IC manufacturers EPC

IC manufacturers (103)

EPC EPC23104 | Demoboard EPC91104

Overview

TopologyMotor Drive
Input voltage14-80 V
IC revision1.0

Description

The EPC91104 evaluation board is a 3-phase BLDC motor drive inverter board featuring the EPC23104 ePower Stage IC 11 mΩ maximum RDS(on), 100 V maximum device voltage. The EPC91104 can deliver up to 10 Apk (7 ARMS) steady-state output current and up to 20 Apk (14 ARMS) pulsed output current (tpulse= 300 ms at 5%, 10%, and 20% of the total period).The EPC91104 contains all the necessary critical functions circuits to support a complete motor drive inverter including regulated auxiliary power rails for housekeeping supplies, voltage, and temperature sense, accurate current sense, and protection functions.The EPC91104 mates with an assortment of compatible controllers, supported by various manufacturers leveraging existing resources for quick development purposes as a motor drive inverter.

Features

3-phase inverter based on EPC23104 ePower Stage IC with wide input DC voltage ranging from 14 V to 80 VDimensions: L x W = 75 mm x 72 mmLow distortion switching that keeps motor audio emission low and reduces torque rippledv/dt optimized for motor drives less than 10 V/nsCurrent sense, voltage sense, temperature monitoring circuitProtection features including: over-current and input supply under voltage lockoutShaft encoder/Hall sensors interface connector for motor drive application with two voltage levels selection option

Typical applications

  • BLDC Motor drives : drones
  • BLDC Motor drives : robotics
  • BLDC Motor drives : eMobility

