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Texas Instruments TDA2SX | Demoboard MMWCAS-DSP-EVM

TDA2x ADAS Applications Processor 23mm Package

Overview

TopologyOther Topology

Description

The MMWCAS-DSP evaluation module (EVM) design provides a processing foundation for a cascaded imaging radar system. Cascade radar devices can support front, long-range radar (LRR), beamforming applications, as well as corner- and side-cascade radar and sensor fusion systems. This EVM design provides qualified developers the design materials to create a functioning software evaluation platform for developing and testing advanced driver-assistance systems (ADAS).MMWCAS-DSP-EVM aids in shortening the development time of a base platform supporting multiple automotive radar front end and antenna subsystems.MMWCAS-DSP-EVM is supported by standard mmWave tools and software, including mmWave Studio (MMWAVE-STUDIO), as well as the processor SDK for TDAx ADAS SoCs (PROCESSOR-SDK-TDAX).For proper evaluation of MMWCAS-DSP-EVM, one other board is required - the mmWave cascaded imaging radar RF evaluation module (MMWCAS-RF-EVM) (sold separately).

Features

  • High-performance TDA2x device with four radar processing SIMD accelerators (one EVE per AWRx)
  • Ethernet and PCIe connectivity for control and data, respectively
  • Reference designs provided in Cascade Imaging Radar Capture Reference Design Using Jacinto™ ADAS Processor (TIDEP-01017) and Imaging Radar Using Cascaded mWave Sensor Reference Design (TIDEP-01012)

Typical applications

  • Mono, Stereo or Tri-Optic Front Camera, LVDS or ethernet surround view
  • Sensor fusion – vision, radar, ultrasonic, lidar sensors

Products

Order Code
Data­sheet
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λDom typ.(nm)
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λPeak typ.(nm)
IV typ.(mcd)
VF typ.(V)
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50% typ.(°)
C
Tol. C
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WL-SMCW SMT Mono-color Chip LED Waterclear, 525 nm, Green
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Dominant Wavelength [typ.]525 nm
Emitting ColorGreen 
Peak Wavelength [typ.]515 nm
Luminous Intensity [typ.]430 mcd
Forward Voltage [typ.]3.2 V
Chip TechnologyInGaN 
Viewing Angle Phi 0° [typ.]140 °
Size0603 
Operating Temperature -40 °C up to +85 °C
Length1.6 mm
Width0.8 mm
Height0.7 mm
PackagingTape and Reel 
Packaging Unit4000 
MountSMT 
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance220 pF
Capacitance±5% 
Rated Voltage50 V (DC)
Size0402 
Operating Temperature -55 °C up to +125 °C
Q-Factor1000 %
Insulation Resistance10 GΩ
Ceramic TypeNP0 Class I 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Packaging Unit10000 
WA-SMSI SMT Steel Spacer with internal Thread M2, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Operating Temperature -55 °C up to +150 °C
Length2.5 mm
PackagingTape and Reel 
Inner ThreadM2 
Outer Diameter4.35 mm
Inner Diameter2.8 mm
Packaging Unit950 
WR-USB Mini/Micro Connectors, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Operating Temperature -40 °C up to +105 °C
Insulation Resistance1000 MΩ
PackagingTape and Reel & Mylar 
Interface TypeType B 
TypeHorizontal 
Variantwith Pads & Pegs 
GenderReceptacle 
Pins
MountSMT 
Rated Current1 A
Working Voltage30 V (AC)