IC manufacturers Semtech

IC manufacturers (103)

Semtech TS51111

High Efficiency Synchronous Rectifier and Charging IC for Wireless Power Applications

Overview

TopologyOther Topology
IC revision0.1

Description

The TS51111 is a fully-integrated synchronous rectifier for wireless charging applications with additional integrated components to minimize system BOM.The TS51111 includes a high efficiency synchronous rectifier to convert the input AC power signal to a DC output level for batterycharging. The device supports both direct battery charging and indirect power applications. Low Rds-on switches minimize power dissipation. High voltage input capability allows for simple and robust secondary side charger implementation. An integrated switchprovides the battery charging path and combined with the rectifier provides back feed protection to the AC inputs. A precharge currentsource is also included for low battery voltage precharge operation. Communication capability is achieved using integrated high voltage switches.The TS51111 includes several additional modules to allow simple integration into wireless power systems. Integrated resistor dividers with zero-current off-mode allow external ADC measurement of PDC, PACKP, USB and thermistor voltages. High voltage switches are included for communication modulation.Power to an external controller is provided through an integrated LDO. The ultra-low quiescent current regulator can supply highoutput currents at low dropout with minimal current draw from the battery.Available in a 45 pin WCSP and 36 pin 6x6 QFN package.

Features

  • High efficiency synchronous rectification of AC input
  • Supports both Direct and Indirect Charging applications
  • Supports WPC Qi® compliant and non-compliant systems
  • Low Rds-on rectifier switches
  • High voltage input for higher power systems
  • Up to 20W+ Output
  • 98% efficiency at high currents

  • Integrated switches for load modulation
  • Integrated switch for battery disconnect
  • Integrated precharge current source
  • 50mA output low Iq LDO
  • Analog mux for ADC sensing
  • Supply Under Voltage Lockout
  • Low external component count
  • Ultra-low standby quiescent current
  • Junction operating temperature -40C to 125C

Typical applications

  • eReaders
  • Cell Phones and Smart Phones
  • Tablet Computers
  • Laptop Computers
  • Small Digital Cameras
  • Wireless charging for portable devices
  • Portable Video Recorders

Products

Order Code
Data­sheet
Simu­lation
Downloads
Status
Product series
C
Tol. C
VR(V (DC))
Operating Temperature
DF(%)
RISO
Ceramic Type
L(mm)
W(mm)
H(mm)
Fl(mm)
Packaging
IRP,40K(A)
ISAT,10%(A)
ISAT,30%(A)
RDC(mΩ)
Material
Interface Type
Type
Variant
Gender
Pins
Mount
Working Voltage(V (AC))
Compliance
Size
L(µH)
IR(A)
RDC max.(mΩ)
fres(MHz)
Q(%)
P(W)
Samples
WCAP-CSGP MLCCs 50 V(DC), 33 pF, ±5%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance33 pF
Capacitance±5% 
Rated Voltage50 V (DC)
Operating Temperature -55 °C up to +125 °C
Insulation Resistance10 GΩ
Ceramic TypeNP0 Class I 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Size0402 
Q-Factor1000 %
WCAP-CSGP MLCCs 50 V(DC), 100 pF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 pF
Capacitance±10% 
Rated Voltage50 V (DC)
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Size0402 
WCAP-CSGP MLCCs 10 V(DC), 330 pF, ±5%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance330 pF
Capacitance±5% 
Rated Voltage10 V (DC)
Operating Temperature -55 °C up to +125 °C
Insulation Resistance10 GΩ
Ceramic TypeNP0 Class I 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Size0402 
Q-Factor1000 %
WCAP-CSGP MLCCs 10 V(DC), 2.2 nF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance2.2 nF
Capacitance±10% 
Rated Voltage10 V (DC)
Operating Temperature -55 °C up to +125 °C
Dissipation Factor5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Size0402 
WCAP-CSGP MLCCs 50 V(DC), 4.7 nF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance4.7 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Size0402 
WCAP-CSGP MLCCs 10 V(DC), 10 nF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance10 nF
Capacitance±10% 
Rated Voltage10 V (DC)
Operating Temperature -55 °C up to +125 °C
Dissipation Factor5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Size0402 
WCAP-CSGP MLCCs 6.3 V(DC), 1 µF, ±20%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 µF
Capacitance±20% 
Rated Voltage6.3 V (DC)
Operating Temperature -55 °C up to +85 °C
Dissipation Factor15 %
Insulation Resistance0.1 GΩ
Ceramic TypeX5R Class II 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Size0402 
WCAP-CSGP MLCCs 10 V(DC), 1 µF, ±20%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 µF
Capacitance±20% 
Rated Voltage10 V (DC)
Operating Temperature -55 °C up to +85 °C
Dissipation Factor15 %
Insulation Resistance0.05 GΩ
Ceramic TypeX5R Class II 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Size0402 
WCAP-CSGP MLCCs 6.3 V(DC), 10 µF, ±20%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance10 µF
Capacitance±20% 
Rated Voltage6.3 V (DC)
Operating Temperature -55 °C up to +85 °C
Dissipation Factor15 %
Insulation Resistance0.005 GΩ
Ceramic TypeX5R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.35 mm
Packaging7" Tape & Reel 
Size0603 
WCAP-CSGP MLCCs 25 V(DC), 10 µF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance10 µF
Capacitance±10% 
Rated Voltage25 V (DC)
Operating Temperature -55 °C up to +125 °C
Dissipation Factor10 %
Insulation Resistance0.01 GΩ
Ceramic TypeX7R Class II 
Length3.2 mm
Width1.6 mm
Height1.6 mm
Pad Dimension0.5 mm
Packaging7" Tape & Reel 
Size1206 
WE-HCI SMT Flat Wire High Current Inductor, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Operating Temperature -40 °C up to +150 °C
Length7 mm
Width6.9 mm
Height3.8 mm
Performance Rated Current7.8 A
Saturation Current @ 10%2.5 A
Saturation Current @ 30%7 A
DC Resistance19.5 mΩ
MaterialSuperflux 
Pins
MountSMT 
Size7040 
Inductance4.7 µH
DC Resistance21.45 mΩ
Self Resonant Frequency33 MHz
WE-WPCC Wireless Power Transfer Receiver Coil, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Operating Temperature -20 °C up to +105 °C
Length48 mm
Width32 mm
Height1 mm
Pins
MountTHT 
Complianceworks with Qi Rx IC's 
Size48 x 32 x 1 mm 
Inductance14.3 µH
Rated Current3 A
DC Resistance190 mΩ
Self Resonant Frequency8.8 MHz
Q-Factor40 %
Power Capability [1]50 W
WR-USB Mini/Micro Connectors, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Operating Temperature -40 °C up to +85 °C
Insulation Resistance1000 MΩ
PackagingTape and Reel 
Interface TypeType B 
TypeHorizontal 
Variantwith Pegs - High Current 
GenderReceptacle 
Pins
MountSMT 
Working Voltage30 V (AC)
Rated Current3 A