IC manufacturers STMicroelectronics

IC manufacturers (103)

STMicroelectronics STM32F767ZIT6 | Demoboard STEVAL-ETH001V1

High-performance and DSP with FPU, Arm Cortex-M7 MCU with 2 Mbytes of Flash memory, 216 MHz CPU, Art Accelerator, L1 cache, SDRAM, TFT, JPEG codec, DFSDM

Overview

TopologyOther Topology
IC revision1

Description

The STM32F765xx, STM32F767xx, STM32F768Ax and STM32F769xx devices are based on the high-performance Arm® Cortex®-M7 32-bit RISC core operating at up to 216 MHz frequency. The Cortex®-M7 core features a floating point unit (FPU) which supports Arm® double-precision and single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances the application security.The STM32F765xx, STM32F767xx, STM32F768Ax and STM32F769xx devices incorporate high-speed embedded memories with a Flash memory up to 2 Mbytes, 512 Kbytes of SRAM (including 128 Kbytes of Data TCM RAM for critical real-time data), 16 Kbytes of instruction TCM RAM (for critical real-time routines), 4 Kbytes of backup SRAM available in the lowest power modes, and an extensive range of enhanced I/Os and peripherals connected to two APB buses, two AHB buses, a 32-bit multi-AHB bus matrix and a multi layer AXI interconnect supporting internal and external memories access.All the devices offer three 12-bit ADCs, two DACs, a low-power RTC, twelve general-purpose 16-bit timers including two PWM timers for motor control, two general-purpose 32-bit timers, a true random number generator (RNG). They also feature standard and advanced communication interfaces.Advanced peripherals include two SDMMC interfaces, a flexible memory control (FMC) interface, a Quad-SPI Flash memory interface, a camera interface for CMOS sensors.The STM32F765xx, STM32F767xx, STM32F768Ax and STM32F769xx devices operate in the –40 to +105 °C temperature range from a 1.7 to 3.6 V power supply. Dedicated supply inputs for USB (OTG_FS and OTG_HS) and SDMMC2 (clock, command and 4-bit data) are available on all the packages except LQFP100 for a greater power supply choice.The supply voltage can drop to 1.7 V with the use of an external power supply supervisor. A comprehensive set of power-saving mode allows the design of low-power applications.The STM32F765xx, STM32F767xx, STM32F768Ax and STM32F769xx devices offer devices in 11 packages ranging from 100 pins to 216 pins. The set of included peripherals changes with the device chosen.These features make the STM32F765xx, STM32F767xx, STM32F768Ax and STM32F769xx microcontrollers suitable for a wide range of applications.

Features

  • Core: Arm® 32-bit Cortex®-M7 CPU with DPFPU, ART Accelerator™ and L1-cache: 16 Kbytes I/D cache, allowing 0-wait state execution from embedded Flash and external memories, up to 216 MHz, MPU, 462 DMIPS/2.14 DMIPS/MHz (Dhrystone 2.1), and DSP instructions.
  • Memories
  • Up to 2 Mbytes of Flash memory organized into two banks allowing read-while-write - SRAM: 512 Kbytes (including 128 Kbytes of data TCM RAM for critical real-time data) + 16 Kbytes of instruction TCM RAM (for critical real-time routines) + 4 Kbytes of backup SRAM
  • Flexible external memory controller with up to 32-bit data bus: SRAM, PSRAM, SDRAM/LPSDR SDRAM, NOR/NAND memories
  • Dual mode Quad-SPI
  • Graphics
  • Chrom-ART Accelerator™ (DMA2D), graphical hardware accelerator enabling enhanced graphical user interface
  • Hardware JPEG codec
  • LCD-TFT controller supporting up to XGA resolution
  • MIPI® DSI host controller supporting up to 720p 30 Hz resolution
  • Clock, reset and supply management
  • 1.7 V to 3.6 V application supply and I/Os
  • POR, PDR, PVD and BOR
  • Dedicated USB power
  • 4-to-26 MHz crystal oscillator
  • Internal 16 MHz factory-trimmed RC (1% accuracy)
  • 32 kHz oscillator for RTC with calibration
  • Internal 32 kHz RC with calibration
  • Low-power
  • Sleep, Stop and Standby modes
  • VBAT supply for RTC, 32×32 bit backup registers + 4 Kbytes backup SRAM
  • 3×12-bit, 2.4 MSPS ADC: up to 24 channels
  • Digital filters for sigma delta modulator (DFSDM), 8 channels / 4 filters
  • 2×12-bit D/A converters
  • General-purpose DMA: 16-stream DMA controller with FIFOs and burst support
  • Up to 18 timers: up to thirteen 16-bit (1x low- power 16-bit timer available in Stop mode) and two 32-bit timers, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input. All 15 timers running up to 216 MHz. 2x watchdogs, SysTick timer
  • Debug mode
  • SWD & JTAG interfaces
  • Cortex®-M7 Trace Macrocell™
  • Up to 168 I/O ports with interrupt capability
  • Up to 164 fast I/Os up to 108 MHz
  • Up to 166 5 V-tolerant I/Os
  • Up to 28 communication interfaces
  • Up to 4 I2C interfaces (SMBus/PMBus)
  • Up to 4 USARTs/4 UARTs (12.5 Mbit/s, ISO7816 interface, LIN, IrDA, modem control)
  • Up to 6 SPIs (up to 54 Mbit/s), 3 with muxed simplex I2S for audio
  • 2 x SAIs (serial audio interface)
  • 3 × CANs (2.0B Active) and 2x SDMMCs
  • SPDIFRX interface
  • HDMI-CEC
  • MDIO slave interface
  • Advanced connectivity
  • USB 2.0 full-speed device/host/OTG controller with on-chip PHY
  • USB 2.0 high-speed/full-speed device/host/OTG controller with dedicated DMA, on-chip full-speed PHY and ULPI
  • 10/100 Ethernet MAC with dedicated DMA: supports IEEE 1588v2 hardware, MII/RMII
  • 8- to 14-bit camera interface up to 54 Mbyte/s
  • True random number generator
  • CRC calculation unit
  • RTC: subsecond accuracy, hardware calendar
  • 96-bit unique ID

