IC manufacturers STMicroelectronics

IC manufacturers (103)

STMicroelectronics STM32F746ZGT7 | Demoboard STEVAL-PLC001V1

Industrial PLC evaluation board with HMI interface

Overview

TopologyOther Topology

Description

The STEVAL-PLC001V1 evaluation board targets compact programmable logiccontroller (PLC) applications in the factory automation domain. It features a powerfulhuman machine interface (HMI) thanks to the 3.5” TFT touchscreen mounted on thePCB, which eases interaction with the tool.The board implements a galvanically isolated PLC control unit with robust digitalinput, digital output modules, expansion connectivity options, and interfaces.The control unit consists of a powerful 144-pin STM32F746ZGT7 MCU, whichhandles the industrial IOs on one side and the TouchGFX display technology on theother side, implementing the ladder logic programming code and several additionaloptions.Highly robust and reliable industrial digital input and output modules are placedsymmetrically on the PCB, making the system a 12+12 PLC, that is, a PLC GUIoptimized for STM32 microcontrollers, which manages 12 industrial inputs and 12industrial outputs.The 12 industrial inputs have been implemented through the combination of aneight-channel CLT01-38SQ7 and two dual channel CLT03-2Q3 ICs.The CLT01-38SQ7 features 6.25 MHz SPI with daisy chain capability to connect, inthis case, the eight-channel output ISO8200AQ and reverse polarity, whereas the CLT03-2Q3 features two high- and low-side compatible independent channels, which can be powered from the external sensors they interface with, and the capability of running in the 60 V range for fail-safe applications.The 12 industrial output array consists of an eight-channel ISO8200AQ IC and afour-channel IPS4260L low-side intelligent power switch.The ISO8200AQ offers a daisy-chain SPI interface and embedded galvanic insulation, separating logic and power side of 4 kV and making the solution costeffective (no opto-coupler is needed).The STEVAL-PLC001V1 also features connectivity options typical of commercialPLCs through the morpho connectors mounted on the PCB bottom, ensuringcompatibility with STM32 Nucleo expansion boards.The embedded ICs for industrial IO management allow great flexibility in terms of technical features, protections and embedded diagnostics, when interfacing industrial range inputs (that is, sensors and valves) and outputs (that is, lamps, alarms, and actuators) with the logic side.The STSW-PLC001 companion software package, freely available on www.st.com,allows experimenting with these advanced features and their combination.Thanks to this software and the smart user interface offered by the TouchGFX, youcan learn how the ICs work and exploit ready-to-use examples as well as ladder logic demonstrations and projects.

Features

  • STM32F746ZGT7 high-performance MCU embedding ARM® 32-bit Cortex®-M7CPU with FPU, Chrom-ART accelerator, and DSP instructions
  • CLT01-38SQ7 octal high-speed digital input current limiter with SPI interface
  • CLT03-2Q3 dual-channel self-powered digital input current limiter
  • ISO8200AQ galvanic isolated octal high-side smart power solid-state relay withSPI interface
  • IPS4260L quad low-side intelligent power switch
  • Main supply voltage: 18 - 32 V (24 V nominal)
  • STSW-PLC001 firmware package
  • 3.5" TFT display with multitouch capability interfaced through dedicated parallel,digital RGB ports and I²C lines
  • STLD40DPUR-based display back-light LED driver with controllable intensity
  • Morpho connectors for expansion connectivity options
  • Screw connectors for safer power supply and industrial IO connections
  • USB connector for alternate 5 V source power supply (only for display poweringand MCU programming/debug)
  • Isolated USART port connector
  • SWD connector for debugging and programming
  • Status LEDs for inputs, outputs, and various fault conditions
  • Debug LEDs
  • Reset button
  • Protections against surge, EMI, and input reverse voltage connection
  • EMC pad and four-layer routing
  • On-board RAM and serial Flash (ROM)
  • Provision for RTC, USB (with one or more additional components to bemounted)
  • Designed to meet IEC industrial standard requirements
  • RoHS

Typical applications

  • programmable logic controllers(PLC)

