IC-Hersteller (103)
- Alle Hersteller
Analog Devices
Infineon Technologies
Microchip
Onsemi
Renesas
ROHM
STMicroelectronics
Texas Instruments
- 3peak incorporated (28)
- Ablic (23)
- Acco Semiconductor (1)
- Advanced Power (4)
- Allegro Microsystems (100)
- Alpha & Omega Semiconductor (37)
- AnalogySemi (3)
- AnDAPT Inc (204)
- Anpec (13)
- AXElite (2)
- Backward (6)
- Bright Power Semiconductor (1)
- Broadcom (46)
- Cambridge GaN Devices (18)
- Chipanalog Micro (10)
- Cologne Chips (1)
- Convenient Power (1)
- Dialog Semiconductor (12)
- Diodes Incorporated (259)
- Divimath (8)
- Elmos AG (1)
- EPC (136)
- e-Peas Semiconductors (1)
- Eta Solutions Co. Ltd. (9)
- GaN Systems (8)
- GaNPower (3)
- Giantec (1)
- Gstek Wuxi (1)
- Helix Semiconductor (7)
- IKON (1)
- Indie Semiconductor (8)
- Innovision Semiconductor Inc (2)
- Intel (68)
- Inventchip Technology (3)
- ISSI (51)
- JoulWatt (20)
- KDPOF (3)
- Kinetic Technology (8)
- Lattice semiconductor Corporation (38)
- Littelfuse (1)
- Lumissil Microsystems (8)
- M3 Technology (M3Tek) (7)
- Macnica (22)
- Marvell Semiconductor (1)
- MaxLinear (181)
- Menlo Micro (1)
- MikroE (25)
- MindCet (2)
- Monolithic Power Systems (980)
- Navitas Semiconductor Inc (6)
- NewEdge Technologies, Inc. (1)
- Nexperia (266)
- Nisshinbo Micro Device Inc. (10)
- Novosense Micro (1)
- NXP (333)
- O2 Micro International Ltd (10)
- On Bright (7)
- Panasonic (2)
- PN Junction Semiconductor (2)
- Power Integrations (117)
- Powermat (1)
- Pulsiv (19)
- Qorvo (96)
- Realsil SuRealsil(tek) Microelectronics (1)
- Richtek (297)
- Sanken Electric Co., Ltd. (16)
- Sckipio (6)
- Semtech (86)
- SG-Micro (54)
- SiFive (2)
- Silanna Semiconductor (9)
- Silergy Corporation (33)
- Silicon Laboratory Inc. (108)
- Silicontent Technology (59)
- Silvertel (59)
- Skycore Semiconductors (1)
- Skyworks (33)
- Southchip (14)
- Summit Wireless (1)
- Tagore Tech (7)
- Taiwan Semiconductor (1)
- TDK Corporation (1)
- Tempo Semiconductor (1)
- Torex (37)
- Toshiba (25)
- Transphorm (21)
- TransSIP (2)
- Union (21)
- uPI Semiconductor (2)
- Valens Semiconductor (31)
- Wise Integration (3)
- Wolfspeed (23)
- Xilinx (22)
- XL Semiconductor (3)
- XYSemi (62)
Details
| Topologie | Sonstige Topologie |
| Eingangsspannung | 10 V |
| Ausgang 1 | 60 V |
| IC-Revision | 1.0 |
Beschreibung
The X-NUCLEO-DOL10A1 industrial digital output expansion board for STM32 Nucleo provides a powerful and flexible environment for the evaluation of the driving and diagnostic capabilities of the IPS1050LQ single low-side smart power solid state relay, with configurable smart overload protection.The X-NUCLEO-DOL10A1 expansion board interfaces with the microcontroller on the STM32 Nucleo via STISO620 and Arduino®R3 connectors. The expansion board can be connected to either a NUCLEO-F401RE or a NUCLEO-G431RB development board.The digital isolators STISO620 (featuring 2.8 kVRMS galvanic isolation) and the isolated dc-dc DC1 (featuring 3 kVDC isolation) protects the logic side from the typical harsh environment on the process side.The logic side is the application side where the MCU operates and it is supplied by the VISO_L rail (3.3 V or 5.0 V, according to setting of SW7). The on-board Arduino® UNO R3 connectors enable the connection to either a NUCLEO-F401RE or a