IC manufacturers STMicroelectronics

IC manufacturers (103)

STMicroelectronics STWBC2-HP | Demoboard STEVAL-WBC2TX70

Qi-compatible wireless power transmitter evaluation board for 70 W applications based on STWBC2-HP

Overview

TopologyWireless Power Transfer
Input voltage4.1-24 V
IC revision1

Description

The STEVAL-WBC2TX70 evaluation board, based on STWBC2-HP, is designed for Qi 1.3 compatible wireless power transmitter applications.steval-wbc2tx70 image Up to 5 W charging power compatible with baseline power profile (BPP).Up to 15 W charging power compatible with extended power profile (EPP).Up to 70 W charging power with ST Super Charge (STSC) protocol using the STEVAL-WLC99RX receiver board solution.Two interfaces are open to the user: UART for monitoring and control via STSW-WBC2STUDIO graphical user interface (GUI) and SWD JTAG for direct NVM access. Both interfaces are accessible via the STLINK-V3MINIE bridge.

Features

  • STWBC2-HP wireless power transmitter chip
  • Synchronous boost DC-DC converter to supply the bridge
  • On board full bridge inverter
  • Rx presence detection based on coil Q factor measurement
  • Foreign object detection (FOD) function
  • On-chip thermal management and protections
  • SWD + UART combined connector
  • Qi charger authentication with STSAFE-A110 secure element

