IC manufacturers (103)
- All manufacturers
Analog Devices
Infineon Technologies
Microchip
Onsemi
Renesas
ROHM
STMicroelectronics
Texas Instruments
- 3peak incorporated (28)
- Ablic (23)
- Acco Semiconductor (1)
- Advanced Power (4)
- Allegro Microsystems (100)
- Alpha & Omega Semiconductor (37)
- AnalogySemi (3)
- AnDAPT Inc (204)
- Anpec (13)
- AXElite (2)
- Backward (6)
- Bright Power Semiconductor (1)
- Broadcom (46)
- Cambridge GaN Devices (18)
- Chipanalog Micro (10)
- Cologne Chips (1)
- Convenient Power (1)
- Dialog Semiconductor (12)
- Diodes Incorporated (259)
- Divimath (8)
- Elmos AG (1)
- EPC (136)
- e-Peas Semiconductors (1)
- Eta Solutions Co. Ltd. (9)
- GaN Systems (8)
- GaNPower (3)
- Giantec (1)
- Gstek Wuxi (1)
- Helix Semiconductor (7)
- IKON (1)
- Indie Semiconductor (8)
- Innovision Semiconductor Inc (2)
- Intel (68)
- Inventchip Technology (3)
- ISSI (51)
- JoulWatt (20)
- KDPOF (3)
- Kinetic Technology (8)
- Lattice semiconductor Corporation (38)
- Littelfuse (1)
- Lumissil Microsystems (8)
- M3 Technology (M3Tek) (7)
- Macnica (22)
- Marvell Semiconductor (1)
- MaxLinear (181)
- Menlo Micro (1)
- MikroE (25)
- MindCet (2)
- Monolithic Power Systems (980)
- Navitas Semiconductor Inc (6)
- NewEdge Technologies, Inc. (1)
- Nexperia (266)
- Nisshinbo Micro Device Inc. (10)
- Novosense Micro (1)
- NXP (333)
- O2 Micro International Ltd (10)
- On Bright (7)
- Panasonic (2)
- PN Junction Semiconductor (2)
- Power Integrations (117)
- Powermat (1)
- Pulsiv (19)
- Qorvo (96)
- Realsil SuRealsil(tek) Microelectronics (1)
- Richtek (297)
- Sanken Electric Co., Ltd. (16)
- Sckipio (6)
- Semtech (86)
- SG-Micro (54)
- SiFive (2)
- Silanna Semiconductor (9)
- Silergy Corporation (33)
- Silicon Laboratory Inc. (108)
- Silicontent Technology (59)
- Silvertel (59)
- Skycore Semiconductors (1)
- Skyworks (33)
- Southchip (14)
- Summit Wireless (1)
- Tagore Tech (7)
- Taiwan Semiconductor (1)
- TDK Corporation (1)
- Tempo Semiconductor (1)
- Torex (37)
- Toshiba (25)
- Transphorm (21)
- TransSIP (2)
- Union (21)
- uPI Semiconductor (2)
- Valens Semiconductor (31)
- Wise Integration (3)
- Wolfspeed (23)
- Xilinx (22)
- XL Semiconductor (3)
- XYSemi (62)
Overview
| Topology | Other Topology |
| Input voltage | 10 V |
| Output 1 | 60 V |
| IC revision | 1.0 |
Description
The X-NUCLEO-DOL10A1 industrial digital output expansion board for STM32 Nucleo provides a powerful and flexible environment for the evaluation of the driving and diagnostic capabilities of the IPS1050LQ single low-side smart power solid state relay, with configurable smart overload protection.The X-NUCLEO-DOL10A1 expansion board interfaces with the microcontroller on the STM32 Nucleo via STISO620 and Arduino®R3 connectors. The expansion board can be connected to either a NUCLEO-F401RE or a NUCLEO-G431RB development board.The digital isolators STISO620 (featuring 2.8 kVRMS galvanic isolation) and the isolated dc-dc DC1 (featuring 3 kVDC isolation) protects the logic side from the typical harsh environment on the process side.The logic side is the application side where the MCU operates and it is supplied by the VISO_L rail (3.3 V or 5.0 V, according to setting of SW7). The on-board Arduino® UNO R3 connectors enable the connection to either a NUCLEO-F401RE or a