NUCLEO-G431RB development board.When the X-NUCLEO-DOL10A1 is stacked on a NUCLEO-F401RE, or on a NUCLEO-G431RB, the VISO_L is supplied by the Nucleo board if connected to a PC/Laptop by USB cable. If the X-NUCLEO-DOL10A1 is used standalone, then VISO_L can be supplied by the CN6[4] (SW7 = close 1-2) or CN6[5] (SW7 = close 2-3).The process side is the application side beyond the galvanic isolation barrier. On the process side there are three supply rails: the 5V_P (5.0 V) and 10V_P (10.0 V) both from DC1, an the 6V rail (derived from V_FIELD_RP line through LDO40LPURY).The 5V_P and 10V_P rails can be enabled by JP4 = close. The 6V rail can be enabled by JP5 = close.The SW11 defines the supply rail of U1: by default from 6V rail (SW11 = close 2-3), or alternatively from 10V_P rail (SW11 = close 1-2).The SW12 defines the pull-up rail of the open drain diagnostic signals: by default from 6V rail (SW12 = close 2-3), or alternatively from 5V_P rail (SW12 = close 1-2).The V_FIELD_RP rail (from CN1 connector) is protected both from reverse polarity on CN1 (by the STPS1H100A, provided that J1 remains open) and against surge pulse (by SM15T39CA (U2), provided that J2 is set closed).The load is connected between the CN1[2] connector and the process side supply rail (typically 24 V) on CN1[1]. The reference rail (ground) of the process side power supply rail must be connected to CN1[3].The SW13 allows the selection or not of the external TVS that ca be used for the demagnetization of the inductive load and for sustaining the surge pulse on the output stage.The low side power switch integrated in U1 can be activated/deactivated by the control signals IN_L: by default, this signal is controlled by CN5[2] through SW1[1-2].The on board green LED D5 can be enabled by closing J3: this is driven ON/OFF according to the status (active/inactive) of the low side power switch (OUT) integrated in the U1.The diagnostic signal OVT_L (over-temperature) is available on CN9[6] (SW6 = close 1-2) or CN5[4] (SW6 = close 2-3).Smart overload protection can be configured through the inrush current level setting as follows:Configuration for inrush current level setting through IPDx digital signals (MCU): SW8 = close 2-3, SW9 = close 2-3, SW10 = close 2-3Configuration for inrush current level static setting through the digital signal driving the output channel (IN_L): SW8 = close 1-2 (for H level J14 = close, for L level J13 = close), SW9 = close 1-2 (for H level J19 = close, for L level J18 = close), SW10 = close 1-2 (for H level J24 = close, for L level J23 = close)Configuration for inrush current level dynamic setting through the digital signal driving the output channel (IN_L): SW8 = close 1-2, J14 = close and J10, J11, J12 setting for the proper capacitance selection, SW9 = close 1-2, J19 = close and J15, J16, J17 setting for the proper capacitance selection, SW10 = close 1-2, J24 = close and J20, J21, J22 setting for the proper capacitance selectionThe switches SW1, SW2, SW3, SW4, SW6 offer to the user some flexibility for the remapping of the driving signals IN_L, IPD1_L, IPD2_L, IPD3_L and OVT_L on CN5, CN8 and CN9 (see Schematic diagrams for further details).It is also possible to evaluate a system composed of a X-NUCLEO-DOL10A1 stacked on other expansion boards.
