Thermal management

The performance, miniaturisation and integration of semiconductors are rapidly advancing. As a result, the subject of heat dissipation of assembly parts and components is becoming increasingly important.

Not only is there an increase in the demands placed on electromagnetic compatibility (EMC), it is also necessary to develop a concept for thermal management. Components are very quickly losing their ability to work as efficiently, while the density within a device is growing sharply. Increasing clock frequencies and expanding packaging density on the silicon chip, in the package and on the printed circuit boards are the reasons for the constantly increasing warming. The development of semiconductor circuits with minimised power loss can only make an insignificant contribution in countering this trend.

Together with you, Würth Elektronik develops smart thermal management concepts which directly dissipate heat through constructive design measures at circuit board level. High-performance components and LEDs are thus protected against excess temperatures in a cost-effective manner and perfect functioning and a long service life are guaranteed.

Even at the first draft stage, a thermal simulation can help in designing the best possible layout for your circuit boards.


  • Heat dissipation of components/assemblies
  • Better system performance
  • Increased reliability of the assemblies

Construction and design variations:


Successful thermal management concepts can be applied in a variety of ways. In particular, they can be found in applications for industrial electronics, the automotive industry and aviation. Examples of this are: LED lighting systems, engine and transmission control systems, inverters, switches and DC power supplies.

Our expertise – your profit!

Because making subsequent changes or adjustments is usually costly, we work with you during the design and development phase in developing suitable measures to dissipate heat. There are a number of different possible ways to design systems for the heat dissipation of components. They always have to be individually executed and they have to be adapted to the different requirements of the assembly.

The following tools show you how you can incorporate this technology into your system.