IC manufacturers NXP

IC manufacturers (103)

NXP IMX8QM | Demoboard MCIMX8QM-CPU

i.MX 8QuadMax Multisensory Enablement Kit (MEK)

Overview

TopologyOther Topology

Description

The NXP i.MX 8 Multisensory Enablement Kit (MEK) provides a platform for evaluation and development of the Arm® Cortex® A72 | A53 + Cortex-M4F based i.MX 8QuadMax and i.MX 8QuadPlus applications processors as well as the NXP PF8100 power management integrated circuit (PMIC) solution and sensors.The i.MX 8 processor family is built with a high-level integration to support graphics, video, image processing, audio and voice functions, while meeting efficient performance requirements. The MEK is complete with highly optimized drivers and software, the i.MX 8 enables broad-based applications for the embedded industrial and automotive markets.

Features

  • NXP 3-axis accelerometer & eCompass [not populated]
  • NXP Gyroscope
  • NXP Light Sensor
  • NXP Pressure Sensor
  • RGB LED
  • Power supply

Typical applications

  • Power supply
  • Light Sensor, RGB LED

More information

Products

Order Code
Data­sheet
Simu­lation
Downloads
Status
Product series
C
Tol. C
VR(V (DC))
Size
DF(%)
RISO
Ceramic Type
L(mm)
W(mm)
H(mm)
Fl(mm)
Packaging
L(µH)
VT(V (RMS))
IRP,40K(A)
ISAT,10%(A)
ISAT,30%(A)
RDC(mΩ)
fres(MHz)
Material
Qty.
Ti
Ø OD(mm)
Ø ID(mm)
Pins
Gender
Variant
Durability
Z @ 100 MHz(Ω)
Zmax(Ω)
Test Condition Zmax
IR 2(mA)
RDC max.(Ω)
Type
Data rate
PoE
Ports
Tab
Improved CMRR
Operating Temperature
LED
PHY Chip Mode
Mount
Shield Tabs
SamplesAvailability & Sample
SPECWCAP-CSGP MLCCs 16 V(DC), 100 nF, ±10%
Simu­lation
Availability
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Capacitance±10% 
Rated Voltage16 V (DC)
Size0402 
Dissipation Factor5 %
Insulation Resistance5 GΩ
Ceramic TypeX7R Class II 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Packaging Unit10000 
Operating Temperature -55 °C up to +125 °C
Check availability
SPECWE-CBF SMT EMI Suppression Ferrite Bead, –, –
Simu­lation
Availability
Status Activei| Production is active. Expected lifetime: >10 years.
Size0603 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.3 mm
Packaging Unit4000 
Impedance @ 100 MHz600 Ω
Maximum Impedance800 Ω
Maximum Impedance200 MHz 
Rated Current 21000 mA
DC Resistance0.2 Ω
TypeHigh Current 
Operating Temperature -55 °C up to +125 °C
MountSMT 
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SPECWE-HCI SMT Flat Wire High Current Inductor, –, –
Simu­lation
Availability
Status Activei| Production is active. Expected lifetime: >10 years.
Size1040 
Length10.5 mm
Width10.2 mm
Height4 mm
Inductance1 µH
Performance Rated Current23.1 A
Saturation Current @ 10%7.5 A
Saturation Current @ 30%20 A
DC Resistance3.3 mΩ
Self Resonant Frequency80 MHz
MaterialWE-PERM 
Packaging Unit800 
Pins
DC Resistance0.00363 Ω
Operating Temperature -40 °C up to +155 °C
MountSMT 
Check availability
SPECWE-RJ45 LAN Transformer, –, –
Simu­lation
Availability
Status Activei| Production is active. Expected lifetime: >10 years.
Length21.25 mm
Width16 mm
Height13.5 mm
Inductance350 µH
Insulation Test Voltage1500 V (RMS)
Packaging Unit29 
Data rate1000BASE-T 
PoEnon-PoE 
Ports1x1 
Tab PositionDown 
Improved Common Mode RejectionNo 
Operating Temperature -40 °C up to +85 °C
LED (Left-Right)green/yellow - green/yellow 
PHY Chip Modecurrent 
MountTHT 
Shield TabsYes 
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SPECWR-CRD SD Card Connectors, –, –
Simu­lation
Availability
Status Activei| Production is active. Expected lifetime: >10 years.
Insulation Resistance1000 MΩ
PackagingTape and Reel 
Pins11 
GenderReceptacle 
Variantwith Card Detection 
Durability10 000 Mating cycles 
TypePush & Pull 
Operating Temperature -25 °C up to +85 °C
MountSMT 
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SPECWA-SMSI SMT Steel Spacer with internal Thread M2.5, –, –
Simu­lation
Availability
Status Activei| Production is active. Expected lifetime: >10 years.
Length2.5 mm
PackagingTape and Reel 
MaterialSteel 
Packaging Unit950 
Inner ThreadM2.5 
Outer Diameter5.1 mm
Inner Diameter3.5 mm
Operating Temperature -55 °C up to +150 °C
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