Electroless nickel/immersion gold (ENIG)
Technical Info:
- Electroless Nickel Immersion Gold
- Typ. Au-coat 0.05 – 0.1 µm
- Typ. Ni-coat 4 – 7 µm
- Process temperature ~ 80 °C
- Max. shelf life 12 months
Advantages:
- Universally suitable surface finish
- No Copper attack during soldering process, Nickel serves as diffusion barrier
- Smooth surface
- Soldering (with or without lead, mulitple soldering)
- Storing between solder processes is possible
Disadvantages:
- Relatively expensive
- Certain limits for press-fit application
Application fields:
- Flex-rigid boards
- Fine pitch structures and micro vias
- Al-wire bonding