• Skip to navigation (Press Enter).
  • Skip to main content (Press Enter).
  • Home
  • Career
  • Contact
  • English
more than you expect...
  • English
  • Deutsch
  • Français
Würth Elektronik: Printed Circuit Boards
Würth Elektronik Group
  • Electronic & Electromechanical Components
  • Printed Circuit Boards
  • Intelligent Power and Control Systems
  • Printed Circuit Boards
  • Products
  • Wire Bonding
  • Publications
  • Welcome
  • Digital Standards
  • Products
    • Single- and Double-sided
    • Multilayer
    • Flex-Rigid
    • SLIM.flex
    • STRETCH.flex
    • Microvia HDI
    • Signal Integrity
    • Thermal Management
    • Wire Bonding
      • Design Rules
      • Production Process
      • Advantages
      • Applications
      • Solderable Surfaces
      • Publications
        • Webinars
    • Embedding Technology
    • High Current Wirelaid®
    • Printed Polymer
    • SMT Stencils
    • Asia Production
  • Layout
  • Prototypes
  • Research & Development
  • Service
  • Download Center
  • About us
  • Contact
  • News
  • Events
  • Webinars
  • Jobs & Careers
  • Online shop for PCBs
  • Newsletter
  • News
  • Events
  • Webinars
  • Download Center
  • Contact
  • Würth Elektronik
  • Würth Elektronik Karriere
  • Würth Elektronik Karriere
  • Würth Elektronik Group
  • Würth Elektronik Group
  • Würth Elektronik Gruppe
  • Newsroom Würth Elektronik Group
Ask the specialist
Bert Heinz
Quickly Calculated
To the online shop
Newsletter subscription

Publications

Design Rules

See here important Design Rules for Wire Bonding

  • as Design Rules for wire bonding
  • as Design Guide Poster (digital) or order poster here for free!

Webinars

  • Wire bonding - Optimum bonding of chips to the PCB substrate
  • Implementing systems into printed circuit boards
 

website copyright © 2021 Würth Elektronik GmbH & Co. KG, Germany. All rights reserved.

Sitemap  |  Imprint  |  Data Protection  |  Contact