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STMicroelectronics STM32F767ZIT6 | Demoboard STEVAL-ETH001V1
High-performance and DSP with FPU, Arm Cortex-M7 MCU with 2 Mbytes of Flash memory, 216 MHz CPU, Art Accelerator, L1 cache, SDRAM, TFT, JPEG codec, DFSDM
Details
| Topologie | Sonstige Topologie |
| IC-Revision | 1 |
Beschreibung
The STM32F765xx, STM32F767xx, STM32F768Ax and STM32F769xx devices are based on the high-performance Arm® Cortex®-M7 32-bit RISC core operating at up to 216 MHz frequency. The Cortex®-M7 core features a floating point unit (FPU) which supports Arm® double-precision and single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances the application security.The STM32F765xx, STM32F767xx, STM32F768Ax and STM32F769xx devices incorporate high-speed embedded memories with a Flash memory up to 2 Mbytes, 512 Kbytes of SRAM (including 128 Kbytes of Data TCM RAM for critical real-time data), 16 Kbytes of instruction TCM RAM (for critical real-time routines), 4 Kbytes of backup SRAM available in the lowest power modes, and an extensive range of enhanced I/Os and peripherals connected to two APB buses, two AHB buses, a 32-bit multi-AHB bus matrix and a multi layer AXI interconnect supporting internal and external memories access.All the devices offer three 12-bit ADCs, two DACs, a low-power RTC, twelve general-purpose 16-bit timers including two PWM timers for motor control, two general-purpose 32-bit timers, a true random number generator (RNG). They also feature standard and advanced communication interfaces.Advanced peripherals include two SDMMC interfaces, a flexible memory control (FMC) interface, a Quad-SPI Flash memory interface, a camera interface for CMOS sensors.The STM32F765xx, STM32F767xx, STM32F768Ax and STM32F769xx devices operate in the –40 to +105 °C temperature range from a 1.7 to 3.6 V power supply. Dedicated supply inputs for USB (OTG_FS and OTG_HS) and SDMMC2 (clock, command and 4-bit data) are available on all the packages except LQFP100 for a greater power supply choice.The supply voltage can drop to 1.7 V with the use of an external power supply supervisor. A comprehensive set of power-saving mode allows the design of low-power applications.The STM32F765xx, STM32F767xx, STM32F768Ax and STM32F769xx devices offer devices in 11 packages ranging from 100 pins to 216 pins. The set of included peripherals changes with the device chosen.These features make the STM32F765xx, STM32F767xx, STM32F768Ax and STM32F769xx microcontrollers suitable for a wide range of applications.
Eigenschaften
- Core: Arm® 32-bit Cortex®-M7 CPU with DPFPU, ART Accelerator™ and L1-cache: 16 Kbytes I/D cache, allowing 0-wait state execution from embedded Flash and external memories, up to 216 MHz, MPU, 462 DMIPS/2.14 DMIPS/MHz (Dhrystone 2.1), and DSP instructions.
- Memories
- Up to 2 Mbytes of Flash memory organized into two banks allowing read-while-write - SRAM: 512 Kbytes (including 128 Kbytes of data TCM RAM for critical real-time data) + 16 Kbytes of instruction TCM RAM (for critical real-time routines) + 4 Kbytes of backup SRAM
- Flexible external memory controller with up to 32-bit data bus: SRAM, PSRAM, SDRAM/LPSDR SDRAM, NOR/NAND memories
- Dual mode Quad-SPI
- Graphics
- Chrom-ART Accelerator™ (DMA2D), graphical hardware accelerator enabling enhanced graphical user interface
- Hardware JPEG codec
- LCD-TFT controller supporting up to XGA resolution
- MIPI® DSI host controller supporting up to 720p 30 Hz resolution
- Clock, reset and supply management
- 1.7 V to 3.6 V application supply and I/Os
- POR, PDR, PVD and BOR
- Dedicated USB power
- 4-to-26 MHz crystal oscillator
- Internal 16 MHz factory-trimmed RC (1% accuracy)
- 32 kHz oscillator for RTC with calibration
- Internal 32 kHz RC with calibration
- Low-power
- Sleep, Stop and Standby modes
- VBAT supply for RTC, 32×32 bit backup registers + 4 Kbytes backup SRAM
- 3×12-bit, 2.4 MSPS ADC: up to 24 channels
- Digital filters for sigma delta modulator (DFSDM), 8 channels / 4 filters
- 2×12-bit D/A converters
