Check Reliability, Detect Weak Points, Assure Quality
The printed circuit board is a complex construct made using a wide variety of materials, manufactured by a multitude of processes and it is used for a highly diverse range of applications. Understanding these interrelationships and the possibilities for influencing PCB design are a prerequisite for being able to develop and manufacture reliable PCBs. The process includes a proper specification of the requirements and needs the participation of all involved disciplines.
The manufacturing processes are highly automated and quality-monitored. Quality gates ensure that only defect-free goods are further processed. Final inspection and an electrical test are carried out before delivery.
Electrical test of printed circuit boards
Electrical testing of printed circuit boards is performed on parallel testers with part-specific needle bed adapters or by finger testers on 100% of the delivered products. For the creation of the test program the customer data is converted (CAM data test). All printed circuit boards are tested using the adjacency method.
Coil measurements
It is also possible to perform measurements on coils by agreement.
TDR (time domain reflectometry) impedance measurement
It is possible to measure characteristic impedances for specified transmission lines. For this purpose test coupons are generated and used for representative measurement.
Customized tests
For qualification and release tests, we will be happy to carry out additional tests for you:
Interconnect Stress Test (IST)
At Würth Elektronik, the reliability of the PCBs can be assured immediately after its manufacture by means of the Interconnect Stress Test (IST).
Download our brochure "Interconnect Stress Test" for more information.
Test Methods
In this introductory webinar you will everything you need to know about the application of a modern test procedure for bare boards – the Interconnect Stress Test (IST). With our many years of experience, we will provide you with interesting insights into this test procedure, whether you are a developer, quality manager, purchasing or management.
Without confusing you with too much physics and statistics, we will talk about these topics:
After the successful introduction webinar, we now delve deeper into the physics and statistics of the Interconnect Stress Test (IST). We will compare the IST with the well-known temperature cycle test (TCT) and demonstrate the possibilities of statistical analysis.
The following topics are discussed in detail in the webinar:
How critical are your applications?
How much effort do you put into testing your PCB designs for reliability before series production starts?
In this webinar, Würth Elektronik Circuit Board Technology would like to show you how IST can be used to test PCB designs on a statistically evaluable scale even before the start of production. And how you can select your suppliers for your demanding applications based on quality.
In this webinar, you will learn more about
