IC manufacturers Intel

IC manufacturers (104)

Intel 5CGXFC5C6F27C7N

FPGA - Field Programmable Gate Array FPGA - Cyclone V GX 2908 LABs 336 IOs

Overview

TopologyBoost Converter
Switching frequency800 kHz
IC revision2012.12.28

Description

Altera Cyclone& 174; V 28 nm FPGAs provide the industry's lowest system cost and power, along with performance levels that make the device family ideal for differentiating your high-volume applications. You'll get up to 40 percent lower total power compared with the previous generation, efficient logic integration capabilities, integrated transceiver variants, and SoC FPGA variants with an ARM-based hard processor system (HPS). The family comes in six targeted variants: Cyclone V E FPGA with logic only Cyclone V GX FPGA with 3.125-Gbps transceivers Cyclone V GT FPGA with 5-Gbps transceivers Cyclone V SE SoC FPGA with ARM-based HPS and logic Cyclone V SX SoC FPGA with ARM-based HPS and 3.125-Gbps transceivers Cyclone V ST SoC FPGA with ARM-based HPS and 5-Gbps transceivers

Features

  • TSMC's 28-nm low-power (28LP) process technology
  • 1.1 V core voltage
  • Wirebond low-halogen packages
  • Multiple device densities with compatible package footprints for seamless migrationbetween different device densities
  • RoHS-compliant optionsEnhanced 8-input ALM with four registers
  • M10K—10-kilobits (Kb) memory blocks with soft error correction code (ECC)
  • Memory logic array block (MLAB)—640-bit distributed LUTRAM where you canuse up to 25% of the ALMs as MLAB memory
  • Native support for up to three signal processing precision levels(three 9 x 9, two 18 x 18, or one 27 x 27 multiplier) in the samevariable-precision DSP block
  • 64-bit accumulator and cascade
  • Embedded internal coefficient memory
  • Preadder/subtractor for improved efficiencyDDR3, DDR2, and LPDDR2 with 16 and 32 bit ECC supportPCI Express® (PCIe®) Gen2 and Gen1 (x1, x2, or x4) hard IP withmultifunction support, endpoint, and root port
  • Up to 550 MHz global clock network
  • Global, quadrant, and peripheral clock networks
  • Clock networks that are not used can be powered down to reduce dynamic power
  • Precision clock synthesis, clock delay compensation, and zero delay buffering (ZDB)
  • Integer mode and fractional mode
  • 875 megabits per second (Mbps) LVDS receiver and 840 Mbps LVDS transmitter
  • 400 MHz/800 Mbps external memory interface
  • On-chip termination (OCT)
  • 3.3 V support with up to 16 mA drive strength
  • 614 Mbps to 5.0 Gbps integrated transceiver speed
  • Transmit pre-emphasis and receiver equalization
  • Dynamic partial reconfiguration of individual channels
  • Single or dual-core ARM Cortex-A9 MPCore processor-up to 800 MHz maximumfrequency with support for symmetric and asymmetric multiprocessing
  • Interface peripherals—10/100/1000 Ethernet media access control (EMAC), USB 2.0On-The-GO (OTG) controller, quad serial peripheral interface (QSPI) flash controller,NANDflash controller, Secure Digital/MultiMediaCard (SD/MMC) controller, UART,controller area network (CAN), serial peripheral interface (SPI), I2C interface, andup to 85 HPS GPIO interfaces
  • System peripherals—general-purpose timers, watchdog timers, direct memory access(DMA) controller, FPGA configuration manager, and clock and reset managers
  • On-chip RAM and boot ROM
  • HPS–FPGA bridges—include the FPGA-to-HPS, HPS-to-FPGA, and lightweightHPS-to-FPGA bridges that allow the FPGA fabric to issue transactions to slaves inthe HPS, and vice versa
  • FPGA-to-HPS SDRAM controller subsystem—provides a configurable interface tothe multiport front end (MPFE) of the HPS SDRAM controller
  • ARM CoreSight™ JTAG debug access port, trace port, and on-chip trace storage
  • Tamper protection—comprehensive design protection to protect your valuable IPinvestments
  • Enhanced advanced encryption standard (AES) design security features
  • CvP
  • Partial and dynamic reconfiguration of the FPGA
  • Active serial (AS) x1 and x4, passive serial (PS), JTAG, and fast passive parallel (FPP)x8 and x16 configuration options

Products

Log in now to view availability and request availability forecasts. LOGIN
Order Code
Data­sheet
Simu­lation
Downloads
Status
Product series
L(µH)
IR(mA)
ISAT(A)
RDC(mΩ)
fres(MHz)
H(mm)
W(mm)
IR(A)
Mount
IRP,40K(A)
ISAT,10%(A)
ISAT,30%(A)
Material
Qty.
Z @ 100 MHz(Ω)
Zmax(Ω)
Test Condition Zmax
IR 2(mA)
RDC max.(mΩ)
Type
SamplesAvailability & Sample
Log in now to view availability and request availability forecasts. LOGIN
SPECWE-HCI SMT Flat Wire High Current Inductor, 1 µH, –
Simu­lation
Availability
Status Activei| Production is active. Expected lifetime: >10 years.
Inductance1 µH
DC Resistance4.6 mΩ
Self Resonant Frequency85 MHz
Height3.8 mm
Width6.9 mm
MountSMT 
Performance Rated Current16.8 A
Saturation Current @ 10%8 A
Saturation Current @ 30%19 A
MaterialSuperflux 
Packaging Unit1000 
DC Resistance4.6 mΩ
Check availability
SPECWE-TPC SMT Tiny Power Inductor, 4.7 µH, –
Simu­lation
Availability
Status Activei| Production is active. Expected lifetime: >10 years.
Inductance4.7 µH
Saturation Current1.95 A
Self Resonant Frequency40 MHz
Height2.8 mm
Width5.8 mm
Rated Current2.4 A
MountSMT 
Packaging Unit400 
DC Resistance38 mΩ
Check availability
SPECWE-PMI Power Multilayer Inductor, 10 µH, 600 mA
Simu­lation
Availability
Status Activei| Production is active. Expected lifetime: >10 years.
Inductance10 µH
Rated Current600 mA
Saturation Current0.125 A
DC Resistance300 mΩ
Self Resonant Frequency20 MHz
Height0.8 mm
Width2 mm
MountSMT 
Packaging Unit3000 
Rated Current 2850 mA
DC Resistance390 mΩ
TypeHigh Saturation Current 
Check availability
SPECWE-CBF SMT EMI Suppression Ferrite Bead, –, 2000 mA
Simu­lation
Availability
Status Activei| Production is active. Expected lifetime: >10 years.
Rated Current2000 mA
Height0.8 mm
Width0.8 mm
Rated Current2 A
MountSMT 
Packaging Unit4000 
Impedance @ 100 MHz30 Ω
Maximum Impedance40 Ω
Maximum Impedance1000 MHz 
Rated Current 23000 mA
DC Resistance40 mΩ
TypeHigh Current 
Check availability