IC manufacturers Onsemi

IC manufacturers (103)

Onsemi NFAQ1060L36T | Demoboard SECO-1KW-MDK-GEVK EVBUM2775/D

1kW 600V Industrial Motor Development Kit (MDK) with Compact Intelligent Power Module (IPM) board and Universal Controller Board (UCB)

Overview

TopologyPower Factor Correction
IC revision2

Description

The SECO-1KW-MDK-GEVK is a complete reference design for three-phase motor drives, featuring the NFAQ1060L36T intelligent power module in a DIPS6 package, and part of the Motor Development Kit (MDK). Rated for 230 Vac input and delivering up to 850W. All the necessary system blocks for a motor drive are part of the solution: EMC filtering and rectification stage, interleaved two-channel PFC, auxiliary power supplies, three-phase inverter and measurement and protection. The graphical user interface ensures an easy startup for evaluation purposes running voltage/frequency control. As part of the MDK the Compact IPM power module motor drive is compatible with the powerful Universal Controller Board (UCB) enabling high-end control strategies and AI capabilities for industrial motor control.

Features

Motor Development Kit (MDK):

  • Compatible with the Universal Controller Board (UCB) FPGA/ARM
  • Fully compatible with Xilinx® development tools for Zynq®-7000
  • Downloadable V/f and FOC control use cases for the UCB 850W Intelligent Power Module (IPM) three-phase motor driver
  • VIN: 230 Vac,rms ± 15% (single-phase)
  • IOUT: Irms 10 ARMS per phase
  • Compatible with three-phase motors: PMSM, BLDC or ACIM
  • DIP/6 IPM NFAQ1060L36T, three-phase/10A with integrated gate drivers
  • Cross-conduction, overcurrent and thermal protection embedded in DIPS6 module
  • Plug-in connector interface for MCU cards (Arduino DUE footprint)
  • Voltage/frequency control strategy implemented
  • NCS2250SN2T3G: Push Pull Output Comparator implemented in ITRIP protection system
  • Use case pre-loaded and GUI available for a quick-start evaluation
  • Xilinx® development tools and environments are available for the MDK, such as Vitis and Vivado to program the FPGA

Typical applications

  • Industrial Automation
  • Industrial Motor Control
  • Industrial Fans
  • White Goods (Washing Machines)