Products

Order Code
Data­sheet
Simu­lation
Downloads
Status
Product series
Pins
PCB/Cable/Panel
Modularity
Wire Section
λDom typ.(nm)
Emitting Color
λPeak typ.(nm)
λPeak G typ.(nm)
λPeak Y typ.(nm)
IV typ.(mcd)
IV G typ.(mcd)
IV Y typ.(mcd)
VF typ.(V)
VF G typ.(V)
VF Y typ.(V)
Chip Technology
50% typ.(°)
C
Tol. C
VR(V (DC))
Size
Operating Temperature
Q(%)
DF(%)
RISO
Ceramic Type
L(mm)
W(mm)
H(mm)
Fl(mm)
Packaging
L(µH)
IRP,40K(A)
ISAT,30%(A)
RDC typ.(mΩ)
fres(MHz)
VOP(V)
Mount
xPxC
Variant
Ports
Shielding
Tab
EMI
LED
Application System
IR(A)
Working Voltage(V (AC))
Z @ 100 MHz(Ω)
Zmax(Ω)
Test Condition Zmax
IR 2(mA)
Test Condition IR 2
Z @ 1 GHz(Ω)
Type
RDC max.(mΩ)
Samples
WE-MAPI SMT Power Inductor, 2, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Pins
Size2510 
Operating Temperature -40 °C up to +125 °C
Length2.5 mm
Width2 mm
Height1 mm
Inductance10 µH
Performance Rated Current0.9 A
Saturation Current @ 30%1.7 A
DC Resistance733 mΩ
Self Resonant Frequency25 MHz
Operating Voltage80 V
MountSMT 
ShieldingShielded 
Rated Current0.6 A
DC Resistance843 mΩ
WR-TBL Series 2535 - 5.08 mm Horizontal Entry Modular w. Rising Cage Clamp, 2, Rising Cage Clamp
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Pins
PCB/Cable/PanelPCB 
ModularityYes 
Wire Section 12 to 30 (AWG) 0.05 to 3.31 (mm²)
Operating Temperature -30 °C up to +120 °C
Length10.16 mm
PackagingBox 
MountTHT 
Rated Current24 A
Working Voltage450 V (AC)
TypeHorizontal 
WR-TBL Series 311 - 5.08 mm Close Vertical PCB Header, 3, PCB Header
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Pins
PCB/Cable/PanelPCB 
ModularityNo 
Operating Temperature -40 °C up to +105 °C
Length16.64 mm
PackagingBox 
MountTHT 
VariantClosed ends 
Rated Current15 A
Working Voltage320 V (AC)
TypeClosed Vertical Plug entry 
WE-CBF SMT EMI Suppression Ferrite Bead, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Size0805 
Operating Temperature -55 °C up to +125 °C
Length2 mm
Width1.2 mm
Height0.0009 mm
Pad Dimension0.5 mm
MountSMT 
Rated Current1.5 A
Impedance @ 100 MHz600 Ω
Maximum Impedance700 Ω
Maximum Impedance150 MHz 
Rated Current 22000 mA
Rated Current 2ΔT = 40 K 
Impedance @ 1 GHz193 Ω
TypeHigh Current 
DC Resistance150 mΩ
WCAP-CSGP MLCCs 10 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance10 pF
Capacitance±5% 
Rated Voltage10 V (DC)
Size0402 
Operating Temperature -55 °C up to +125 °C
Q-Factor600 %
Insulation Resistance10 GΩ
Ceramic TypeNP0 Class I 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 10 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 pF
Capacitance±5% 
Rated Voltage10 V (DC)
Size0402 
Operating Temperature -55 °C up to +125 °C
Q-Factor1000 %
Insulation Resistance10 GΩ
Ceramic TypeNP0 Class I 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 16 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance10 nF
Capacitance±10% 
Rated Voltage16 V (DC)
Size0402 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 16 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Capacitance±10% 
Rated Voltage16 V (DC)
Size0402 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor5 %
Insulation Resistance5 GΩ
Ceramic TypeX7R Class II 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 pF
Capacitance±10% 
Rated Voltage25 V (DC)
Size0402 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance22 nF
Capacitance±10% 
