IC manufacturers Renesas

IC manufacturers (96)

Renesas R7FA6M5BH3CFB | Demoboard VK-RA6M5 Evaluation Board

00MHz Arm® Cortex®-M33 TrustZone®, Highest Integration with Ethernet and CAN FD

Overview

TopologyOther Topology
IC revision1.0

Description

The Renesas RA6M5 group uses the high-performance Arm® Cortex®-M33 core with TrustZone®. In concert with the Secure Crypto Engine it offers Secure Element functionality. The integrated Ethernet MAC with individual DMA ensures high data throughput. The RA6M5 is built on a highly efficient 40nm process and is supported by an open and flexible ecosystem concept—the Flexible Software Package (FSP), built on FreeRTOS—and is expandable to use other RTOSes and middleware. The RA6M5 is suitable for IoT applications requiring Ethernet, future proof security, large embedded RAM, and low active power consumption down to 107uA/MHz running the CoreMark® algorithm from Flash.

Features

  • 200MHz Arm® Cortex®-M33 with TrustZone®
  • Secure element functionality
  • 1MB - 2MB Flash memory and 448kB SRAM with Parity and 64kB SRAM with ECC
  • Dual-bank-Flash with background operation, and block swap functionality
  • 8kB Data Flash to store data as in EEPROM
  • Scalable from 100-pin to 176-pin packages
  • Ethernet controller with DMA
  • Capacitive touch sensing unit
  • USB 2.0 High-Speed and Full Speed
  • CAN FD (CAN 2.0B option)
  • QuadSPI and OctaSPI
  • SCI (UART, Simple SPI, Simple I2C)
  • SPI/ I2C multimaster interface
  • SDHI and MMC

Typical applications

  • Embedded Programmable Logic Controller (PLC) for Industrial Use, micro-ROS Solutions, ROS-Based Robot Body Controller
  • Cellular Cloud Connected System