Eigenschaften
Based on the IPS1050LQ single low-side switch, which features:Operating voltage range 5.8 to 10 VSmart overload protection with configurable inrush and limitation levels3.3 V and 5 V compatible I/OVery low On-state resistance (RDSON ≤ 50 mΩ)Fast demagnetization of inductive loadsJunction over-temperature protectionsOver-temperature diagnostic pinUndervoltage lock-outLoss of supply / loss of ground protectionDesigned to meet IEC 61000-4-2, IEC61000-4-4, and IEC61000-4-5QFN32L 6x6 mm packageGalvanic isolation between logic and process sides by STISO620 digital isolators and isolated DC-DC converterSelectable supply of the IPS1050LQ from 24 V supply rail, or alternatively from on board isolated dc-dc converterProcess side supply rail reverse polarity protection by STPS1H100AOn board high efficiency 24 V to 6 V LDO (LDO40LPURY)Supply rail surge pulse protection by SM15T39CADigital signals for smart overload protection configurationConfiguration for inrush current level settingCompatible with STM32 Nucleo development boardsEquipped with Arduino® UNO R3 connectorsRoHS and China RoHS compliantCE certified
Typische Anwendungen
- Factory automation
Weiterführende Informationen
Artikeldaten
Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | Pins | PCB/Kabel/Panel | Modularity | Typ | Wire Section | λDom typ.(nm) | Farbe | λPeak typ.(nm) | IV typ.(mcd) | VF typ.(V) | Chiptechnologie | 2θ50% typ.(°) | C | Tol. C | VR(V (DC)) | Bauform | Betriebstemperatur | Q(%) | DF(%) | RISO | Keramiktyp | L(mm) | B(mm) | H(mm) | Fl(mm) | Verpackung | L(µH) | IRP,40K(A) | RDC max.(mΩ) | fres(MHz) | Montageart | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | WR-TBL Series 2141 - 3.50 mm Horiz. Entry Modular, 2, Käfigzugklemme | Simulation– | Downloads6 Dateien | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | Pins2 | PCB/Kabel/PanelPCB | ModularityJa | TypHorizontal | Wire Section 24 to 16 (AWG) 0.2 to 1 (mm²) | – | – | – | – | – | – | – | – | – | – | – | Betriebstemperatur -40 °C up to +105 °C | – | – | – | – | Länge7.05 mm | – | – | – | VerpackungKarton | – | – | – | – | MontageartTHT | |||
| WR-TBL Series 2141 - 3.50 mm Horiz. Entry Modular, 3, Käfigzugklemme | Simulation– | Downloads6 Dateien | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | Pins3 | PCB/Kabel/PanelPCB | ModularityJa | TypHorizontal | Wire Section 24 to 16 (AWG) 0.2 to 1 (mm²) | – | – | – | – | – | – | – | – | – | – | – | Betriebstemperatur -40 °C up to +105 °C | – | – | – | – | Länge10.5 mm | – | – | – | VerpackungKarton | – | – | – | – | MontageartTHT | |||
 | WE-GF SMT-Induktivität, –, – | Simulation– | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWE-GF SMT-Induktivität | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | Bauform3225 | Betriebstemperatur -40 °C up to +105 °C | Güte30 % | – | – | – | Länge3.2 mm | Breite2.5 mm | Höhe2.2 mm | – | – | Induktivität6.8 µH | Performance Nennstrom0.55 A | Gleichstromwiderstand1800 mΩ | Eigenresonanzfrequenz38 MHz | MontageartSMT | |||
 | WL-SMCW SMT Mono-color Chip LED Waterclear, –, – | Downloads26 Dateien Strahldaten
| Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWL-SMCW SMT Mono-color Chip LED Waterclear | – | – | – | – | – | dominante Wellenlänge [typ.]625 nm | FarbeRot | Spitzen-Wellenlänge [typ.]630 nm | Lichtstärke [typ.]250 mcd | Durchlassspannung [typ.]2 V | ChiptechnologieAlInGaP | Abstrahlwinkel Phi 0° [typ.]140 ° | – | – | – | Bauform0603 | Betriebstemperatur -40 °C up to +85 °C | – | – | – | – | Länge1.6 mm | Breite0.8 mm | Höhe0.7 mm | – | VerpackungTape and Reel | – | – | – | – | MontageartSMT | |||
| WL-SMCW SMT Mono-color Chip LED Waterclear, –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWL-SMCW SMT Mono-color Chip LED Waterclear | – | – | – | – | – | dominante Wellenlänge [typ.]570 nm | FarbeHellgrün | Spitzen-Wellenlänge [typ.]572 nm | Lichtstärke [typ.]40 mcd | Durchlassspannung [typ.]2 V | ChiptechnologieAlInGaP | Abstrahlwinkel Phi 0° [typ.]140 ° | – | – | – | Bauform0603 | Betriebstemperatur -40 °C up to +85 °C | – | – | – | – | Länge1.6 mm | Breite0.8 mm | Höhe0.7 mm | – | VerpackungTape and Reel | – | – | – | – | MontageartSMT | ||||