- General-purpose DMA: 16-stream DMA controller with FIFOs and burst support
- Up to 18 timers: up to thirteen 16-bit (1x low- power 16-bit timer available in Stop mode) and two 32-bit timers, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input. All 15 timers running up to 216 MHz. 2x watchdogs, SysTick timer
- Debug mode
- SWD & JTAG interfaces
- Cortex®-M7 Trace Macrocell™
- Up to 168 I/O ports with interrupt capability
- Up to 164 fast I/Os up to 108 MHz
- Up to 166 5 V-tolerant I/Os
- Up to 28 communication interfaces
- Up to 4 I2C interfaces (SMBus/PMBus)
- Up to 4 USARTs/4 UARTs (12.5 Mbit/s, ISO7816 interface, LIN, IrDA, modem control)
- Up to 6 SPIs (up to 54 Mbit/s), 3 with muxed simplex I2S for audio
- 2 x SAIs (serial audio interface)
- 3 × CANs (2.0B Active) and 2x SDMMCs
- SPDIFRX interface
- HDMI-CEC
- MDIO slave interface
- Advanced connectivity
- USB 2.0 full-speed device/host/OTG controller with on-chip PHY
- USB 2.0 high-speed/full-speed device/host/OTG controller with dedicated DMA, on-chip full-speed PHY and ULPI
- 10/100 Ethernet MAC with dedicated DMA: supports IEEE 1588v2 hardware, MII/RMII
- 8- to 14-bit camera interface up to 54 Mbyte/s
- True random number generator
- CRC calculation unit
- RTC: subsecond accuracy, hardware calendar
- 96-bit unique ID
Weiterführende Informationen
Artikeldaten
Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | Pins | PCB/Kabel/Panel | Modularity | Wire Section | λDom typ.(nm) | Farbe | λPeak typ.(nm) | λPeak G typ.(nm) | λPeak Y typ.(nm) | IV typ.(mcd) | IV G typ.(mcd) | IV Y typ.(mcd) | VF typ.(V) | VF G typ.(V) | VF Y typ.(V) | Chiptechnologie | 2θ50% typ.(°) | C | Tol. C | VR(V (DC)) | Bauform | Betriebstemperatur | Q(%) | DF(%) | RISO | Keramiktyp | L(mm) | B(mm) | H(mm) | Fl(mm) | Verpackung | L(µH) | IRP,40K(A) | ISAT,30%(A) | RDC typ.(mΩ) | fres(MHz) | VOP(V) | Montageart | xPxC | Ausführung | Ports | Schirmung | Tab | EMI | LED | Anwendungssystem | IR(A) | Arbeitsspannung(V (AC)) | Z @ 100 MHz(Ω) | Zmax(Ω) | Testbedingung Zmax | IR 2(mA) | Testbedingung IR 2 | Z @ 1 GHz(Ω) | Typ | RDC max.(mΩ) | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | WE-MAPI SMT-Speicherdrossel, 2, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWE-MAPI SMT-Speicherdrossel | Pins2 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | Bauform2510 | Betriebstemperatur -40 °C up to +125 °C | – | – | – | – | Länge2.5 mm | Breite2 mm | Höhe1 mm | – | – | Induktivität10 µH | Performance Nennstrom0.9 A | Sättigungsstrom @ 30%1.7 A | Gleichstromwiderstand733 mΩ | Eigenresonanzfrequenz25 MHz | Betriebsspannung80 V | MontageartSMT | – | – | – | Schirmunggeschirmt | – | – | – | – | Nennstrom0.6 A | – | – | – | – | – | – | – | – | Gleichstromwiderstand843 mΩ | ||||
 | WR-TBL Serie 2535 - 5.08 mm Horizontal Entry Modular w. Rising Cage Clamp, 2, Käfigzugklemme | Simulation– | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | Pins2 | PCB/Kabel/PanelPCB | ModularityJa | Wire Section 12 to 30 (AWG) 0.05 to 3.31 (mm²) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | Betriebstemperatur -30 °C up to +120 °C | – | – | – | – | Länge10.16 mm | – | – | – | VerpackungKarton | – | – | – | – | – | – | MontageartTHT | – | – | – | – | – | – | – | – | Nennstrom24 A | Arbeitsspannung450 V (AC) | – | – | – | – | – | – | TypHorizontal | – | ||||
 | WR-TBL Serie 311 - 5.08 mm Close Vertical PCB Header, 3, Stiftleiste | Simulation– | Downloads6 Dateien | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | Pins3 | PCB/Kabel/PanelPCB | ModularityNein | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | Betriebstemperatur -40 °C up to +105 °C | – | – | – | – | Länge16.64 mm | – | – | – | VerpackungKarton | – | – | – | – | – | – | MontageartTHT | – | AusführungGeschlossene Enden | – | – | – | – | – | – | Nennstrom15 A | Arbeitsspannung320 V (AC) | – | – | – | – | – | – | TypGeschlossen, vertikale Steckrichtung | – | |||