NUCLEO-G431RB development board.When the X-NUCLEO-DOL10A1 is stacked on a NUCLEO-F401RE, or on a NUCLEO-G431RB, the VISO_L is supplied by the Nucleo board if connected to a PC/Laptop by USB cable. If the X-NUCLEO-DOL10A1 is used standalone, then VISO_L can be supplied by the CN6[4] (SW7 = close 1-2) or CN6[5] (SW7 = close 2-3).The process side is the application side beyond the galvanic isolation barrier. On the process side there are three supply rails: the 5V_P (5.0 V) and 10V_P (10.0 V) both from DC1, an the 6V rail (derived from V_FIELD_RP line through LDO40LPURY).The 5V_P and 10V_P rails can be enabled by JP4 = close. The 6V rail can be enabled by JP5 = close.The SW11 defines the supply rail of U1: by default from 6V rail (SW11 = close 2-3), or alternatively from 10V_P rail (SW11 = close 1-2).The SW12 defines the pull-up rail of the open drain diagnostic signals: by default from 6V rail (SW12 = close 2-3), or alternatively from 5V_P rail (SW12 = close 1-2).The V_FIELD_RP rail (from CN1 connector) is protected both from reverse polarity on CN1 (by the STPS1H100A, provided that J1 remains open) and against surge pulse (by SM15T39CA (U2), provided that J2 is set closed).The load is connected between the CN1[2] connector and the process side supply rail (typically 24 V) on CN1[1]. The reference rail (ground) of the process side power supply rail must be connected to CN1[3].The SW13 allows the selection or not of the external TVS that ca be used for the demagnetization of the inductive load and for sustaining the surge pulse on the output stage.The low side power switch integrated in U1 can be activated/deactivated by the control signals IN_L: by default, this signal is controlled by CN5[2] through SW1[1-2].The on board green LED D5 can be enabled by closing J3: this is driven ON/OFF according to the status (active/inactive) of the low side power switch (OUT) integrated in the U1.The diagnostic signal OVT_L (over-temperature) is available on CN9[6] (SW6 = close 1-2) or CN5[4] (SW6 = close 2-3).Smart overload protection can be configured through the inrush current level setting as follows:Configuration for inrush current level setting through IPDx digital signals (MCU): SW8 = close 2-3, SW9 = close 2-3, SW10 = close 2-3Configuration for inrush current level static setting through the digital signal driving the output channel (IN_L): SW8 = close 1-2 (for H level J14 = close, for L level J13 = close), SW9 = close 1-2 (for H level J19 = close, for L level J18 = close), SW10 = close 1-2 (for H level J24 = close, for L level J23 = close)Configuration for inrush current level dynamic setting through the digital signal driving the output channel (IN_L): SW8 = close 1-2, J14 = close and J10, J11, J12 setting for the proper capacitance selection, SW9 = close 1-2, J19 = close and J15, J16, J17 setting for the proper capacitance selection, SW10 = close 1-2, J24 = close and J20, J21, J22 setting for the proper capacitance selectionThe switches SW1, SW2, SW3, SW4, SW6 offer to the user some flexibility for the remapping of the driving signals IN_L, IPD1_L, IPD2_L, IPD3_L and OVT_L on CN5, CN8 and CN9 (see Schematic diagrams for further details).It is also possible to evaluate a system composed of a X-NUCLEO-DOL10A1 stacked on other expansion boards.