Products

Order Code
Data­sheet
Simu­lation
Downloads
Status
Product series
Pins
PCB/Cable/Panel
Modularity
Wire Section
λDom typ.(nm)
Emitting Color
λPeak typ.(nm)
IV typ.(mcd)
VF typ.(V)
Chip Technology
50% typ.(°)
C
Tol. C
VR(V (DC))
Size
Operating Temperature
Q(%)
DF(%)
RISO
Ceramic Type
L(mm)
W(mm)
Fl(mm)
Packaging
Mount
Working Voltage(V (AC))
Color
Gender
Z @ 100 MHz(Ω)
Zmax(Ω)
Test Condition Zmax
IR(A)
Z @ 1 GHz(Ω)
H(mm)
Type
Samples
WR-PHD Jumper, 1, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Product seriesWR-PHD Jumper
Pins
Operating Temperature -40 °C up to +125 °C
Insulation Resistance1000 MΩ
Length2.44 mm
PackagingBag 
Working Voltage250 V (AC)
ColorBlack 
GenderJumper 
Rated Current3 A
WR-PHD Pin Header - Single, 2, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Pins
Operating Temperature -40 °C up to +105 °C
Insulation Resistance1000 MΩ
Length5.08 mm
PackagingBag 
MountTHT 
Working Voltage250 V (AC)
GenderPin Header 
Rated Current3 A
TypeStraight 
WR-PHD Pin Header - Single, 3, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Pins
Operating Temperature -40 °C up to +105 °C
Insulation Resistance1000 MΩ
Length7.62 mm
PackagingBag 
MountTHT 
Working Voltage250 V (AC)
GenderPin Header 
Rated Current3 A
TypeStraight 
WR-TBL Series 2109 - 2.54 mm Horiz. Entry, 5, Rising Cage Clamp
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Pins
PCB/Cable/PanelPCB 
ModularityNo 
Wire Section 30 to 18 (AWG) 0.2 to 0.75 (mm²)
Operating Temperature -40 °C up to +105 °C
Length13.1 mm
PackagingBox 
MountTHT 
Working Voltage150 V (AC)
Rated Current6 A
TypeHorizontal 
WR-TBL Series 2315 - 5.08 mm Double Level Horiz. Entry Modular w. Rising Cage, H=19.1 mm, 6, Rising Cage Clamp
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Pins
PCB/Cable/PanelPCB 
ModularityYes 
Wire Section 16 to 26 (AWG) 1.31 to 0.129 (mm²)
Operating Temperature -40 °C up to +105 °C
Length15.24 mm
PackagingBox 
MountTHT 
Working Voltage300 V (AC)
ColorGreen 
Rated Current10 A
TypeHorizontal 
WR-TBL Series 2445 - 5.08 mm Horizontal Entry Modular w. Rising Cage Clamp, 8, Rising Cage Clamp
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Pins
PCB/Cable/PanelPCB 
ModularityNo 
Wire Section 12 to 30 (AWG) 3.31 to 0.0509 (mm²)
Operating Temperature -30 °C up to +120 °C
Length40.64 mm
PackagingBox 
MountTHT 
Working Voltage450 V (AC)
ColorGreen 
Rated Current24 A
TypeHorizontal 
WE-MPSB EMI Multilayer Power Suppression Bead, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Size3312 
Operating Temperature -55 °C up to +125 °C
Length8.5 mm
Width3 mm
Pad Dimension0.89 mm
MountSMT 
Impedance @ 100 MHz100 Ω
Maximum Impedance160 Ω
Maximum Impedance1200 MHz 
Rated Current10 A
Impedance @ 1 GHz169 Ω
Height2.3 mm
TypeHigh Current 
WCAP-CSGP MLCCs 10 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 pF
Capacitance±0.5pF 
Rated Voltage10 V (DC)
Size0402 
Operating Temperature -55 °C up to +125 °C
Q-Factor420 %
Insulation Resistance10 GΩ
Ceramic TypeNP0 Class I 
Length1 mm
Width0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Height0.5 mm
WCAP-CSGP MLCCs 16 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance33 pF
Capacitance±5% 
Rated Voltage16 V (DC)
Size0402 
Operating Temperature -55 °C up to +125 °C
Q-Factor1000 %
Insulation Resistance10 GΩ
Ceramic TypeNP0 Class I 
Length1 mm
Width0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Height0.5 mm
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance10 pF
Capacitance±5% 
Rated Voltage50 V (DC)
Size0402 
Operating Temperature -55 °C up to +125 °C
Q-Factor600 %
