Insulated Metal Substrate (IMS)

The use of IMS circuit boards for simple single-layer circuits is a special but very effective method of heat dissipation for components across circuit boards. These generally consist of aluminium supports, insulation layers and copper foil. The base materials are available in different design versions.


  • LED technology: Illuminated signs, displays and lighting
  • Automotive industry: LED headlights, engine control and power steering
  • Power electronics: DC power supply, inverters and engine control
  • Switches and semi-conductor relays

Better heat dissipation than FR4

The heat generated by components such as LEDs and transistors can be easily spread and transmitted. Compared with conventional FR4 materials, the heat conductance value of the insulating layers between the copper layer and metal carrier is 5 to 10 times higher.

Technical specifications
Manufacturers Bergquist, DENKA,KinWong, Ventec, Shengyi, DOOSAN, PTTC, Rogers, Aismalibar
Carrier material Aluminium, copper, stainless steel
Metal type Aluminum-base:1100,4045,4047,5052,6061
Stainless-steel base: 202, 304, 430
Panel size Normal: 406 * 325 mm
Maximum: 1180 * 350 mm only for OSP/HAL+IMS
PCB thickness 0.5 mm - 3.2 mm
Tolerance of PCB thickness ± 0.10 mm and ± 10% which is bigger
Standard metal thickness 0.8 mm, 1.0 mm, 1.5 mm, 2.0 mm, 3.0 mm
Thickness of insulating layer 0.05 mm - 0.20 mm
Heat conductance value 1-12 W/m*K
Dielectric strength 6 kV AC
Copper thickness ½ oz – 4 oz
Track width ≥ 100 μm
Conductor spacing ≥ 100 μm
Final diameter 0.55 mm - 6.5 mm
Hole tolerance NPTH diameter tolerance +/- 0.05 mm
PTH diameter tolerance +/- 0.075 mm
Positional tolerance of drilled hole +/- 0.075 mm
Aspect ratio 8:1
Solder mask dam < 2 oz, Green ink/ Blue ink: ≥ 0.076 mm;
White ink/ black ink: ≥ 0.13 mm
Solder mask clearance +/- 0.075 mm
Via clearance ≥ 100 μm
Conductor coverage +/- 0.075 mm
Tolerance of outer outlines +/- 0.10 mm
Max. external dimensions Maximum: 1180 * 350 mm only for OSP/HAL+IMS
Surface finish HAL, LF-HAL, OSP, ENIG, Immersion Silver

Manufacturing process

1. The copper foil is laminated onto the metal carrier using prepreg
2. The copper foil is structured
3. Solder mask is applied
4. Surface finish
5. Mechanical processing