 | WE-CBF SMT-Ferrit, –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWE-CBF SMT-Ferrit | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | Bauform0805 | Betriebstemperatur -55 °C up to +125 °C | – | – | – | – | Länge2 mm | Breite1.2 mm | Höhe0.0009 mm | Pad Dimension0.5 mm | – | – | – | – | – | – | – | MontageartSMT | – | – | – | – | – | – | – | – | Nennstrom1.5 A | – | Impedanz @ 100 MHz600 Ω | Maximale Impedanz700 Ω | Maximale Impedanz150 MHz | Nennstrom 22000 mA | Nennstrom 2ΔT = 40 K | Impedanz @ 1 GHz193 Ω | TypHochstrom | Gleichstromwiderstand150 mΩ | ||||
| WCAP-CSGP MLCCs 10 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 10 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | Kapazität10 pF | Kapazität±5% | Nennspannung10 V (DC) | Bauform0402 | Betriebstemperatur -55 °C up to +125 °C | Güte600 % | – | Isolationswiderstand10 GΩ | KeramiktypNP0 Klasse I | Länge1 mm | Breite0.5 mm | Höhe0.5 mm | Pad Dimension0.25 mm | Verpackung7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 10 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 10 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | Kapazität100 pF | Kapazität±5% | Nennspannung10 V (DC) | Bauform0402 | Betriebstemperatur -55 °C up to +125 °C | Güte1000 % | – | Isolationswiderstand10 GΩ | KeramiktypNP0 Klasse I | Länge1 mm | Breite0.5 mm | Höhe0.5 mm | Pad Dimension0.25 mm | Verpackung7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 16 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 16 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | Kapazität10 nF | Kapazität±10% | Nennspannung16 V (DC) | Bauform0402 | Betriebstemperatur -55 °C up to +125 °C | – | Verlustfaktor3.5 % | Isolationswiderstand10 GΩ | KeramiktypX7R Klasse II | Länge1 mm | Breite0.5 mm | Höhe0.5 mm | Pad Dimension0.25 mm | Verpackung7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 16 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 16 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | Kapazität100 nF | Kapazität±10% | Nennspannung16 V (DC) | Bauform0402 | Betriebstemperatur -55 °C up to +125 °C | – | Verlustfaktor5 % | Isolationswiderstand5 GΩ | KeramiktypX7R Klasse II | Länge1 mm | Breite0.5 mm | Höhe0.5 mm | Pad Dimension0.25 mm | Verpackung7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 25 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | Kapazität100 pF | Kapazität±10% | Nennspannung25 V (DC) | Bauform0402 | Betriebstemperatur -55 °C up to +125 °C | – | Verlustfaktor3.5 % | Isolationswiderstand10 GΩ | KeramiktypX7R Klasse II | Länge1 mm | Breite0.5 mm | Höhe0.5 mm | Pad Dimension0.25 mm | Verpackung7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 25 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | Kapazität22 nF | Kapazität±10% | Nennspannung25 V (DC) | Bauform0402 | Betriebstemperatur -55 °C up to +125 °C | – | Verlustfaktor3.5 % | Isolationswiderstand10 GΩ | KeramiktypX7R Klasse II | Länge1 mm | Breite0.5 mm | Höhe0.5 mm | Pad Dimension0.25 mm | Verpackung7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 10 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 10 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | Kapazität2.2 µF | Kapazität±20% | Nennspannung10 V (DC) | Bauform0402 | Betriebstemperatur -55 °C up to +85 °C | – | Verlustfaktor10 % | Isolationswiderstand0.05 GΩ | KeramiktypX5R Klasse II | Länge1 mm | Breite0.5 mm | Höhe0.5 mm | Pad Dimension0.25 mm | Verpackung7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 25 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | Kapazität100 nF | Kapazität±20% | Nennspannung25 V (DC) | Bauform0402 | Betriebstemperatur -55 °C up to +85 °C | – | Verlustfaktor10 % | Isolationswiderstand5 GΩ | KeramiktypX5R Klasse II | Länge1 mm | Breite0.5 mm | Höhe0.5 mm | Pad Dimension0.25 mm | Verpackung7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 16 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 16 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | Kapazität100 nF | Kapazität±10% | Nennspannung16 V (DC) | Bauform0603 | Betriebstemperatur -55 °C up to +125 °C | – | Verlustfaktor3.5 % | Isolationswiderstand5 GΩ | KeramiktypX7R Klasse II | Länge1.6 mm | Breite0.8 mm | Höhe0.8 mm | Pad Dimension0.4 mm | Verpackung7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 