IC manufacturers Microchip

IC manufacturers (103)

Microchip MCP164GX1000AB

MCP164GX1000AB Datasheet

Overview

TopologyBuck Converter
Input voltage2.7-5.5 V
Output 13.3 V / 1.5 A
Output 21 V / 1.5 A
Output 31.8 V / 1.5 A
Output 41.2 V / 1.5 A
IC revision1

Description

The MCP164GX1000 is a custom-designed Power Management Integrated Circuit (PMIC) specifically developedas a high-performance, small-footprint power companion for the Microchip 64-bit RISC-V® Quad-CoreMicroprocessor PIC64GX1000.Making use of the on-board embedded EEPROM for default power-up configuration, the device ispreprogrammed with the necessary configuration required by the PIC64GX1000. It is available in two memoryarchitecture options: DDR4 (MCP164GX1000AB) and LPDDR4 (MCP164GX1000AA).These options alleviate the production effort, simplifying the integration task of the PMIC into the design. TheMCP164GX1000 also offers flexibility, allowing users to reprogram the IC, in-field or in-circuit, with any desiredconfiguration using the integrated I2C bus, which supports clock rates up to 3.4 MHz. As a safety mechanism,the integrated EEPROM has protection against accidental write operations.The MCP164GX1000 supports commercial and industrial applications.The MCP164GX1000 integrates 13 power channels distributed as eight parallelable 1.5A Buck regulators, four300 mA LDOs, and one low-input/low-output voltage LDO Controller using an external MOSFET.The eight 1.5A Buck regulators can be operated either independently or in parallel to support higher currents,in groups of up to four. The paralleling technique relies on the matching of the power switches’ resistances anddoes not require the complication of an additional current-sharing loop. Part count and solution footprint arealso reduced since all paralleled channels share the same inductor, while the required magnetic volume is thesame as equivalent multi-phase architectures.

Features

  • Input Voltage: 2.7V to 5.5V
  • Eight 1.5A Buck DC-DC Channels
  • Four 300 mA High-Accuracy LDOs
  • One High-Accuracy, High-PSRR LDO Controller Using External N-Channel MOSFET (SERDES Lanes Supply)
  • ±0.8% Output Voltage Accuracy for Bucks (VDD), for VFB ≥ 1V
  • -1.5%/+1% Output Voltage Accuracy for the LDO Controller, for VFBLC ≥ 0.9V
  • ±1% Output Voltage Accuracy for LDOs, for VFBL ≥ 1.8V
  • Directly Parallelable Buck Channels Power Stages – Up to 4 – for a Combined Current Capability Up to 6A
  • Tight RDS(ON) Matching of Parallelable Channels for Good Current Sharing
  • Minimum Number of Inductors: Paralleled Buck Channels Share the Same Inductor
  • Programmable Output Voltage for all Buck and LDO Channels 0.6V to 3.8V – No External Feedback ResistorsRequired
  • 100% Duty Cycle Capability of Buck Channels
  • LDO Controller Output Voltage 0.6V to 1.6V/12.5 mV Steps
  • Reference Ground (REFGND) Can be Remotely Routed to the Load Ground (Pseudo Remote Sensing)
  • Low-Noise Forced-PWM and Light-load High-Efficiency Mode Available (Pin-Selectable or Bit Control)MCP164GX1000Data Sheet© 2025 Microchip Technology Inc. and its subsidiaries20007007A - 3
  • External Synchronization of Switching Frequency, with Accurate Switching-Events Time Positioning
  • Selectable Phase (0°, 90°, 180° or 270°) for Buck Channels
  • Global RESET (nRSTO_A) with Programmable Deassertion Delay
  • User-Defined RESET (nRSTO_P) with Programmable Deassertion Delay – Ideal for PolarFire FPGA DEVRST_NInterfacing
  • 3.4 MHz I2C Interface
  • In-Circuit Programmable: On-Board Embedded EEPROM for Default Power-Up Configuration Programming
  • EEPROM Write Password Protection
  • Dedicated VDD Supply Pin for EEPROM and Interface Allows Programming Without Powering Up theApplication
  • Reconfigurable During Run Time
  • Hiccup Mode Current Limit for Buck Channels (Can Be Disabled)
  • Programmable Thermal Early Warning and Thermal Shutdown Protection
  • nINTO Pin (Interrupt Flag) With Selectable Interrupt Masking for Each Channel
  • 64-Pin VQFN Package, 8 x 8 mm
  • –40°C to +105°C Junction Temperature Range