Features
Based on the IPS1050LQ single low-side switch, which features:Operating voltage range 5.8 to 10 VSmart overload protection with configurable inrush and limitation levels3.3 V and 5 V compatible I/OVery low On-state resistance (RDSON ≤ 50 mΩ)Fast demagnetization of inductive loadsJunction over-temperature protectionsOver-temperature diagnostic pinUndervoltage lock-outLoss of supply / loss of ground protectionDesigned to meet IEC 61000-4-2, IEC61000-4-4, and IEC61000-4-5QFN32L 6x6 mm packageGalvanic isolation between logic and process sides by STISO620 digital isolators and isolated DC-DC converterSelectable supply of the IPS1050LQ from 24 V supply rail, or alternatively from on board isolated dc-dc converterProcess side supply rail reverse polarity protection by STPS1H100AOn board high efficiency 24 V to 6 V LDO (LDO40LPURY)Supply rail surge pulse protection by SM15T39CADigital signals for smart overload protection configurationConfiguration for inrush current level settingCompatible with STM32 Nucleo development boardsEquipped with Arduino® UNO R3 connectorsRoHS and China RoHS compliantCE certified
Typical applications
- Factory automation
More information
Products
Order Code | Datasheet | Simulation | Downloads | Status | Product series | Pins | PCB/Cable/Panel | Modularity | Type | Wire Section | λDom typ.(nm) | Emitting Color | λPeak typ.(nm) | IV typ.(mcd) | VF typ.(V) | Chip Technology | 2θ50% typ.(°) | C | Tol. C | VR(V (DC)) | Size | Operating Temperature | Q(%) | DF(%) | RISO | Ceramic Type | L(mm) | W(mm) | H(mm) | Fl(mm) | Packaging | L(µH) | IRP,40K(A) | RDC max.(mΩ) | fres(MHz) | Mount | Samples | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | WR-TBL Series 2141 - 3.50 mm Horiz. Entry Modular, 2, Rising Cage Clamp | Simulation– | Downloads6 files | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWR-TBL Series 2141 - 3.50 mm Horiz. Entry Modular | Pins2 | PCB/Cable/PanelPCB | ModularityYes | TypeHorizontal | Wire Section 24 to 16 (AWG) 0.2 to 1 (mm²) | – | – | – | – | – | – | – | – | – | – | – | Operating Temperature -40 °C up to +105 °C | – | – | – | – | Length7.05 mm | – | – | – | PackagingBox | – | – | – | – | MountTHT | ||
| WR-TBL Series 2141 - 3.50 mm Horiz. Entry Modular, 3, Rising Cage Clamp | Simulation– | Downloads6 files | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWR-TBL Series 2141 - 3.50 mm Horiz. Entry Modular | Pins3 | PCB/Cable/PanelPCB | ModularityYes | TypeHorizontal | Wire Section 24 to 16 (AWG) 0.2 to 1 (mm²) | – | – | – | – | – | – | – | – | – | – | – | Operating Temperature -40 °C up to +105 °C | – | – | – | – | Length10.5 mm | – | – | – | PackagingBox | – | – | – | – | MountTHT | ||
 | WE-GF SMT Wire Wound Inductor, –, – | Simulation– | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWE-GF SMT Wire Wound Inductor | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | Size3225 | Operating Temperature -40 °C up to +105 °C | Q-Factor30 % | – | – | – | Length3.2 mm | Width2.5 mm | Height2.2 mm | – | – | Inductance6.8 µH | Performance Rated Current0.55 A | DC Resistance1800 mΩ | Self Resonant Frequency38 MHz | MountSMT | |||
 | WL-SMCW SMT Mono-color Chip LED Waterclear, –, – | Downloads26 files RAY files
| Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWL-SMCW SMT Mono-color Chip LED Waterclear | – | – | – | – | – | Dominant Wavelength [typ.]625 nm | Emitting ColorRed | Peak Wavelength [typ.]630 nm | Luminous Intensity [typ.]250 mcd | Forward Voltage [typ.]2 V | Chip TechnologyAlInGaP | Viewing Angle Phi 0° [typ.]140 ° | – | – | – | Size0603 | Operating Temperature -40 °C up to +85 °C | – | – | – | – | Length1.6 mm | Width0.8 mm | Height0.7 mm | – | PackagingTape and Reel | – | – | – | – | MountSMT | |||
| WL-SMCW SMT Mono-color Chip LED Waterclear, –, – | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWL-SMCW SMT Mono-color Chip LED Waterclear | – | – | – | – | – | Dominant Wavelength [typ.]570 nm | Emitting ColorBright Green | Peak Wavelength [typ.]572 nm | Luminous Intensity [typ.]40 mcd | Forward Voltage [typ.]2 V | Chip TechnologyAlInGaP | Viewing Angle Phi 0° [typ.]140 ° | – | – | – | Size0603 | Operating Temperature -40 °C up to +85 °C | – | – | – | – | Length1.6 mm | Width0.8 mm | Height0.7 mm | – | PackagingTape and Reel | – | – | – | – | MountSMT | ||||
