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Details
| Topologie | USB |
| Ausgang 1 | 20 V |
| IC-Revision | 1.0 |
Beschreibung
This board illustrates a minimal USB PD SINK implementation. It can be used as a small footprint reference design for fast migration from a custom power plug or DC barrel to a USB Type-C® connector.It is based on the STUSB4531 USB PD controller IC (USB Type-C® rev 2.4, USB PD rev 3.2) and is certified as a “Power Sinking Device” (TID #13956).
Eigenschaften
USB Power Delivery SINK port (up to 100 W)Dead battery supportShort-to-VBUS protection up to 28 VLow BOM cost, small footprintStatus LEDCertified reference design (board TID: # 13957)
Typische Anwendungen
- Power supplies and converters
Weiterführende Informationen
Artikeldaten
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | Pins | Anwendung | PCB/Kabel/Panel | Modularity | Typ | Wire Section | λDom typ. (nm) | Farbe | λPeak typ. (nm) | λPeak B typ. (nm) | λPeak G typ. (nm) | λPeak R typ. (nm) | λDom B typ. (nm) | λDom G typ. (nm) | λDom R typ. (nm) | IV typ. (mcd) | IV B typ. (mcd) | IV G typ. (mcd) | IV R typ. (mcd) | VF typ. (V) | VF B typ. (V) | VF G typ. (V) | VF R typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | H (mm) | Fl (mm) | Verpackung | Interface typ | Gender | Montageart | Leiterplattendicke (mm) | IR (A) | Arbeitsspannung (V (AC)) | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 691210910002 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-TBL Series 2109 - 2.54 mm Horiz. Entry | 2 | Käfigzugklemme | PCB | Nein | Horizontal | 30 to 18 (AWG) 0.2 to 0.75 (mm²) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | – | – | 5.48 | – | – | – | Karton | – | – | THT | – | 6 | 150 | |
 | 632723300011 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-USB Type C Connectors | 24 | USB 3.1 | – | – | Horizontal | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | 1000 MΩ | – | – | – | – | – | Tape and Reel | Type C | Buchse | THR | 1.6 | 5 | 48 | |
| 885012105006 | SPEC | 7 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 6.3 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 1 µF | ±20% | 6.3 | 0402 | -55 °C up to +85 °C | 15 | 0.1 GΩ | X5R Klasse II | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | |||
| 885012105018 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 100 nF | ±20% | 25 | 0402 | -55 °C up to +85 °C | 10 | 5 GΩ | X5R Klasse II | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | |||
| 885012107018 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 4.7 µF | ±20% | 25 | 0805 | -55 °C up to +85 °C | 10 | 0.02 GΩ | X5R Klasse II | 2 | 1.25 | 1.25 | 0.5 | 7" Tape & Reel | – | – | – | – | – | – | |||
 | 150066M153000 | SPEC | – | 26 Dateien Strahldaten
| Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WL-SFCD SMT Full-color Chip LED Diffused | – | – | – | – | – | – | – | Rot & Grün & Blau | – | 468 | 520 | 632 | 470 | 525 | 624 | – | 180 | 900 | 285 | – | 3.3 | 3.3 | 2 | AlInGaP + InGaN | 120 | – | – | – | 0606 | -40 °C up to +85 °C | – | – | – | 1.6 | 1.6 | 0.4 | – | Tape and Reel | – | – | SMT | – | – | – | |
 | 150060YS75020 | SPEC | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WL-SMCW SMT Mono-color Chip LED Waterclear | – | – | – | – | – | – | 590 | Gelb | 595 | – | – | – | – | – | – | 130 | – | – | – | 2 | – | – | – | AlInGaP | 140 | – | – | – | 0603 | -40 °C up to +85 °C | – | – | – | 1.6 | 0.8 | 0.25 | – | – | – | – | SMT | – | – | – |
| Artikel Nr. | Datenblatt | Simulation | |
|---|---|---|---|
| 691210910002 | SPEC | – |
| 632723300011 | SPEC | – |
| 885012105006 | SPEC | ||
| 885012105018 | SPEC | ||
| 885012107018 | SPEC | ||
| 150066M153000 | SPEC | – |
| 150060YS75020 | SPEC |
| Muster |
|---|
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | Pins | Anwendung | PCB/Kabel/Panel | Modularity | Typ | Wire Section | λDom typ. (nm) | Farbe | λPeak typ. (nm) | λPeak B typ. (nm) | λPeak G typ. (nm) | λPeak R typ. (nm) | λDom B typ. (nm) | λDom G typ. (nm) | λDom R typ. (nm) | IV typ. (mcd) | IV B typ. (mcd) | IV G typ. (mcd) | IV R typ. (mcd) | VF typ. (V) | VF B typ. (V) | VF G typ. (V) | VF R typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | H (mm) | Fl (mm) | Verpackung | Interface typ | Gender | Montageart | Leiterplattendicke (mm) | IR (A) | Arbeitsspannung (V (AC)) | Muster |
|---|