Products

Order Code
Data­sheet
Simu­lation
Downloads
Status
Product series
C
Safety Class
dV/dt(V/µs)
DF @ 1 kHz(%)
RISO
Pitch(mm)
Packaging
Tol. C
Size
Operating Temperature
Q(%)
DF(%)
Ceramic Type
Fl(mm)
ISAT(A)
fres(MHz)
Ø ID(mm)
Ø OD(mm)
Endurance(h)
IRIPPLE(mA)
ILeak(µA)
Ø D(mm)
Z(mΩ)
RESR(Ω)
G(mm)
Working Voltage(V (AC))
IR(A)
L(mH)
RDC max.(mΩ)
VR(V (DC))
VT(V (AC))
Material
L(mm)
W(mm)
H(mm)
Mount
Pins
PCB/Cable/Panel
Modularity
Type
Wire Section
Samples
WCAP-CSGP MLCCs 50 V(DC), 100 pF, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 pF
Insulation Resistance10 GΩ
Packaging7" Tape & Reel 
Capacitance±5% 
Size0603 
Operating Temperature -55 °C up to +125 °C
Q-Factor1000 %
Ceramic TypeNP0 Class I 
Pad Dimension0.4 mm
Rated Voltage50 V (DC)
Length1.6 mm
Width0.8 mm
Height0.8 mm
WCAP-CSGP MLCCs 50 V(DC), 470 pF, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance470 pF
Insulation Resistance10 GΩ
Packaging7" Tape & Reel 
Capacitance±5% 
Size0603 
Operating Temperature -55 °C up to +125 °C
Q-Factor1000 %
Ceramic TypeNP0 Class I 
Pad Dimension0.4 mm
Rated Voltage50 V (DC)
Length1.6 mm
Width0.8 mm
Height0.8 mm
WCAP-CSGP MLCCs 25 V(DC), 1 nF, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 nF
Insulation Resistance10 GΩ
Packaging7" Tape & Reel 
Capacitance±5% 
Size0603 
Operating Temperature -55 °C up to +125 °C
Q-Factor1000 %
Ceramic TypeNP0 Class I 
Pad Dimension0.4 mm
Rated Voltage25 V (DC)
Length1.6 mm
Width0.8 mm
Height0.8 mm
WCAP-CSGP MLCCs 50 V(DC), 1 nF, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 nF
Insulation Resistance10 GΩ
Packaging7" Tape & Reel 
Capacitance±5% 
Size0603 
Operating Temperature -55 °C up to +125 °C
Q-Factor1000 %
Ceramic TypeNP0 Class I 
Pad Dimension0.4 mm
Rated Voltage50 V (DC)
Length1.6 mm
Width0.8 mm
Height0.8 mm
WCAP-CSGP MLCCs 50 V(DC), 1 nF, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 nF
Insulation Resistance10 GΩ
Packaging7" Tape & Reel 
Capacitance±10% 
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Ceramic TypeX7R Class II 
Pad Dimension0.4 mm
Rated Voltage50 V (DC)
Length1.6 mm
Width0.8 mm
Height0.8 mm
WCAP-CSGP MLCCs 25 V(DC), 10 nF, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance10 nF
Insulation Resistance10 GΩ
Packaging7" Tape & Reel 
Capacitance±10% 
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3.5 %
Ceramic TypeX7R Class II 
Pad Dimension0.4 mm
Rated Voltage25 V (DC)
Length1.6 mm
Width0.8 mm
Height0.8 mm
WCAP-CSGP MLCCs 50 V(DC), 10 nF, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance10 nF
Insulation Resistance10 GΩ
Packaging7" Tape & Reel 
Capacitance±10% 
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Ceramic TypeX7R Class II 
Pad Dimension0.4 mm
Rated Voltage50 V (DC)
Length1.6 mm
Width0.8 mm
Height0.8 mm
WCAP-CSGP MLCCs 50 V(DC), 15 nF, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance15 nF
Insulation Resistance10 GΩ
Packaging7" Tape & Reel 
Capacitance±10% 
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Ceramic TypeX7R Class II 
Pad Dimension0.4 mm
Rated Voltage50 V (DC)
Length1.6 mm
Width0.8 mm
Height0.8 mm
WCAP-CSGP MLCCs 50 V(DC), 47 nF, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance47 nF
Insulation Resistance10 GΩ
Packaging7" Tape & Reel 
Capacitance±10% 
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3 %
Ceramic TypeX7R Class II 
Pad Dimension0.4 mm
Rated Voltage50 V (DC)
Length1.6 mm
Width0.8 mm
Height0.8 mm
WCAP-FTXX Film Capacitors, 100 nF, X2
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Safety ClassX2 
Rate of Voltage Rise300 V/µs
Dissipation Factor0.1 %
Insulation Resistance30 GΩ
Pitch15 mm
PackagingCarton 
Capacitance±10% 
SizePitch 15 mm 
Operating Temperature -40 °C up to +105 °C
Pin length4 mm
Rated Voltage310 V (DC)
Length18 mm
Width6 mm
Height12 mm
MountBoxed THT 
WCAP-CSGP MLCCs 25 V(DC), 100 nF, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Insulation Resistance5 GΩ
Packaging7" Tape & Reel 
Capacitance±20% 
Size0402 
Operating Temperature -55 °C up to +85 °C
Dissipation Factor10 %