| WCAP-CSGP MLCCs 16 V(DC), –, – | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 16 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | Capacitance47 pF | Capacitance±5% | Rated Voltage16 V (DC) | Size0603 | Operating Temperature -55 °C up to +125 °C | Q-Factor1000 % | – | Insulation Resistance10 GΩ | Ceramic TypeNP0 Class I | Length1.6 mm | Width0.8 mm | Height0.8 mm | Pad Dimension0.4 mm | Packaging7" Tape & Reel | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 50 V(DC), –, – | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | Capacitance470 pF | Capacitance±5% | Rated Voltage50 V (DC) | Size0603 | Operating Temperature -55 °C up to +125 °C | Q-Factor1000 % | – | Insulation Resistance10 GΩ | Ceramic TypeNP0 Class I | Length1.6 mm | Width0.8 mm | Height0.8 mm | Pad Dimension0.4 mm | Packaging7" Tape & Reel | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 16 V(DC), –, – | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 16 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | Capacitance4.7 nF | Capacitance±10% | Rated Voltage16 V (DC) | Size0603 | Operating Temperature -55 °C up to +125 °C | – | Dissipation Factor3.5 % | Insulation Resistance10 GΩ | Ceramic TypeX7R Class II | Length1.6 mm | Width0.8 mm | Height0.8 mm | Pad Dimension0.4 mm | Packaging7" Tape & Reel | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 16 V(DC), –, – | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 16 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | Capacitance47 nF | Capacitance±10% | Rated Voltage16 V (DC) | Size0603 | Operating Temperature -55 °C up to +125 °C | – | Dissipation Factor3.5 % | Insulation Resistance10 GΩ | Ceramic TypeX7R Class II | Length1.6 mm | Width0.8 mm | Height0.8 mm | Pad Dimension0.4 mm | Packaging7" Tape & Reel | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 16 V(DC), –, – | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 16 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | Capacitance100 nF | Capacitance±10% | Rated Voltage16 V (DC) | Size0603 | Operating Temperature -55 °C up to +125 °C | – | Dissipation Factor3.5 % | Insulation Resistance5 GΩ | Ceramic TypeX7R Class II | Length1.6 mm | Width0.8 mm | Height0.8 mm | Pad Dimension0.4 mm | Packaging7" Tape & Reel | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 10 V(DC), –, – | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 10 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | Capacitance4.7 µF | Capacitance±10% | Rated Voltage10 V (DC) | Size0805 | Operating Temperature -55 °C up to +125 °C | – | Dissipation Factor10 % | Insulation Resistance0.02 GΩ | Ceramic TypeX7R Class II | Length2 mm | Width1.25 mm | Height1.25 mm | Pad Dimension0.5 mm | Packaging7" Tape & Reel | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 100 V(DC), –, – | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 100 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | Capacitance15 nF | Capacitance±10% | Rated Voltage100 V (DC) | Size0805 | Operating Temperature -55 °C up to +125 °C | – | Dissipation Factor2.5 % | Insulation Resistance6.7 GΩ | Ceramic TypeX7R Class II | Length2 mm | Width1.25 mm | Height0.8 mm | Pad Dimension0.5 mm | Packaging7" Tape & Reel | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 100 V(DC), –, – | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 100 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | Capacitance100 nF | Capacitance±10% | Rated Voltage100 V (DC) | Size0805 | Operating Temperature -55 °C up to +125 °C | – | Dissipation Factor2.5 % | Insulation Resistance1 GΩ | Ceramic TypeX7R Class II | Length2 mm | Width1.25 mm | Height1.25 mm | Pad Dimension0.5 mm | Packaging7" Tape & Reel | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 100 V(DC), –, – | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 100 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | Capacitance2.2 µF | Capacitance±10% | Rated Voltage100 V (DC) | Size1210 | Operating Temperature -55 °C up to +125 °C | – | Dissipation Factor5 % | Insulation Resistance0.05 GΩ | Ceramic TypeX7R Class II | Length3.2 mm | Width2.5 mm | Height2.5 mm | Pad Dimension0.75 mm | Packaging7" Tape & Reel | – | – | – | – | – |