| WCAP-CSGP MLCCs 16 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 16 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | Kapazität47 pF | Kapazität±5% | Nennspannung16 V (DC) | Bauform0603 | Betriebstemperatur -55 °C up to +125 °C | Güte1000 % | – | Isolationswiderstand10 GΩ | KeramiktypNP0 Klasse I | Länge1.6 mm | Breite0.8 mm | Höhe0.8 mm | Pad Dimension0.4 mm | Verpackung7" Tape & Reel | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 50 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | Kapazität470 pF | Kapazität±5% | Nennspannung50 V (DC) | Bauform0603 | Betriebstemperatur -55 °C up to +125 °C | Güte1000 % | – | Isolationswiderstand10 GΩ | KeramiktypNP0 Klasse I | Länge1.6 mm | Breite0.8 mm | Höhe0.8 mm | Pad Dimension0.4 mm | Verpackung7" Tape & Reel | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 16 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 16 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | Kapazität4.7 nF | Kapazität±10% | Nennspannung16 V (DC) | Bauform0603 | Betriebstemperatur -55 °C up to +125 °C | – | Verlustfaktor3.5 % | Isolationswiderstand10 GΩ | KeramiktypX7R Klasse II | Länge1.6 mm | Breite0.8 mm | Höhe0.8 mm | Pad Dimension0.4 mm | Verpackung7" Tape & Reel | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 16 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 16 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | Kapazität47 nF | Kapazität±10% | Nennspannung16 V (DC) | Bauform0603 | Betriebstemperatur -55 °C up to +125 °C | – | Verlustfaktor3.5 % | Isolationswiderstand10 GΩ | KeramiktypX7R Klasse II | Länge1.6 mm | Breite0.8 mm | Höhe0.8 mm | Pad Dimension0.4 mm | Verpackung7" Tape & Reel | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 16 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 16 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | Kapazität100 nF | Kapazität±10% | Nennspannung16 V (DC) | Bauform0603 | Betriebstemperatur -55 °C up to +125 °C | – | Verlustfaktor3.5 % | Isolationswiderstand5 GΩ | KeramiktypX7R Klasse II | Länge1.6 mm | Breite0.8 mm | Höhe0.8 mm | Pad Dimension0.4 mm | Verpackung7" Tape & Reel | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 10 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 10 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | Kapazität4.7 µF | Kapazität±10% | Nennspannung10 V (DC) | Bauform0805 | Betriebstemperatur -55 °C up to +125 °C | – | Verlustfaktor10 % | Isolationswiderstand0.02 GΩ | KeramiktypX7R Klasse II | Länge2 mm | Breite1.25 mm | Höhe1.25 mm | Pad Dimension0.5 mm | Verpackung7" Tape & Reel | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 100 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 100 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | Kapazität15 nF | Kapazität±10% | Nennspannung100 V (DC) | Bauform0805 | Betriebstemperatur -55 °C up to +125 °C | – | Verlustfaktor2.5 % | Isolationswiderstand6.7 GΩ | KeramiktypX7R Klasse II | Länge2 mm | Breite1.25 mm | Höhe0.8 mm | Pad Dimension0.5 mm | Verpackung7" Tape & Reel | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 100 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 100 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | Kapazität100 nF | Kapazität±10% | Nennspannung100 V (DC) | Bauform0805 | Betriebstemperatur -55 °C up to +125 °C | – | Verlustfaktor2.5 % | Isolationswiderstand1 GΩ | KeramiktypX7R Klasse II | Länge2 mm | Breite1.25 mm | Höhe1.25 mm | Pad Dimension0.5 mm | Verpackung7" Tape & Reel | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 100 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 100 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | Kapazität2.2 µF | Kapazität±10% | Nennspannung100 V (DC) | Bauform1210 | Betriebstemperatur -55 °C up to +125 °C | – | Verlustfaktor5 % | Isolationswiderstand0.05 GΩ | KeramiktypX7R Klasse II | Länge3.2 mm | Breite2.5 mm | Höhe2.5 mm | Pad Dimension0.75 mm | Verpackung7" Tape & Reel | – | – | – | – | – |