Insulation Resistance10 GΩ
Ceramic TypeNP0 Class I 
Length1 mm
Width0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Height0.5 mm
WCAP-CSGP MLCCs 10 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance10 nF
Capacitance±10% 
Rated Voltage10 V (DC)
Size0402 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1 mm
Width0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Height0.5 mm
WCAP-CSGP MLCCs 10 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Capacitance±10% 
Rated Voltage10 V (DC)
Size0402 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor5 %
Insulation Resistance5 GΩ
Ceramic TypeX7R Class II 
Length1 mm
Width0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Height0.5 mm
WCAP-CSGP MLCCs 16 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance10 nF
Capacitance±10% 
Rated Voltage16 V (DC)
Size0402 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1 mm
Width0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Height0.5 mm
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance10 nF
Capacitance±10% 
Rated Voltage25 V (DC)
Size0402 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1 mm
Width0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Height0.5 mm
WCAP-CSGP MLCCs 10 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Capacitance±20% 
Rated Voltage10 V (DC)
Size0402 
Operating Temperature -55 °C up to +85 °C
Dissipation Factor5 %
Insulation Resistance5 GΩ
Ceramic TypeX5R Class II 
Length1 mm
Width0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Height0.5 mm
WCAP-CSGP MLCCs 6.3 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance10 µF
Capacitance±20% 
Rated Voltage6.3 V (DC)
Size0603 
Operating Temperature -55 °C up to +85 °C
Dissipation Factor15 %
Insulation Resistance0.005 GΩ
Ceramic TypeX5R Class II 
Length1.6 mm
Width0.8 mm
Pad Dimension0.35 mm
Packaging7" Tape & Reel 
Height0.8 mm
WCAP-CSGP MLCCs 6.3 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance4.7 µF
Capacitance±10% 
Rated Voltage6.3 V (DC)
Size0805 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor15 %
Insulation Resistance0.02 GΩ
Ceramic TypeX7R Class II 
Length2 mm
Width1.25 mm
Pad Dimension0.5 mm
Packaging7" Tape & Reel 
Height1.25 mm
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance330 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0805 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3 %
Insulation Resistance1.5 GΩ
Ceramic TypeX7R Class II 
Length2 mm
Width1.25 mm
Pad Dimension0.5 mm
Packaging7" Tape & Reel 
Height1.25 mm
WCAP-CSGP MLCCs 10 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance10 µF
Capacitance±20% 
Rated Voltage10 V (DC)
Size0805 
Operating Temperature -55 °C up to +85 °C
Dissipation Factor10 %
Insulation Resistance0.01 GΩ
Ceramic TypeX5R Class II 
Length2 mm
Width1.25 mm
Pad Dimension0.5 mm
Packaging7" Tape & Reel 
Height1.25 mm
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance4.7 µF
Capacitance±20% 
Rated Voltage25 V (DC)
Size0805 
Operating Temperature -55 °C up to +85 °C
Dissipation Factor10 %
Insulation Resistance0.02 GΩ
Ceramic TypeX5R Class II 
Length2 mm
Width1.25 mm
Pad Dimension0.5 mm
Packaging7" Tape & Reel 
Height1.25 mm
WL-SMCW SMT Mono-color Chip LED Waterclear, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Dominant Wavelength [typ.]605 nm
Emitting ColorAmber 
Peak Wavelength [typ.]610 nm
Luminous Intensity [typ.]140 mcd
Forward Voltage [typ.]2 V
Chip TechnologyAlInGaP 
Viewing Angle Phi 0° [typ.]140 °
Size0603 
Operating Temperature -40 °C up to +85 °C
Length1.6 mm
Width0.8 mm
MountSMT 
Height0.25 mm