More information

Products

Order Code Data­sheet Simu­lation Downloads Product seriesPCB/Cable/PanelModularityWire SectionλDom typ.
(nm)
Emitting ColorλPeak typ.
(nm)
IV typ.
(mcd)
VF typ.
(V)
Chip Technology50% typ.
(°)
fTol. fStability
(ppm)
Cload
(pF)
Pitch
(mm)
L
(mm)
Working Voltage
(V (AC))
Contact Resistance
(mΩ)
Tol. RCTol. CVR
(V (DC))
DF
(%)
RISOCeramic TypeW
(mm)
Fl
(mm)
Interface TypePCB Thickness
(mm)
IR
(A)
H
(mm)
Operation Force (Value)
(g)
Electrical Life
(Cycles)
Actuator ColorVaporphase processZ @ 100 MHz
(Ω)
Zmax
(Ω)
Test Condition ZmaxIR 2
(mA)
Z @ 1 GHz
(Ω)
TypeVDC
(V)
ILeak
(µA)
VClamp typ.
(V)
VESD Air
(kV)
CCh min.
(pF)
SizeApplicationVRMS
(V)
VBR min.
(V)
IPeak
(A)
Wmax
(J)
VClamp
(V)
Test Condition VClampData ratePoEPortsTabImproved CMRROperating TemperatureLEDPHY Chip ModeMountShield TabsPinsRowsGenderIR
(A)
Packaging Samples
691402910005BSPEC
6 files WR-TBL Series 4029 - 2.54 mm Screwless Horizontal Entry PCB No 20 to 26 (AWG) 0.518 to 0.129 (mm²) 2.54 15.24 150 Horizontal Screwless -40 °C up to +105 °C THT 5 6 Box
742863122SPEC
7 files WE-CBF HF SMT EMI Suppression Ferrite Bead (High Frequency) 1.6 0.8 0.3 0.8 220 350 640 MHz 1300 250 High Current 0603 -55 °C up to +125 °C SMT 0.6
82356120050SPEC
6 files WE-VE ESD Suppressor 1.610 MΩ 0.8 0.3 0.9 12 1 80 15 5 0603 SMT
82537040SPEC
6 files WE-VS SMT Varistor 0.96 0.48 0.25 0.5 5.5 0402 5 VDC 4 8 20 0.04 21 1.0 A @ 8/20 µs -40 °C up to +85 °C SMT
7499010211ASPEC
6 files WE-RJ45 LAN Transformer 21.25 16 13.5 Standard 100BASE-TX non-PoE 1x1 Down No 0 °C up to +70 °C green-yellow current & voltage THT No
68710614022SPEC
7 files WR-FPC 0.50 mm SMT ZIF Horizontal Top Contact 0.5 9.4 50 20 max.100 MΩ Black Horizontal -25 °C up to +85 °C SMT 6 0.5 Tape and Reel
61300611821SPEC
6 files WR-PHD 2.54 mm Socket Header 2.54 15.74 250 20 max.1000 MΩ Straight -40 °C up to +105 °C THT 6 Single Socket Header 3 Tray
61301011821SPEC
6 files WR-PHD 2.54 mm Socket Header 2.54 25.9 250 20 max.1000 MΩ Straight -40 °C up to +105 °C THT 10 Single Socket Header 3 Tray
62200821121SPEC
6 files WR-PHD 1.27 mm THT Dual Pin Header 1.27 5.08 100 20 max.500 MΩ 1 Straight -40 °C up to +105 °C THT 8 Dual Pin Header 1 Box
629105136821SPEC
6 files WR-COM Micro USB 2.0 SMT Type B Horizontal 5 Contacts 30 30 max.1000 MΩ Type B 1 Horizontal Micro USB 2.0 -40 °C up to +105 °C SMT 5 Receptacle 1 Tape and Reel
61300811821SPEC
6 files WR-PHD 2.54 mm Socket Header 2.54 20.82 250 20 max.1000 MΩ Straight -40 °C up to +105 °C THT 8 Single Socket Header 3 Tray
62000211121SPEC
6 files WR-PHD 2.00 mm THT Pin Header 2 4 200 20 max.1000 MΩ 2 Straight -40 °C up to +105 °C THT 2 Single Pin Header 2 Bag
62101021021SPEC
6 files WR-PHD 1.27 mm SMT Dual Pin Header, H=3.80 mm 1.27 6.35 100 20 max.500 MΩ 1 Straight -40 °C up to +105 °C SMT 10 Dual Pin Header 1 Tube
629105150921SPEC
6 files WR-COM Micro USB 2.0 Type AB Horizontal 30 30 max.1000 MΩ Type AB 1.2 Horizontal Micro USB 2.0 -40 °C up to +85 °C SMT 5 Receptacle 1.8 Tape and Reel
693071010811SPEC
6 files WR-CRD Micro SD Card Connector Push & Push 8 pins 100 100 max.1000 MΩ Push & Push Micro SD -25 °C up to +85 °C SMT 8 Socket 0.5 Tape and Reel & Mylar
434133025816SPEC
6 files WS-TASV J-Bend SMT Tact Switch 4.2x3.2 mm 16100 MΩ 0.05 2.5 160 100000 Black not specified -40 °C up to +85 °C 0.05 Tape and Reel
150060RS55040SPEC
25 files WL-SMCD SMT Mono-color Chip LED Diffused 624 Red 632 90 2 AlInGaP 140 1.6 0.8 0.4 0603 -40 °C up to +85 °C SMT Tape and Reel
150060GS55040SPEC
25 files WL-SMCD SMT Mono-color Chip LED Diffused 525 Green 520 430 3.2 InGaN 140 1.6 0.8 0.4 0603 -40 °C up to +85 °C SMT Tape and Reel
150060BS55040SPEC
6 files WL-SMCD SMT Mono-color Chip LED Diffused 470 Blue 465 80 3.2 InGaN 140 1.6 0.8 0.4 0603 -40 °C up to +85 °C SMT Tape and Reel
885012105020SPEC
9 files WCAP-CSGP MLCCs 6.3 V(DC) 110 µF ±20% 6.3 100.01 GΩ X5R Class II 0.5 0.25 0.5 0402 -55 °C up to +85 °C 7" Tape & Reel
885012205086SPEC
8 files WCAP-CSGP MLCCs 50 V(DC) 1100 nF ±10% 50 100.5 GΩ X7R Class II 0.5 0.25 0.5 0402 -55 °C up to +125 °C 7" Tape & Reel
830050789SPEC
5 files WE-XTAL Watch Crystals32.768 kHz ±20ppm 0 12.5 2 1.2 0.6 IQXC-25 -40 °C up to +85 °C
830069383
5 files WE-XTAL Quartz Crystal24 MHz ±20ppm 20 10 2.5 2 0.6 CFPX-218 -40 °C up to +85 °C SMT
830108338809SPEC
5 files WE-XTAL Quartz Crystal12 MHz ±20ppm 30 12 3.2 2.5 0.8 CFPX-180 -40 °C up to +105 °C
Samples
Order Code Data­sheet Simu­lation Downloads Product seriesPCB/Cable/PanelModularityWire SectionλDom typ.
(nm)
Emitting ColorλPeak typ.
(nm)
IV typ.
(mcd)
VF typ.
(V)
Chip Technology50% typ.
(°)
fTol. fStability
(ppm)
Cload
(pF)
Pitch
(mm)
L
(mm)
Working Voltage
(V (AC))
Contact Resistance
(mΩ)
Tol. RCTol. CVR
(V (DC))
DF
(%)
RISOCeramic TypeW
(mm)
Fl
(mm)
Interface TypePCB Thickness
(mm)
IR
(A)
H
(mm)
Operation Force (Value)
(g)
Electrical Life
(Cycles)
Actuator ColorVaporphase processZ @ 100 MHz
(Ω)
Zmax
(Ω)
Test Condition ZmaxIR 2
(mA)
Z @ 1 GHz
(Ω)
TypeVDC
(V)
ILeak
(µA)
VClamp typ.
(V)
VESD Air
(kV)
CCh min.
(pF)
SizeApplicationVRMS
(V)
VBR min.
(V)
IPeak
(A)
Wmax
(J)
VClamp
(V)
Test Condition VClampData ratePoEPortsTabImproved CMRROperating TemperatureLEDPHY Chip ModeMountShield TabsPinsRowsGenderIR
(A)
Packaging Samples