Gold and aluminum wire bonding

Two wire bonding procedures

Gold wire bonding (ball-wedge bonding)

Gold wire bonding generally cannot be done at room temperature. To create a good connection, a minimum substrate temperature of 120° C is required.

Gold wire bonding has the same requirements as aluminum wire bonding: the bond pads cannot have any unevenness or contamination.

Aluminum wire bonding (wedge-wedge-bonding)

Compared with gold wire bonding, the bonding speed with aluminum wire bonding is slower but has the advantage that the low-cost final surfaces of the bond pads make the final product more affordable.

Aluminum wire bonding is pure friction welding. Two pure metals are pressed together using a specific amount of pressure and are friction welded with ultrasonic oscillation that is generated by a transducer.

We'd be glad to answer your questions about these procedures!