Ceramic TypeX5R Class II 
Pad Dimension0.25 mm
Rated Voltage25 V (DC)
Length1 mm
Width0.5 mm
Height0.5 mm
WCAP-CSGP MLCCs 16 V(DC), 100 nF, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Insulation Resistance5 GΩ
Packaging7" Tape & Reel 
Capacitance±10% 
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3.5 %
Ceramic TypeX7R Class II 
Pad Dimension0.4 mm
Rated Voltage16 V (DC)
Length1.6 mm
Width0.8 mm
Height0.8 mm
WCAP-CSGP MLCCs 25 V(DC), 100 nF, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Insulation Resistance5 GΩ
Packaging7" Tape & Reel 
Capacitance±10% 
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3.5 %
Ceramic TypeX7R Class II 
Pad Dimension0.4 mm
Rated Voltage25 V (DC)
Length1.6 mm
Width0.8 mm
Height0.8 mm
WCAP-CSGP MLCCs 50 V(DC), 100 nF, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Insulation Resistance5 GΩ
Packaging7" Tape & Reel 
Capacitance±10% 
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3 %
Ceramic TypeX7R Class II 
Pad Dimension0.4 mm
Rated Voltage50 V (DC)
Length1.6 mm
Width0.8 mm
Height0.8 mm
WCAP-CSGP MLCCs 25 V(DC), 100 nF, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Insulation Resistance5 GΩ
Packaging7" Tape & Reel 
Capacitance±10% 
Size0805 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3.5 %
Ceramic TypeX7R Class II 
Pad Dimension0.5 mm
Rated Voltage25 V (DC)
Length2 mm
Width1.25 mm
Height0.8 mm
WCAP-CSGP MLCCs 50 V(DC), 330 nF, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance330 nF
Insulation Resistance1.5 GΩ
Packaging7" Tape & Reel 
Capacitance±10% 
Size0805 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3 %
Ceramic TypeX7R Class II 
Pad Dimension0.5 mm
Rated Voltage50 V (DC)
Length2 mm
Width1.25 mm
Height1.25 mm
WCAP-FTXX Film Capacitors, 680 nF, X2
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance680 nF
Safety ClassX2 
Rate of Voltage Rise130 V/µs
Dissipation Factor0.1 %
Insulation Resistance14.71 GΩ
Pitch22.5 mm
PackagingCarton 
Capacitance±10% 
SizePitch 22.5 mm 
Operating Temperature -40 °C up to +105 °C
Pin length4 mm
Rated Voltage310 V (DC)
Length26 mm
Width7.5 mm
Height15 mm
MountBoxed THT 
WCAP-FTXX Film Capacitors, 1 µF, X2
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 µF
Safety ClassX2 
Rate of Voltage Rise170 V/µs
Dissipation Factor0.1 %
Insulation Resistance10 GΩ
Pitch22.5 mm
PackagingCarton 
Capacitance±10% 
SizePitch 22.5 mm 
Operating Temperature -40 °C up to +105 °C
Pin length4 mm
Rated Voltage310 V (DC)
Length26 mm
Width11 mm
Height20 mm
MountBoxed THT 
WCAP-CSGP MLCCs 10 V(DC), 2.2 µF, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance2.2 µF
Insulation Resistance0.05 GΩ
Packaging7" Tape & Reel 
Capacitance±10% 
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor10 %
Ceramic TypeX7R Class II 
Pad Dimension0.4 mm
Rated Voltage10 V (DC)
Length1.6 mm
Width0.8 mm
Height0.8 mm
WCAP-ASLI Aluminum Electrolytic Capacitors, 10 µF, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance10 µF
Insulation Resistance10 MΩ
Packaging15" Tape & Reel 
Capacitance±20% 
Size4.0 x 5.5 
Operating Temperature -55 °C up to +105 °C
Dissipation Factor14 %
Endurance 2000
Ripple Current90 mA
Leakage Current3.5 µA
Diameter4 mm
Impedance2000 mΩ
ESR1.8844 Ω
Rated Voltage35 V (DC)
Length5.5 mm
Width4.3 mm
MountV-Chip SMT 
WCAP-PSHP Aluminum Polymer Capacitors, 100 µF, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 µF
Pitch3.1 mm
Packaging15" Tape & Reel 
Capacitance±20% 
Size8.0 x 8.7 
Operating Temperature -55 °C up to +105 °C
Dissipation Factor12 %
Endurance 2000
Ripple Current3000 mA
Leakage Current700 µA
Diameter8 mm
ESR0.03 Ω
Rated Voltage35 V (DC)
Length8.7 mm
Width8.3 mm
MountV-Chip SMT 
WCAP-ATUL Aluminum Electrolytic Capacitors, 220 µF, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance220 µF
Pitch3.5 mm
PackagingAmmopack 
Capacitance±20% 
Dissipation Factor14 %
Endurance 7000
Ripple Current590 mA
Leakage Current55 µA
Diameter8 mm
Rated Voltage25 V (DC)
Length11.5 mm
WCAP-PSLC Aluminum Polymer Capacitors, 330 µF, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance330 µF
