Embedding Technology

The future of electronics is tending towards higher reliability, more functionality and increasing miniaturisation. The efficient use of ever smaller housing volumes and tiny surfaces is gaining in importance. ET (Embedding Technology) serves as a solution for reduced spaces. In an embedding process, active or passive components are positioned in the stack up so that they are completely integrated into its construction. Würth Elektronik distinguishes between three manufacturing processes: ET Solder, ET Microvia and ET Flip-Chip.


  • Miniaturisation
  • Function
  • Reliability

Construction and design variations:

  • ET Solder
  • ET Microvia
  • ET Flip-Chip

More in the design guide!

Fields of application

The fields of application range from the automotive industry to industrial electronics to medical technology and to sensor technology.

Our expertise – your profit!

The circuit board is no longer thought of as simply something to hold other elements. In fact, it is part of the system and offers a diverse range of options to integrate different functions. We want to support our customers as early on in the development process as possible so that they can get the most out of our wide-ranging expertise. In this way we can succeed in finding the perfect solution for the specific situation whilst keeping an overview of the entire system.

Find out more about the possible applications of ET circuit boards. The following resource will help to show how you can integrate this technology into your system.