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IC-Hersteller (103)

Microchip MCP164GX1000AB

MCP164GX1000AB Datasheet

Details

TopologieAbwärtswandler
Eingangsspannung2.7-5.5 V
Ausgang 13.3 V / 1.5 A
Ausgang 21 V / 1.5 A
Ausgang 31.2 V / 1.5 A
Ausgang 41.8 V / 1.5 A
IC-Revision1

Beschreibung

The MCP164GX1000 is a custom-designed Power Management Integrated Circuit (PMIC) specifically developedas a high-performance, small-footprint power companion for the Microchip 64-bit RISC-V® Quad-CoreMicroprocessor PIC64GX1000.Making use of the on-board embedded EEPROM for default power-up configuration, the device ispreprogrammed with the necessary configuration required by the PIC64GX1000. It is available in two memoryarchitecture options: DDR4 (MCP164GX1000AB) and LPDDR4 (MCP164GX1000AA).These options alleviate the production effort, simplifying the integration task of the PMIC into the design. TheMCP164GX1000 also offers flexibility, allowing users to reprogram the IC, in-field or in-circuit, with any desiredconfiguration using the integrated I2C bus, which supports clock rates up to 3.4 MHz. As a safety mechanism,the integrated EEPROM has protection against accidental write operations.The MCP164GX1000 supports commercial and industrial applications.The MCP164GX1000 integrates 13 power channels distributed as eight parallelable 1.5A Buck regulators, four300 mA LDOs, and one low-input/low-output voltage LDO Controller using an external MOSFET.The eight 1.5A Buck regulators can be operated either independently or in parallel to support higher currents,in groups of up to four. The paralleling technique relies on the matching of the power switches’ resistances anddoes not require the complication of an additional current-sharing loop. Part count and solution footprint arealso reduced since all paralleled channels share the same inductor, while the required magnetic volume is thesame as equivalent multi-phase architectures.

Eigenschaften

  • Input Voltage: 2.7V to 5.5V
  • Eight 1.5A Buck DC-DC Channels
  • Four 300 mA High-Accuracy LDOs
  • One High-Accuracy, High-PSRR LDO Controller Using External N-Channel MOSFET (SERDES Lanes Supply)
  • ±0.8% Output Voltage Accuracy for Bucks (VDD), for VFB ≥ 1V
  • -1.5%/+1% Output Voltage Accuracy for the LDO Controller, for VFBLC ≥ 0.9V
  • ±1% Output Voltage Accuracy for LDOs, for VFBL ≥ 1.8V
  • Directly Parallelable Buck Channels Power Stages – Up to 4 – for a Combined Current Capability Up to 6A
  • Tight RDS(ON) Matching of Parallelable Channels for Good Current Sharing
  • Minimum Number of Inductors: Paralleled Buck Channels Share the Same Inductor
  • Programmable Output Voltage for all Buck and LDO Channels 0.6V to 3.8V – No External Feedback ResistorsRequired
  • 100% Duty Cycle Capability of Buck Channels
  • LDO Controller Output Voltage 0.6V to 1.6V/12.5 mV Steps
  • Reference Ground (REFGND) Can be Remotely Routed to the Load Ground (Pseudo Remote Sensing)
  • Low-Noise Forced-PWM and Light-load High-Efficiency Mode Available (Pin-Selectable or Bit Control)MCP164GX1000Data Sheet© 2025 Microchip Technology Inc. and its subsidiaries20007007A - 3
  • External Synchronization of Switching Frequency, with Accurate Switching-Events Time Positioning
  • Selectable Phase (0°, 90°, 180° or 270°) for Buck Channels
  • Global RESET (nRSTO_A) with Programmable Deassertion Delay
  • User-Defined RESET (nRSTO_P) with Programmable Deassertion Delay – Ideal for PolarFire FPGA DEVRST_NInterfacing
  • 3.4 MHz I2C Interface
  • In-Circuit Programmable: On-Board Embedded EEPROM for Default Power-Up Configuration Programming
  • EEPROM Write Password Protection
  • Dedicated VDD Supply Pin for EEPROM and Interface Allows Programming Without Powering Up theApplication
  • Reconfigurable During Run Time
  • Hiccup Mode Current Limit for Buck Channels (Can Be Disabled)
  • Programmable Thermal Early Warning and Thermal Shutdown Protection
  • nINTO Pin (Interrupt Flag) With Selectable Interrupt Masking for Each Channel
  • 64-Pin VQFN Package, 8 x 8 mm
  • –40°C to +105°C Junction Temperature Range

