


Webinar presentation

Interconnect Stress Test (IST) Reliability Demonstration - Deepening

After the successful introduction webinar, we now delve deeper into the physics and statistics of the Interconnect Stress Test (IST). We will compare the IST with the well-known temperature cycle test (TCT) and demonstrate the possibilities of statistical analysis.
The following topics are discussed in detail in the webinar:

  • Failure modes and their causes
  • Evaluation and presentation of the results of reliability proof
  • Possibilities for optimization
  • Factors influencing the reliability of PCBs


Webinar presentation

Interconnect Stress Test (IST) - Design Verification and Supplier Selection

How critical are your applications?
How much effort do you put into testing your PCB designs for reliability before series production starts?
In this webinar, Würth Elektronik Circuit Board Technology would like to show you how IST can be used to test PCB designs on a statistically evaluable scale even before the start of production. And how you can select your suppliers for your demanding applications based on quality.
In this webinar, you will learn more about

  • The application possibilities of the Interconnect Stress Test
  • Current applications and results
  • The advantages of the Interconnect Stress Test already in technology development, variant selection or process changes
  • The added value when "you buy the rolls at the bakery”


Webinar presentation

Developer holds green circuit board in hand and makes phone call

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