Production of a flex-rigid pcb

The production of rigid-flexible circuit boards varies depending on the construction.

The production of a 1F-1Ri construction serves as an example.
The manufacturing process is largely comparable with that for the production of a 4-layer multilayer. Differences are seen in the materials and the additional milling processes:

Core graver routing > no-flow prepreg milling > pressing

Drilling > plating > conductor pattern > 2x flexible solder-mask

Z-axis milling

Contour milling > electrical testing