Packaging15" Tape & Reel 
Capacitance±20% 
Size10.0 x 12.4 
Operating Temperature -55 °C up to +105 °C
Dissipation Factor12 %
Endurance 2000
Ripple Current4400 mA
Leakage Current2310 µA
Diameter10 mm
ESR0.02 Ω
Rated Voltage35 V (DC)
Length12.4 mm
Width10.3 mm
MountV-Chip SMT 
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance470 µF
Pitch10 mm
PackagingTray 
Capacitance±20% 
Size35.0 x 50.0 
Operating Temperature -25 °C up to +105 °C
Dissipation Factor20 %
Endurance 3000
Ripple Current1850 mA
Leakage Current1379.67 µA
Diameter35 mm
ESR0.195 Ω
Rated Voltage450 V (DC)
Length52 mm
WE-CMB Common Mode Power Line Choke, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Size
Operating Temperature -40 °C up to +125 °C
Pin length5 mm
Rated Current6 A
Inductance2.2 mH
DC Resistance20 mΩ
Rated Voltage250 V (DC)
Insulation Test Voltage1500 V (AC)
MaterialMnZn 
Length27.5 mm
Width18.5 mm
Height33 mm
MountTHT 
Pins
WE-FI Leaded Toroidal Line Choke, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Operating Temperature -40 °C up to +105 °C
Pin length15 mm
Rated Current6.1 A
Inductance0.15 mH
DC Resistance45 mΩ
Length27.5 mm
Width13.6 mm
MountTHT 
WE-TIS Radial Leaded Wire Wound Inductor, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Size8075 
Operating Temperature -40 °C up to +125 °C
Saturation Current0.4 A
Self Resonant Frequency2.3 MHz
Rated Current0.6 A
Inductance0.47 mH
DC Resistance1300 mΩ
MaterialNiZn 
Length7.8 mm
Width7.8 mm
Height7.5 mm
MountTHT 
WE-TIS Radial Leaded Wire Wound Inductor, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Size8075 
Operating Temperature -40 °C up to +125 °C
Saturation Current0.25 A
Self Resonant Frequency1.7 MHz
Rated Current0.35 A
Inductance1 mH
DC Resistance2300 mΩ
MaterialNiZn 
Length7.8 mm
Width7.8 mm
Height7.5 mm
MountTHT 
WR-PHD Socket Header - Dual, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Insulation Resistance1000 MΩ
Pitch2.54 mm
PackagingTube 
Operating Temperature -40 °C up to +105 °C
Working Voltage250 V (AC)
Rated Current3 A
Length46.22 mm
MountSMT 
Pins36 
TypeStraight 
WR-TBL Series 313 - 5.08 mm Close Horizontal PCB Header, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Pitch5.08 mm
PackagingBox 
Operating Temperature -40 °C up to +105 °C
Working Voltage320 V (AC)
Rated Current15 A
Length11.56 mm
MountTHT 
Pins
PCB/Cable/PanelPCB 
ModularityNo 
TypeClosed Horizontal Plug entry 
WR-TBL Series 3137 - 5.00 mm Close Horizontal PCB Header, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Pitch5 mm
PackagingBox 
Operating Temperature -40 °C up to +105 °C
Working Voltage320 V (AC)
Rated Current20 A
Length17 mm
MountTHT 
Pins
PCB/Cable/PanelPCB 
ModularityNo 
TypeHorizontal 
WR-TBL Series 351 - 5.08 mm Vertical, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Pitch5.08 mm
PackagingBox 
Operating Temperature -40 °C up to +105 °C
Working Voltage320 V (AC)
Rated Current20 A
Length10.16 mm
MountCable 
Pins
PCB/Cable/PanelCable 
ModularityNo 
TypeVertical 
Wire Section 12 to 24 (AWG) 3.31 to 0.205 (mm²)
WR-TBL Series 351 - 5.08 mm Vertical, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Pitch5.08 mm
PackagingBox 
Operating Temperature -40 °C up to +105 °C
Working Voltage320 V (AC)
Rated Current20 A
Length15.24 mm
MountCable 
Pins
PCB/Cable/PanelCable 
ModularityNo 
TypeVertical 
Wire Section 12 to 24 (AWG) 3.31 to 0.205 (mm²)
WR-PHD Socket Header - Single, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Insulation Resistance1000 MΩ
Pitch2.54 mm
PackagingTube 
Operating Temperature -40 °C up to +125 °C
Working Voltage250 V (AC)
Rated Current3 A
Length20.82 mm
MountSMT 
Pins
TypeStraight Type 2 
750314724
Power Inductor, –, –
Simu­lation
Downloads
Status Activei| Production is active. Expected lifetime: >10 years.
Product series Power Inductor
WA-SBRRO Round Brass Spacers, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
PackagingBulk 
Operating Temperature -55 °C up to +150 °C
Inner Diameter3.2 mm
Outer Diameter6 mm
MaterialBrass 
Length3 mm