Products

Order Code
Data­sheet
Simu­lation
Downloads
Status
Product series
Pins
PCB/Cable/Panel
Modularity
Wire Section
λDom typ.(nm)
Emitting Color
λPeak typ.(nm)
IV typ.(mcd)
VF typ.(V)
Chip Technology
50% typ.(°)
C
Tol. C
VR(V (DC))
Size
Operating Temperature
Q(%)
DF(%)
RISO
Ceramic Type
L(mm)
W(mm)
H(mm)
Fl(mm)
Packaging
L(µH)
IRP,40K(A)
ISAT(A)
fres(MHz)
Version
Ti
Ø OD(mm)
Ø ID(mm)
Qty.
Mount
IR(A)
Working Voltage(V (AC))
Z @ 100 MHz(Ω)
Zmax(Ω)
Test Condition Zmax
IR 2(mA)
RDC max.(Ω)
Type
Samples
WR-PHD Pin Header - Single, 2, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Pins
Operating Temperature -40 °C up to +105 °C
Insulation Resistance1000 MΩ
Length5.08 mm
PackagingBag 
MountTHT 
Rated Current3 A
Working Voltage250 V (AC)
TypeStraight 
WR-TBL Series 2164 - 7.62 mm Horizon. Entry w. Rising Cage Clamp, 2, Rising Cage Clamp
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Pins
PCB/Cable/PanelPCB 
ModularityYes 
Wire Section 12 to 30 (AWG) 3.31 to 0.05 (mm²)
Operating Temperature -30 °C up to +120 °C
Length15.24 mm
PackagingBox 
MountTHT 
Rated Current24 A
Working Voltage750 V (AC)
TypeHorizontal 
WE-CBF SMT EMI Suppression Ferrite Bead, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Size0603 
Operating Temperature -55 °C up to +125 °C
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.3 mm
VersionSMT 
Packaging Unit4000 
MountSMT 
Rated Current1 A
Impedance @ 100 MHz180 Ω
Maximum Impedance250 Ω
Maximum Impedance400 MHz 
Rated Current 21500 mA
DC Resistance0.09 Ω
TypeHigh Current 
WE-PD SMT Power Inductor, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Size6033 
Operating Temperature -40 °C up to +125 °C
Length5.9 mm
Width6.2 mm
Height3.3 mm
Inductance33 µH
Performance Rated Current1.05 A
Saturation Current0.9 A
Self Resonant Frequency17 MHz
VersionRobust 
Packaging Unit1000 
MountSMT 
DC Resistance0.4 Ω
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance10 pF
Capacitance±5% 
Rated Voltage50 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Q-Factor600 %
Insulation Resistance10 GΩ
Ceramic TypeNP0 Class I 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
Packaging Unit4000 
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 pF
Capacitance±5% 
Rated Voltage50 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Q-Factor1000 %
Insulation Resistance10 GΩ
Ceramic TypeNP0 Class I 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
Packaging Unit4000 
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 µF
Capacitance±10% 
Rated Voltage25 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor10 %
Insulation Resistance0.5 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
Packaging Unit4000 
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
Packaging Unit4000 
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance10 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
Packaging Unit4000 
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 µF
Capacitance±10% 
Rated Voltage25 V (DC)
Size0805 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor5 %
Insulation Resistance0.5 GΩ
Ceramic TypeX7R Class II 
Length2 mm
Width1.25 mm
Height1.25 mm
Pad Dimension0.5 mm
Packaging7" Tape & Reel 
Packaging Unit3000 
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance680 pF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0805 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length2 mm
Width1.25 mm
Height0.8 mm
Pad Dimension0.5 mm
Packaging7" Tape & Reel 
Packaging Unit4000 
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0805 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Insulation Resistance5 GΩ
Ceramic TypeX7R Class II 
Length2 mm
Width1.25 mm
Height0.8 mm
Pad Dimension0.5 mm
Packaging7" Tape & Reel 
Packaging Unit4000 
WA-SMSI SMT Steel Spacer with internal Thread M2, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Operating Temperature -55 °C up to +150 °C
Length1 mm
PackagingTape and Reel 
Inner ThreadM2 
Outer Diameter4.35 mm
Inner Diameter2.8 mm
Packaging Unit1500 
WCAP-CSGP MLCCs 100 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Capacitance±10% 
Rated Voltage100 V (DC)
Size0805 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Insulation Resistance1 GΩ
Ceramic TypeX7R Class II 
Length2 mm
Width1.25 mm
Height1.25 mm
Pad Dimension0.5 mm
Packaging7" Tape & Reel 
Packaging Unit3000 
WL-SMCW SMT Mono-color Chip LED Waterclear, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Dominant Wavelength [typ.]590 nm
Emitting ColorYellow 
Peak Wavelength [typ.]595 nm
Luminous Intensity [typ.]130 mcd
Forward Voltage [typ.]2 V
Chip TechnologyAlInGaP 
Viewing Angle Phi 0° [typ.]140 °
Size0603 
Operating Temperature -40 °C up to +85 °C
Length1.6 mm
Width0.8 mm
Height0.25 mm
MountSMT 
WL-SMCW SMT Mono-color Chip LED Waterclear, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Dominant Wavelength [typ.]570 nm
Emitting ColorBright Green 
Peak Wavelength [typ.]572 nm
Luminous Intensity [typ.]50 mcd
Forward Voltage [typ.]2 V
Chip TechnologyAlInGaP 
Viewing Angle Phi 0° [typ.]140 °
Size0603 
Operating Temperature -40 °C up to +85 °C
Length1.6 mm
Width0.8 mm
Height0.25 mm
MountSMT 
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 µF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor10 %
Insulation Resistance0.5 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.35 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 10 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance22 µF
Capacitance±20% 
Rated Voltage10 V (DC)
Size0603 
Operating Temperature -55 °C up to +85 °C
Dissipation Factor20 %
Insulation Resistance0.002 GΩ
Ceramic TypeX5R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance10 µF
Capacitance±10% 
Rated Voltage25 V (DC)
Size0805 
Operating Temperature -55 °C up to +85 °C
Dissipation Factor12.5 %
Insulation Resistance0.005 GΩ
Ceramic TypeX5R Class II 
Length2 mm
Width1.25 mm
Height1.25 mm
Pad Dimension0.5 mm
Packaging7" Tape & Reel