IC manufacturers NXP

IC manufacturers (103)

NXP S32G-VNP-RDB2

S32G VEHICLE NETWORK PROCESSING REFERENCE DESIGN BOARD 2

Overview

TopologyOther Topology
IC revisionD

Description

The S32G-VNP-RDB2 is a compact, highly optimized and integrated reference design board featuring the S32G vehicle network processor. With its high-performance computing capacity and rich input/output (I/O), this board can provide reference for a variety of automotive applications such as service-oriented gateways, vehicle central compute, domain controllers, safety processors and black boxes. Carmakers, suppliers and software ecosystem partners can directly use the RDB to help accelerate development for shorter time-to-market.

Features

  • Hardware key features:
  • 1 x NOR flash (64 MB)
  • 1 x eMMC (32 GB), 1x SD card slot
  • 1 x LPDDR4 (4 GB)
  • 6 x 100BASE-T1 Ethernet
  • 5 x 1000BASE-T Ethernet
  • 1 x 100BASE-TX Ethernet
  • 18 x FlexCAN
  • 5x LINFlexD – 1 x FlexRay
  • 1 x USB 2.0
  • 5 x ADC, 1x DSPI, 1x I2C
  • 1 x PCIe X1
  • 1 x M.2 M-key, 1x M.2 E-key
  • Supports functional safety features:
  • ASIL D S32G274A vehicle network processor
  • ASIL D VR5510 power management IC
  • ASIL B SJA1110A Ethernet switch
  • Fault management and reset logic circuits

Typical applications

  • Service-oriented gateways, vehicle central compute, domain controllers, safety processors and black boxes

Products

Order Code
Data­sheet
Simu­lation
Downloads
Status
Product series
Emitting Color
λPeak B typ.(nm)
λPeak G typ.(nm)
λPeak R typ.(nm)
λDom B typ.(nm)
λDom G typ.(nm)
λDom R typ.(nm)
IV B typ.(mcd)
IV G typ.(mcd)
IV R typ.(mcd)
VF B typ.(V)
VF G typ.(V)
VF R typ.(V)
Chip Technology
50% typ.(°)
f
Tol. f
Cload(pF)
C
Tol. C
VR(V (DC))
Size
Q(%)
RISO
Ceramic Type
W(mm)
H(mm)
Fl(mm)
Packaging
Interface Type
Type
Gender
Pins
PCB Thickness(mm)
IR(A)
Working Voltage(V (AC))
Poles
L(mm)
Vaporphase process
Data rate
PoE
Ports
Tab
Improved CMRR
Operating Temperature
LED
PHY Chip Mode
Mount
Shield Tabs
Samples
SPEC
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Width16 mm
Height13.5 mm
Length21.25 mm
Data rate100BASE-TX 
PoEnon-PoE 
Ports1x1 
Tab PositionDown 
Improved Common Mode RejectionNo 
Operating Temperature -40 °C up to +85 °C
LED (Left-Right)yellow-green 
PHY Chip Modecurrent & voltage 
MountTHT 
Shield TabsYes 
SPEC
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance6.8 pF
Capacitance±0.5pF 
Rated Voltage50 V (DC)
Size0402 
Q-Factor536 %
Insulation Resistance10 GΩ
Ceramic TypeNP0 Class I 
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Length1 mm
Operating Temperature -55 °C up to +125 °C
SPEC
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Insulation Resistance100 MΩ
PackagingTape and Reel 
Pins
Poles
Length2.44 mm
Vaporphase processYes 
Operating Temperature -40 °C up to +85 °C
SPEC
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Rated Voltage24 V (DC)
Insulation Resistance100 MΩ
PackagingTape and Reel 
Pins
Poles
Length3.71 mm
Vaporphase processYes 
Operating Temperature -40 °C up to +85 °C
SPEC
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Rated Voltage24 V (DC)
Insulation Resistance100 MΩ
PackagingTape and Reel 
Pins
Poles
Length11.33 mm
Vaporphase processYes 
Operating Temperature -40 °C up to +85 °C
SPEC
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Insulation Resistance1000 MΩ
PackagingBag 
TypeStraight 
GenderPin Header 
Pins
Rated Current3 A
Working Voltage250 V (AC)
Length7.62 mm
Operating Temperature -40 °C up to +105 °C
MountTHT 
SPEC
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Insulation Resistance1000 MΩ
PackagingTape and Reel 
Interface TypeType AB 
TypeHorizontal 
GenderReceptacle 
Pins
PCB Thickness1.2 mm
Rated Current1.8 A
Working Voltage30 V (AC)
Operating Temperature -40 °C up to +85 °C
MountSMT 
SPEC
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Emitting ColorRed & Green & Blue 
Peak Wavelength (Blue) [typ.]465 nm
Peak Wavelength (Green) [typ.]515 nm
Peak Wavelength (Red) [typ.]635 nm
Dominant Wavelength (Blue) [typ.]470 nm
Dominant Wavelength (Green) [typ.]520 nm
Dominant Wavelength (Red) [typ.]625 nm
Luminous Intensity (Blue) [typ.]400 mcd
Luminous Intensity (Green) [typ.]1700 mcd
Luminous Intensity (Red) [typ.]750 mcd
Forward Voltage (Blue) [typ.]3.2 V
Forward Voltage (Green) [typ.]3.2 V
Forward Voltage (Red) [typ.]2 V
Chip TechnologyAlInGaP + InGaN 
Viewing Angle Phi 0° [typ.]120 °
Size3528 
PackagingTape and Reel 
Operating Temperature -40 °C up to +85 °C
MountSMT 
SPEC
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Frequency32.768 kHz
Frequency±20ppm 
Load Capacitance7 pF
SizeCFPX-217 
Width1.5 mm
Height0.9 mm
Length3.2 mm
Operating Temperature -40 °C up to +85 °C
MountSMT