Rated Voltage25 V (DC)
Size0402 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 10 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance2.2 µF
Capacitance±20% 
Rated Voltage10 V (DC)
Size0402 
Operating Temperature -55 °C up to +85 °C
Dissipation Factor10 %
Insulation Resistance0.05 GΩ
Ceramic TypeX5R Class II 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Capacitance±20% 
Rated Voltage25 V (DC)
Size0402 
Operating Temperature -55 °C up to +85 °C
Dissipation Factor10 %
Insulation Resistance5 GΩ
Ceramic TypeX5R Class II 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 16 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Capacitance±10% 
Rated Voltage16 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3.5 %
Insulation Resistance5 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance470 nF
Capacitance±10% 
Rated Voltage25 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor10 %
Insulation Resistance1.1 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3 %
Insulation Resistance5 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
WR-MJ Cat 3 Modular Jacks – THT, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Peak Wavelength (Green) [typ.]570 nm
Peak Wavelength (Yellow) [typ.]590 nm
Luminous Intensity (Green) [typ.]13 mcd
Luminous Intensity (Yellow) [typ.]8 mcd
Forward Voltage (Green) [typ.]2.3 V
Forward Voltage (Yellow) [typ.]2.3 V
Viewing Angle Phi 0° [typ.]140 °
Operating Temperature -40 °C up to +85 °C
Insulation Resistance1000 MΩ
PackagingTray 
MountTHT 
Number of Pins (xPxC)8P8C 
Ports1x1 
ShieldingShielded 
Tab PositionDown 
EMI FingersYes 
LED (Left-Right)yellow-green 
Application SystemCAT 3 
Rated Current1.5 A
Working Voltage125 V (AC)
TypeHorizontal 
WL-SMCC SMT Mono-color Chip LED Compact, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Dominant Wavelength [typ.]625 nm
Emitting ColorRed 
Peak Wavelength [typ.]630 nm
Luminous Intensity [typ.]100 mcd
Forward Voltage [typ.]2 V
Chip TechnologyAlInGaP 
Viewing Angle Phi 0° [typ.]120 °
Size0402 
Operating Temperature -40 °C up to +85 °C
Length1 mm
Width0.5 mm
Height0.4 mm
PackagingTape and Reel 
MountSMT 
WL-SMCC SMT Mono-color Chip LED Compact, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Dominant Wavelength [typ.]570 nm
Emitting ColorBright Green 
Peak Wavelength [typ.]572 nm
Luminous Intensity [typ.]50 mcd
Forward Voltage [typ.]2 V
Chip TechnologyAlInGaP 
Viewing Angle Phi 0° [typ.]120 °
Size0402 
Operating Temperature -40 °C up to +85 °C
Length1 mm
Width0.5 mm
Height0.4 mm
PackagingTape and Reel 
MountSMT 
WL-SMCC SMT Mono-color Chip LED Compact, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Dominant Wavelength [typ.]605 nm
Emitting ColorAmber 
Peak Wavelength [typ.]609 nm
Luminous Intensity [typ.]80 mcd
Forward Voltage [typ.]2 V
Chip TechnologyAlInGaP 
Viewing Angle Phi 0° [typ.]120 °
Size0402 
Operating Temperature -40 °C up to +85 °C
Length1 mm
Width0.5 mm
Height0.25 mm
MountSMT 
WE-TMSB Tiny Multilayer Suppression Bead, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Size0402 
Operating Temperature -55 °C up to +125 °C
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
DC Resistance220 mΩ
MountSMT 
Rated Current0.85 A
Impedance @ 100 MHz600 Ω
Maximum Impedance720 Ω
Maximum Impedance211 MHz 
Impedance @ 1 GHz218 Ω
TypeWide Band 
DC Resistance250 mΩ