Typical applications

  • Processor PSU, LPDDR4 and DDR4 PSU

Products

Order Code
Data­sheet
Simu­lation
Downloads
Status
Product series
C
Tol. C
VR(V (DC))
Size
Operating Temperature
DF(%)
RISO
Ceramic Type
L(mm)
W(mm)
H(mm)
Fl(mm)
Packaging
L(µH)
IR(A)
ISAT1(A)
ISAT2(A)
RDC max.(mΩ)
fres(MHz)
IRP,40K(A)
ISAT,30%(A)
RDC typ.(mΩ)
VOP(V)
Mount
ISAT,10%(A)
Samples
WCAP-CSGP MLCCs 25 V(DC), 1 µF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 µF
Capacitance±10% 
Rated Voltage25 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor10 %
Insulation Resistance0.5 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 10 V(DC), 4.7 µF, ±20%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance4.7 µF
Capacitance±20% 
Rated Voltage10 V (DC)
Size0603 
Operating Temperature -55 °C up to +85 °C
Dissipation Factor10 %
Insulation Resistance0.02 GΩ
Ceramic TypeX5R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 10 V(DC), 22 µF, ±20%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance22 µF
Capacitance±20% 
Rated Voltage10 V (DC)
Size0805 
Operating Temperature -55 °C up to +85 °C
Dissipation Factor10 %
Insulation Resistance0.005 GΩ
Ceramic TypeX5R Class II 
Length2 mm
Width1.25 mm
Height1.25 mm
Pad Dimension0.5 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 6.3 V(DC), 47 µF, ±20%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance47 µF
Capacitance±20% 
Rated Voltage6.3 V (DC)
Size1210 
Operating Temperature -55 °C up to +85 °C
Dissipation Factor10 %
Insulation Resistance0.002 GΩ
Ceramic TypeX5R Class II 
Length3.2 mm
Width2.5 mm
Height2.5 mm
Pad Dimension0.75 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 6.3 V(DC), 100 µF, ±20%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 µF
Capacitance±20% 
Rated Voltage6.3 V (DC)
Size1206 
Operating Temperature -55 °C up to +85 °C
Dissipation Factor10 %
Insulation Resistance0.001 GΩ
Ceramic TypeX5R Class II 
Length3.2 mm
Width1.6 mm
Height1.6 mm
Pad Dimension0.5 mm
Packaging7" Tape & Reel 
WE-LHMI SMT Power Inductor, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Size4020 
Operating Temperature -40 °C up to +125 °C
Length4.45 mm
Width4.06 mm
Height1.8 mm
Inductance1 µH
DC Resistance27 mΩ
Self Resonant Frequency89 MHz
Performance Rated Current6.2 A
Saturation Current @ 30%12.5 A
DC Resistance22 mΩ
Operating Voltage120 V
MountSMT 
Saturation Current @ 10%6.5 A
WE-PMCI Power Molded Chip Inductor, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Size252012 
Operating Temperature -40 °C up to +125 °C
Length2.5 mm
Width2 mm
Height1.2 mm
Pad Dimension0.6 mm
Inductance1.5 µH
Rated Current3.2 A
Saturation Current 11.35 A
Saturation Current 23.05 A
DC Resistance77 mΩ
Self Resonant Frequency70 MHz
Performance Rated Current3.2 A
Saturation Current @ 30%3.05 A
DC Resistance71 mΩ
MountSMT 
Saturation Current @ 10%1.35 A
WE-MAPI SMT Power Inductor, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Size4020HT 
Operating Temperature -55 °C up to +150 °C
Length4 mm
Width4 mm
Height2 mm
Inductance0.68 µH
Rated Current8.1 A
DC Resistance9.2 mΩ
Self Resonant Frequency67 MHz
Performance Rated Current11.7 A
Saturation Current @ 30%11.7 A
DC Resistance8 mΩ
Operating Voltage80 V
MountSMT 
Saturation Current @ 10%5.45 A
WE-XHMI SMT Power Inductor, –, –
Simu­lation
Status Newi| Product is new in our portfolio and production is active. Expected lifetime: >10 years.
Size4020 
Operating Temperature -40 °C up to +125 °C
Length4.3 mm
Width4.3 mm
Height2 mm
Inductance0.47 µH
DC Resistance6.69 mΩ
Self Resonant Frequency95 MHz
Performance Rated Current14.5 A
Saturation Current @ 30%12.8 A
DC Resistance5.25 mΩ
MountSMT 
Saturation Current @ 10%5.6 A