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Overview
| Topology | USB |
| Output 1 | 20 V |
| IC revision | 1.0 |
Description
This board illustrates a minimal USB PD SINK implementation. It can be used as a small footprint reference design for fast migration from a custom power plug or DC barrel to a USB Type-C® connector.It is based on the STUSB4531 USB PD controller IC (USB Type-C® rev 2.4, USB PD rev 3.2) and is certified as a “Power Sinking Device” (TID #13956).
Features
USB Power Delivery SINK port (up to 100 W)Dead battery supportShort-to-VBUS protection up to 28 VLow BOM cost, small footprintStatus LEDCertified reference design (board TID: # 13957)
Typical applications
- Power supplies and converters
More information
Products
Order Code | Datasheet | Simulation | Downloads | Status | Product series | Pins | PCB/Cable/Panel | Modularity | Type | Wire Section | λDom typ.(nm) | Emitting Color | λPeak typ.(nm) | λPeak B typ.(nm) | λPeak G typ.(nm) | λPeak R typ.(nm) | λDom B typ.(nm) | λDom G typ.(nm) | λDom R typ.(nm) | IV typ.(mcd) | IV B typ.(mcd) | IV G typ.(mcd) | IV R typ.(mcd) | VF typ.(V) | VF B typ.(V) | VF G typ.(V) | VF R typ.(V) | Chip Technology | 2θ50% typ.(°) | C | Tol. C | VR(V (DC)) | Size | Operating Temperature | DF(%) | RISO | Ceramic Type | L(mm) | W(mm) | H(mm) | Fl(mm) | Packaging | Interface Type | Gender | Mount | PCB Thickness(mm) | IR(A) | Working Voltage(V (AC)) | Samples | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | WR-TBL Series 2109 - 2.54 mm Horiz. Entry, 2, Rising Cage Clamp | Simulation– | Downloads6 files | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWR-TBL Series 2109 - 2.54 mm Horiz. Entry | Pins2 | PCB/Cable/PanelPCB | ModularityNo | TypeHorizontal | Wire Section 30 to 18 (AWG) 0.2 to 0.75 (mm²) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | Operating Temperature -40 °C up to +105 °C | – | – | – | Length5.48 mm | – | – | – | PackagingBox | – | – | MountTHT | – | Rated Current6 A | Working Voltage150 V (AC) | ||
 | WR-USB Type C Connectors, 24, USB 3.1 | Simulation– | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWR-USB Type C Connectors | Pins24 | – | – | TypeHorizontal | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | Operating Temperature -40 °C up to +105 °C | – | Insulation Resistance1000 MΩ | – | – | – | – | – | PackagingTape and Reel | Interface TypeType C | GenderReceptacle | MountTHR | PCB Thickness1.6 mm | Rated Current5 A | Working Voltage48 V (AC) | |||
| WCAP-CSGP MLCCs 6.3 V(DC), –, – | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 6.3 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | Capacitance1 µF | Capacitance±20% | Rated Voltage6.3 V (DC) | Size0402 | Operating Temperature -55 °C up to +85 °C | Dissipation Factor15 % | Insulation Resistance0.1 GΩ | Ceramic TypeX5R Class II | Length1 mm | Width0.5 mm | Height0.5 mm | Pad Dimension0.25 mm | Packaging7" Tape & Reel | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 25 V(DC), –, – | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | Capacitance100 nF | Capacitance±20% | Rated Voltage25 V (DC) | Size0402 | Operating Temperature -55 °C up to +85 °C | Dissipation Factor10 % | Insulation Resistance5 GΩ | Ceramic TypeX5R Class II | Length1 mm | Width0.5 mm | Height0.5 mm | Pad Dimension0.25 mm | Packaging7" Tape & Reel | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 25 V(DC), –, – | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | Capacitance4.7 µF | Capacitance±20% | Rated Voltage25 V (DC) | Size0805 | Operating Temperature -55 °C up to +85 °C | Dissipation Factor10 % | Insulation Resistance0.02 GΩ | Ceramic TypeX5R Class II | Length2 mm | Width1.25 mm | Height1.25 mm | Pad Dimension0.5 mm | Packaging7" Tape & Reel | – | – | – | – | – | – | |||||
 | WL-SFCD SMT Full-color Chip LED Diffused, –, – | Simulation– | Downloads26 files RAY files
| Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWL-SFCD SMT Full-color Chip LED Diffused | – | – | – | – | – | – | Emitting ColorRed & Green & Blue | – | Peak Wavelength (Blue) [typ.]468 nm | Peak Wavelength (Green) [typ.]520 nm | Peak Wavelength (Red) [typ.]632 nm | Dominant Wavelength (Blue) [typ.]470 nm | Dominant Wavelength (Green) [typ.]525 nm | Dominant Wavelength (Red) [typ.]624 nm | – | Luminous Intensity (Blue) [typ.]180 mcd | Luminous Intensity (Green) [typ.]900 mcd | Luminous Intensity (Red) [typ.]285 mcd | – | Forward Voltage (Blue) [typ.]3.3 V | Forward Voltage (Green) [typ.]3.3 V | Forward Voltage (Red) [typ.]2 V | Chip TechnologyAlInGaP + InGaN | Viewing Angle Phi 0° [typ.]120 ° | – | – | – | Size0606 | Operating Temperature -40 °C up to +85 °C | – | – | – | Length1.6 mm | Width1.6 mm | Height0.4 mm | – | PackagingTape and Reel | – | – | MountSMT | – | – | – | ||
 | WL-SMCW SMT Mono-color Chip LED Waterclear, –, – | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWL-SMCW SMT Mono-color Chip LED Waterclear | – | – | – | – | – | Dominant Wavelength [typ.]590 nm | Emitting ColorYellow | Peak Wavelength [typ.]595 nm | – | – | – | – | – | – | Luminous Intensity [typ.]130 mcd | – | – | – | Forward Voltage [typ.]2 V | – | – | – | Chip TechnologyAlInGaP | Viewing Angle Phi 0° [typ.]140 ° | – | – | – | Size0603 | Operating Temperature -40 °C up to +85 °C | – | – | – | Length1.6 mm | Width0.8 mm | Height0.25 mm | – | – | – | – | MountSMT | – | – | – |