Typische Anwendungen

  • Processor PSU, LPDDR4 and DDR4 PSU

Weiterführende Informationen

Artikeldaten

Artikel Nr. Daten­blatt Simu­lation Downloads Status ProduktserieCTol. CVR
(V (DC))
BauformBetriebstemperaturDF
(%)
RISOKeramiktypL
(mm)
W
(mm)
H
(mm)
Fl
(mm)
VerpackungL
(µH)
IR
(A)
ISAT1
(A)
ISAT2
(A)
RDC max.
(mΩ)
fres
(MHz)
IRP,40K
(A)
ISAT,30%
(A)
RDC typ.
(mΩ)
VOP
(V)
MontageartISAT,10%
(A)
Muster
885012206076SPEC
8 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WCAP-CSGP MLCCs 25 V(DC)1 µF ±10% 25 0603 -55 °C up to +125 °C 100.5 GΩ X7R Klasse II 1.6 0.8 0.8 0.4 7" Tape & Reel
885012106012SPEC
8 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WCAP-CSGP MLCCs 10 V(DC)4.7 µF ±20% 10 0603 -55 °C up to +85 °C 100.02 GΩ X5R Klasse II 1.6 0.8 0.8 0.4 7" Tape & Reel
885012107011SPEC
8 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WCAP-CSGP MLCCs 10 V(DC)22 µF ±20% 10 0805 -55 °C up to +85 °C 100.005 GΩ X5R Klasse II 2 1.25 1.25 0.5 7" Tape & Reel
885012109003SPEC
8 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WCAP-CSGP MLCCs 6.3 V(DC)47 µF ±20% 6.3 1210 -55 °C up to +85 °C 100.002 GΩ X5R Klasse II 3.2 2.5 2.5 0.75 7" Tape & Reel
885012108005SPEC
7 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WCAP-CSGP MLCCs 6.3 V(DC)100 µF ±20% 6.3 1206 -55 °C up to +85 °C 100.001 GΩ X5R Klasse II 3.2 1.6 1.6 0.5 7" Tape & Reel
74437324010SPEC

Anstehende PCN

Aufgrund einer anstehenden PCN wird in Kürze eine Änderung am Bauteil durchgeführt. Anbei finden Sie die entsprechende PCN. Bei weiteren Fragen wenden Sie sich bitte an Ihren Vertriebsmitarbeiter.

9 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WE-LHMI SMT Speicherdrossel 4020 -40 °C up to +125 °C 4.45 4.06 1.8 1 27 89 6.2 12.5 22 120 SMT 6.5
74479288215SPEC
10 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WE-PMCI Power Molded Chip Induktivität 252012 -40 °C up to +125 °C 2.5 2 1.2 0.6 1.5 3.2 1.35 3.05 77 70 3.2 3.05 71 SMT 1.35
744383560068HTSPEC
10 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WE-MAPI SMT-Speicherdrossel 4020HT -55 °C up to +150 °C 4 4 2 0.68 8.1 9.2 67 11.7 11.7 8 80 SMT 5.45
744393230047SPEC
9 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WE-XHMI SMT Speicherdrossel 4020 -40 °C up to +125 °C 4.3 4.3 2 0.47 6.69 95 14.5 12.8 5.25 SMT 5.6
Artikel Nr. Daten­blatt Simu­lation
885012206076SPEC
885012106012SPEC
885012107011SPEC
885012109003SPEC
885012108005SPEC
74437324010SPEC

Anstehende PCN

Aufgrund einer anstehenden PCN wird in Kürze eine Änderung am Bauteil durchgeführt. Anbei finden Sie die entsprechende PCN. Bei weiteren Fragen wenden Sie sich bitte an Ihren Vertriebsmitarbeiter.

74479288215SPEC
744383560068HTSPEC
744393230047SPEC
Muster
Artikel Nr. Daten­blatt Simu­lation Downloads Status ProduktserieCTol. CVR
(V (DC))
BauformBetriebstemperaturDF
(%)
RISOKeramiktypL
(mm)
W
(mm)
H
(mm)
Fl
(mm)
VerpackungL
(µH)
IR
(A)
ISAT1
(A)
ISAT2
(A)
RDC max.
(mΩ)
fres
(MHz)
IRP,40K
(A)
ISAT,30%
(A)
RDC typ.
(mΩ)
VOP
(V)
MontageartISAT,10%
(A)
Muster