Typical applications

  • Wireless Charger up to 70W

More information

Products

Order Code
Data­sheet
Simu­lation
Downloads
Status
Product series
R
Tol. R
PRated(W)
TCR(ppm/ °C)
TCR(ppm/ °C)
L(mm)
W(mm)
H(mm)
λDom typ.(nm)
Emitting Color
λPeak typ.(nm)
IV typ.(mcd)
VF typ.(V)
Chip Technology
50% typ.(°)
C
Tol. C
VR(mV)
Operating Temperature
DF(%)
RISO
Ceramic Type
Fl(mm)
Packaging
IRP,40K(A)
ISAT,10%(A)
ISAT,30%(A)
Mount
Pins
Center pin Ø (Value)(mm)
Plug OD(mm)
Type
Working Voltage(V (DC))
Interface Type
Gender
PCB Thickness(mm)
Compliance
Size
L(µH)
IR(A)
RDC max.(mΩ)
fres(MHz)
Q(%)
P(W)
Samples
WRIS-PSMC Metal Plate Resistors, 10 mΩ, ±1%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Resistance10 mΩ
Resistance±1% 
Rated Power2 W
Temperature Coefficient of Resistance (min.)-100 ppm/ °C
Temperature Coefficient of Resistance (max.)100 ppm/ °C
Length6.3 mm
Width3.1 mm
Height0.35 mm
Rated Voltage141.4 mV
Operating Temperature -55 °C up to +155 °C
Pad Dimension0.5 mm
MountSMT 
Size2512 
Rated Current14.14 A
WE-LHMI SMT Power Inductor, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Length9.7 mm
Width8.5 mm
Height4 mm
Operating Temperature -40 °C up to +125 °C
Performance Rated Current18.6 A
Saturation Current @ 10%20.6 A
Saturation Current @ 30%43.1 A
MountSMT 
Size8040 
Inductance1 µH
DC Resistance4.63 mΩ
Self Resonant Frequency42 MHz
WL-SMCW SMT Mono-color Chip LED Waterclear, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Length1.6 mm
Width0.8 mm
Height0.7 mm
Dominant Wavelength [typ.]625 nm
Emitting ColorRed 
Peak Wavelength [typ.]630 nm
Luminous Intensity [typ.]250 mcd
Forward Voltage [typ.]2 V
Chip TechnologyAlInGaP 
Viewing Angle Phi 0° [typ.]140 °
Operating Temperature -40 °C up to +85 °C
PackagingTape and Reel 
MountSMT 
Size0603 
WL-SMCW SMT Mono-color Chip LED Waterclear, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Length1.6 mm
Width0.8 mm
Height0.7 mm
Dominant Wavelength [typ.]570 nm
Emitting ColorBright Green 
Peak Wavelength [typ.]572 nm
Luminous Intensity [typ.]40 mcd
Forward Voltage [typ.]2 V
Chip TechnologyAlInGaP 
Viewing Angle Phi 0° [typ.]140 °
Operating Temperature -40 °C up to +85 °C
PackagingTape and Reel 
MountSMT 
Size0603 
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Length1 mm
Width0.5 mm
Height0.5 mm
Capacitance33 pF
Capacitance±5% 
Rated Voltage50000 mV
Operating Temperature -55 °C up to +125 °C
Insulation Resistance10 GΩ
Ceramic TypeNP0 Class I 
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Size0402 
Q-Factor1000 %
WCAP-CSGP MLCCs 16 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Length1 mm
Width0.5 mm
Height0.5 mm
Capacitance10 nF
Capacitance±10% 
Rated Voltage16000 mV
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Size0402 
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Length1 mm
Width0.5 mm
Height0.5 mm
Capacitance220 pF
Capacitance±10% 
Rated Voltage50000 mV
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Size0402 
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Length1 mm
Width0.5 mm
Height0.5 mm
Capacitance10 nF
Capacitance±10% 
Rated Voltage50000 mV
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Size0402 
WCAP-CSGP MLCCs 6.3 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Length1 mm
Width0.5 mm
Height0.5 mm
Capacitance4.7 µF
Capacitance±20% 
Rated Voltage6300 mV
Operating Temperature -55 °C up to +85 °C
Dissipation Factor20 %
Insulation Resistance0.01 GΩ
Ceramic TypeX5R Class II 
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Size0402 
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Length1.6 mm
Width0.8 mm
Height0.8 mm
Capacitance33 nF
Capacitance±10% 
Rated Voltage50000 mV
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
Size0603 
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Length1.6 mm
Width0.8 mm
Height0.8 mm
Capacitance100 nF
Capacitance±10% 
Rated Voltage50000 mV
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3 %
Insulation Resistance5 GΩ
Ceramic TypeX7R Class II 
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
Size0603 
WR-DC Power Jacks, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Product seriesWR-DC Power Jacks
Operating Temperature -40 °C up to +85 °C
Insulation Resistance100 MΩ
PackagingBag 
MountTHT 
Center pin Ø2 mm
Recommended Plug outer Ø5.5 mm
TypeRight Angled 
Working Voltage30 V (DC)
Rated Current5 A
WR-USB Type C Connectors, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Operating Temperature -40 °C up to +105 °C
Insulation Resistance1000 MΩ
PackagingTape and Reel 
MountTHR 
Pins24 
TypeHorizontal 
Working Voltage48 V (DC)
Interface TypeType C 
GenderReceptacle 
PCB Thickness1.6 mm
Rated Current5 A
WE-WPCC Wireless Power Transfer Transmitter Coil, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Length53 mm
Width53 mm
Height4.5 mm
MountTHT 
Pins
ComplianceQi - MP-A2 
Size53 x 53 x 4.5 mm 
Inductance10 µH
Rated Current7 A
DC Resistance55 mΩ
Self Resonant Frequency11 MHz
Q-Factor130 %
Power Capability [1]150 W
WCAP-CSGP MLCCs 100 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Length1 mm
Width0.5 mm
Height0.5 mm
Capacitance1 nF
Capacitance±10% 
Rated Voltage100000 mV
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Size0402 
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Length1.6 mm
Width0.8 mm
Height0.8 mm
Capacitance330 nF
Capacitance±10% 
Rated Voltage50000 mV
Operating Temperature -55 °C up to +125 °C
Dissipation Factor10 %
Insulation Resistance1.5 GΩ
Ceramic TypeX7R Class II 
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
Size0603 
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Length1 mm
Width0.5 mm
Height0.5 mm
Capacitance100 nF
Capacitance±10% 
Rated Voltage50000 mV
Operating Temperature -55 °C up to +125 °C
Dissipation Factor10 %
Insulation Resistance0.5 GΩ
Ceramic TypeX7R Class II 
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Size0402 
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Length1 mm
Width0.5 mm
Height0.5 mm
Capacitance100 nF
Capacitance±10% 
Rated Voltage25000 mV
Operating Temperature -55 °C up to +125 °C
Dissipation Factor10 %
Insulation Resistance5 GΩ
Ceramic TypeX7R Class II 
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Size0402 
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Length1 mm
Width0.5 mm
Height0.5 mm
Capacitance1 nF
Capacitance±5% 
Rated Voltage50000 mV
Operating Temperature -55 °C up to +125 °C
Insulation Resistance10 GΩ
Ceramic TypeNP0 Class I 
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Size0402 
Q-Factor1000 %
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Length1.6 mm
Width0.8 mm
Height0.8 mm
Capacitance10 µF
Capacitance±20% 
Rated Voltage25000 mV
Operating Temperature -55 °C up to +85 °C
Dissipation Factor20 %
Insulation Resistance0.01 GΩ
Ceramic TypeX5R Class II 
Pad Dimension0.35 mm
Packaging7" Tape & Reel 
Size0603