25 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | Kapazität470 nF | Kapazität±10% | Nennspannung25 V (DC) | Bauform0603 | Betriebstemperatur -55 °C up to +125 °C | – | Verlustfaktor10 % | Isolationswiderstand1.1 GΩ | KeramiktypX7R Klasse II | Länge1.6 mm | Breite0.8 mm | Höhe0.8 mm | Pad Dimension0.4 mm | Verpackung7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 50 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | Kapazität100 nF | Kapazität±10% | Nennspannung50 V (DC) | Bauform0603 | Betriebstemperatur -55 °C up to +125 °C | – | Verlustfaktor3 % | Isolationswiderstand5 GΩ | KeramiktypX7R Klasse II | Länge1.6 mm | Breite0.8 mm | Höhe0.8 mm | Pad Dimension0.4 mm | Verpackung7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | |||||
 | WR-MJ Cat 3 Modular Jacks – THT, –, – | Simulation– | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWR-MJ Cat 3 Modular Jacks – THT | – | – | – | – | – | – | – | Spitzen-Wellenlänge (Grün) [typ.]570 nm | Spitzen-Wellenlänge (Gelb) [typ.]590 nm | – | Lichtstärke (Grün) [typ.]13 mcd | Lichtstärke (Gelb) [typ.]8 mcd | – | Durchlassspannung (Grün) [typ.]2.3 V | Durchlassspannung (Gelb) [typ.]2.3 V | – | Abstrahlwinkel Phi 0° [typ.]140 ° | – | – | – | – | Betriebstemperatur -40 °C up to +85 °C | – | – | Isolationswiderstand1000 MΩ | – | – | – | – | – | VerpackungTray | – | – | – | – | – | – | MontageartTHT | Anzahl der Pins (xPxC)8P8C | – | Ports1x1 | Schirmunggeschirmt | Tab PositionUnten | EMI FingerJa | LED (Links-Rechts)gelb-grün | AnwendungssystemCAT 3 | Nennstrom1.5 A | Arbeitsspannung125 V (AC) | – | – | – | – | – | – | TypHorizontal | – | |||
 | WL-SMCC SMT Mono-color Chip LED Compact, –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWL-SMCC SMT Mono-color Chip LED Compact | – | – | – | – | dominante Wellenlänge [typ.]625 nm | FarbeRot | Spitzen-Wellenlänge [typ.]630 nm | – | – | Lichtstärke [typ.]100 mcd | – | – | Durchlassspannung [typ.]2 V | – | – | ChiptechnologieAlInGaP | Abstrahlwinkel Phi 0° [typ.]120 ° | – | – | – | Bauform0402 | Betriebstemperatur -40 °C up to +85 °C | – | – | – | – | Länge1 mm | Breite0.5 mm | Höhe0.4 mm | – | VerpackungTape and Reel | – | – | – | – | – | – | MontageartSMT | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | ||||
| WL-SMCC SMT Mono-color Chip LED Compact, –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWL-SMCC SMT Mono-color Chip LED Compact | – | – | – | – | dominante Wellenlänge [typ.]570 nm | FarbeHellgrün | Spitzen-Wellenlänge [typ.]572 nm | – | – | Lichtstärke [typ.]50 mcd | – | – | Durchlassspannung [typ.]2 V | – | – | ChiptechnologieAlInGaP | Abstrahlwinkel Phi 0° [typ.]120 ° | – | – | – | Bauform0402 | Betriebstemperatur -40 °C up to +85 °C | – | – | – | – | Länge1 mm | Breite0.5 mm | Höhe0.4 mm | – | VerpackungTape and Reel | – | – | – | – | – | – | MontageartSMT | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | ||||
 | WL-SMCC SMT Mono-color Chip LED Compact, –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWL-SMCC SMT Mono-color Chip LED Compact | – | – | – | – | dominante Wellenlänge [typ.]605 nm | FarbeBernstein | Spitzen-Wellenlänge [typ.]609 nm | – | – | Lichtstärke [typ.]80 mcd | – | – | Durchlassspannung [typ.]2 V | – | – | ChiptechnologieAlInGaP | Abstrahlwinkel Phi 0° [typ.]120 ° | – | – | – | Bauform0402 | Betriebstemperatur -40 °C up to +85 °C | – | – | – | – | Länge1 mm | Breite0.5 mm | Höhe0.25 mm | – | – | – | – | – | – | – | – | MontageartSMT | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | ||||
 | WE-TMSB SMT-Ferrit, –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWE-TMSB SMT-Ferrit | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | Bauform0402 | Betriebstemperatur -55 °C up to +125 °C | – | – | – | – | Länge1 mm | Breite0.5 mm | Höhe0.5 mm | Pad Dimension0.25 mm | – | – | – | – | Gleichstromwiderstand220 mΩ | – | – | MontageartSMT | – | – | – | – | – | – | – | – | Nennstrom0.85 A | – | Impedanz @ 100 MHz600 Ω | Maximale Impedanz720 Ω | Maximale Impedanz211 MHz | – | – | Impedanz @ 1 GHz218 Ω | TypBreitband | Gleichstromwiderstand250 mΩ |